XC6SLX75-N3FG484C - 74,637 LE Spartan-6 LX FPGA | AMD
MPN: XC6SLX75-N3FG484C ✓ ActiveXC6SLX75-N3FG484C Overview
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and programmable I/O resources can be configured after fabrication. An FPGA sits within the broader programmable-logic hierarchy and can be described as a programmable logic device, digital integrated circuit, and semiconductor. Spartan-6 LX devices combine configurable logic blocks, block RAM, programmable input/output resources, and dedicated hardwired functions in one integrated circuit.
The XC6SLX75 family provides 74,637 logic elements, 5,831 logic array blocks or configurable logic blocks, and 3,170,304 total RAM bits. Its 280 I/O positions support connections to external memory, control interfaces, communications links, and mixed-signal system inputs and outputs. The 484-BBGA package is intended for compact, high-density professional printed-circuit-board designs requiring numerous ball-grid connections.
The -3 suffix selects the -3 performance grade, while the FG484 package code identifies the 484-ball configuration used by the target. Configuration and programming behavior, supported interfaces, electrical limits, and timing constraints must be established from the manufacturer datasheet and the Spartan-6 package pinout files. Designers should also validate the complete device configuration, system interface assignments, and PCB escape-routing capacity before release to fabrication.
Typical uses include industrial control, embedded instrumentation, communications equipment, video processing, networking infrastructure, and general-purpose programmable logic. The Spartan-6 LX architecture is useful when a design requires substantially more parallel logic and memory resources than a small microcontroller or fixed-function digital device can provide, while retaining reconfigurability for product updates.
PCB implementation should follow the AMD package pinout files, preserve the required power and ground distribution, and route every assigned ball according to the selected PCB stack-up. Because the package contains 484 balls, escape routing and via-in-pad or microvia strategy can materially affect routability, signal integrity, assembly yield, and thermal performance. Confirm BGA land pattern, solder-mask definition, and assembly process compatibility with the board manufacturer.
This product guide combines the target device's 74,637 logic elements, 280 I/O, 3,170,304 RAM bits, and 484-BBGA configuration with same-package speed-grade options and practical implementation guidance. It supports faster part selection while directing engineers to the authoritative datasheet, package files, and design guidance for final engineering sign-off.
Drop-in alternatives for XC6SLX75-N3FG484C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC6SLX75-N3FG484C (same form factor and footprint) — differing in Package Type, Mounting Type, Speed Grade, Device Type, Logic Cells.
XC6SLX75-3FGG484C
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →XC6SLX75-2FGG484I
✅ Drop-InContact for price
View Datasheet →XC6SLX75-2CSG484C
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →XC6SLX75-2CSG484I
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →XC6SLX75-3CSG484I
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →XC6SLX75-N3FG484C Maximum Ratings & Electrical Characteristics
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Elements | 74,637 logic elements |
| Logic Array Blocks | 5,831 logic array blocks |
| Total RAM | 3,170,304 bits |
| User I/O | 280 I/O |
| Speed Grade | -3 |
| Package | 484-BBGA |
| Terminal Count | 484 terminals |
| Package Type | BGA |
| Package Shape | Square |
| Terminal Form | Ball |
| Mounting Type | Surface mount |
| Programmable Logic | 74,637 logic elements |
| Block RAM | 3,170,304 bits |
XC6SLX75-N3FG484C square Pin Configuration Guide
Pin configuration for XC6SLX75-N3FG484C (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC6SLX75-N3FG484C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC6SLX75-N3FG484C is suitable for 6 applications: Industrial Automation Controllers, Communications and Network Equipment, Video and Image Processing, Embedded Instrumentation, Digital Storage and Interface Control, Aerospace and Defense Support Logic.
Industrial Automation Controllers
XC6SLX75-N3FG484C fits industrial automation controllers that coordinate sensors, actuators, interlocks, and machine-state logic in parallel. Its 74,637 logic elements and 5,831 logic array blocks provide substantial capacity for sequencing and datapath logic, while 3,170,304 RAM bits support buffers, counters, and protocol state. The 280 I/O can accommodate substantial board-level connectivity. In a controller, the FPGA can execute real-time control paths in parallel rather than relying solely on a microcontroller. Validate clocking, I/O standards, isolation requirements, and timing margins against the manufacturer documentation before production use.
Recommended
Communications and Network Equipment
XC6SLX75-N3FG484C is suitable for communications equipment requiring parallel packet processing, buffering, and protocol-interface logic. The device provides 74,637 logic elements and 3,170,304 RAM bits, allowing multiple datapaths and queues to operate concurrently, while its 280 I/O supports high-density board connections. In a line card or interface module, the FPGA can combine framing, error checking, and flow-control functions around external memories. Exact transceiver interfaces and I/O rates must be verified from the datasheet, with full timing analysis required for each implemented interface.
