XC6SLX75-N3FG484C vs XC6SLX75-2FGG484I Comparison

Detailed side-by-side comparison of XC6SLX75-N3FG484C by AMD and XC6SLX75-2FGG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX75-N3FG484C XC6SLX75-2FGG484I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX field-programmable gate array (FPGA) —
Logic Elements 74,637 logic elements —
Logic Array Blocks 5,831 logic array blocks —
Total RAM 3,170,304 bits —
User I/O 280 I/O —
Speed Grade -3 -2 (mid-range)
Package 484-BBGA 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch
Terminal Count 484 terminals —
Package Type BGA —
Package Shape Square —
Terminal Form Ball —
Mounting Type Surface mount Surface Mount (BGA)
Programmable Logic 74,637 logic elements —
Block RAM 3,170,304 bits 4,824 Kbits (180 x 18 Kbit)
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
Supply Voltage Range [DATA_NEEDED: supply voltage range] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
RoHS Status [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
Device Family — Spartan-6 LX
Logic Cells — 74,637
Logic Elements / Slices — 11,650 slices
System Gates — 3,170,304
DSP Slices (DSP48A1) — 132
User I/Os — 280
Maximum Internal Frequency — 667 MHz
Process Technology — 45 nm CMOS
Core Supply Voltage (VCCINT) — 1.14 V to 1.26 V
Auxiliary Supply Voltage (VCCAUX) — 3.3 V
Operating Temperature (Industrial) — -40 °C to +100 °C (junction to +125 °C)
MSL Level — 3 (168 hours)

Datasheets & Resources

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