Recommended
Video and Image Processing
XC6SLX75-N3FG484C can support parallel video or image-processing pipelines that require multiple simultaneous data paths. Its 74,637 logic elements and 3,170,304 RAM bits provide capacity for pixel manipulation, line buffering, filtering, and control, while 280 I/O enables dense connection to memory and external interfaces. A typical design can divide incoming data into parallel lanes, process each lane concurrently, and use internal RAM as a line buffer. Video timing, pixel clocking, memory-interface bandwidth, and supported I/O standards must be checked in the manufacturer documentation before schematic approval.
Recommended
Embedded Instrumentation
XC6SLX75-N3FG484C fits embedded instrumentation requiring configurable acquisition, timing, and control logic with substantial parallel connectivity. The 280 I/O can connect measurement channels, control outputs, status signals, and external memory, while 3,170,304 RAM bits support captured-data buffering. In a measurement system, the FPGA can coordinate sampling clocks, digital filtering, threshold decisions, and data transfer while preserving a programmable architecture for product variations. Confirm input thresholds, output drive capabilities, clock-jitter requirements, and operating-temperature limits for each instrument class before production release.
Recommended
Digital Storage and Interface Control
XC6SLX75-N3FG484C is appropriate for digital storage controllers, test systems, and interface concentrators that require deterministic logic and onboard buffering. Its 74,637 logic elements support command handling, state machines, checksums, and data-format conversion, while 3,170,304 RAM bits can support FIFO and transient data buffering. The 484-BBGA package provides 280 user I/O for external memories, buses, and control logic. Because memory-mapped performance depends on pin placement and timing constraints, use the package files and design tool to complete placement and timing closure.
Recommended
Aerospace and Defense Support Logic
XC6SLX75-N3FG484C can serve as programmable logic in aerospace, defense, and high-reliability system architectures when its qualification, temperature, and screening requirements satisfy the program specification. The device offers 74,637 logic elements, 3,170,304 RAM bits, and 280 I/O for redundant control, data acquisition, monitoring, and communication functions. Qualification status and environmental limits must be established from the authoritative ordering documentation rather than inferred from the family name. Designers should also apply program-specific screening, fault-tolerance analysis, radiation requirements, and independent verification before deployment.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX75-N3FG484C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX75-3FGG484C | XC6SLX75-2FGG484I | XC6SLX75-2CSG484C | XC6SLX75-2CSG484I | XC6SLX75-3CSG484I |
|---|---|---|---|---|---|---|
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3 | -3 | -2 | -2 | -2 | -3 |
| Terminal Count | 484 terminals | 484 terminals | 484 terminals | 484 terminals | 484 terminals | 484 terminals |
Key Differentiators
- Retains the -3 performance designation (vs XC6SLX75-2FGG484I)
- Provides 74,637 logic elements and 3,170,304 RAM bits (vs XC6SLX100-2FG484C)
- Combines 280 I/O with a 484-terminal BGA (vs XC6SLX75-2FGG676I)
Design Notes
Use the AMD Spartan-6 package-device pinout file for the exact FG484 configuration to create the schematic symbol and PCB footprint. The 484-terminal BGA requires a board stack-up with sufficient escape-routing capability. Confirm ball-pitch dimensions, pad diameter, solder-mask opening, and assembly-process requirements against the package drawing before releasing fabrication data. Validate the footprint with the PCB manufacturer because land-pattern and mask-definition tolerances can affect yield.
Partition the supply network according to the manufacturer power and ground requirements, and provide low-impedance distribution for every power ball rather than relying on a single general-purpose plane connection. Follow the datasheet's recommended decoupling and bulk-capacitance arrangement near the device. Do not select capacitor values or power limits by inference from the package code; use the device-specific electrical specification and account for expected transient current at configuration and normal operation.
Route clock, configuration, and high-speed interfaces as controlled-impedance nets using the selected PCB stack-up. Place decoupling and configuration-support components close to their associated balls, and avoid switching-current paths beneath sensitive clock regions. For interfaces above the device's published signaling limits, add appropriate source termination, series damping, or external buffering. Complete post-route timing and signal-integrity simulation with actual connector, package, and board models.
Do not treat every similarly suffixed XC6SLX75 device as an automatic substitution. The -2 and -3 speed grades can change achievable timing, while FG, FGG, and CSG suffixes identify different package or qualification ordering conditions. Before a replacement is approved, compare the exact ordering table, pinout, temperature range, power characteristics, lifecycle status, and bitstream compatibility, then rerun synthesis, place-and-route, and timing analysis.
Estimate FPGA power from the actual design utilization, switching activity, clock rates, I/O loading, and configured voltage rather than using a single nominal device figure. Place thermal monitoring points near the FPGA and use the package thermal model from the manufacturer documentation. Validate the assembled board under worst-case environmental conditions because heat flow through a 484-BBGA depends strongly on the PCB stack-up, copper distribution, nearby components, enclosure, and airflow.
Compliance Information
The product listings identify the family and package but do not state the target device's RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 status is not established for this industrial FPGA and is therefore treated as not applicable.