XC6SLX75-N3FG484C vs XC6SLX75-3FGG484C Comparison

Detailed side-by-side comparison of XC6SLX75-N3FG484C by AMD and XC6SLX75-3FGG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX75-N3FG484C XC6SLX75-3FGG484C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX field-programmable gate array (FPGA) Field Programmable Gate Array (FPGA)
Logic Elements 74,637 logic elements —
Logic Array Blocks 5,831 logic array blocks —
Total RAM 3,170,304 bits —
User I/O 280 I/O —
Speed Grade -3 -3 (highest performance in Spartan-6 LX family)
Package 484-BBGA —
Terminal Count 484 terminals —
Package Type BGA 484-ball FBGA (MS-034)
Package Shape Square —
Terminal Form Ball —
Mounting Type Surface mount Surface Mount (SMD)
Programmable Logic 74,637 logic elements —
Block RAM 3,170,304 bits [DATA_NEEDED: block RAM capacity]
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
Supply Voltage Range [DATA_NEEDED: supply voltage range] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] 0 °C to 85 °C (commercial grade)
RoHS Status [DATA_NEEDED: RoHS status] unknown
REACH Status [DATA_NEEDED: REACH status] —
Series — Spartan-6 LX
Logic Cells — 74,637
User I/O Count — 280
Package Body Size — 23 x 23 mm
Package Pitch — 1.0 mm
Internal Clock Frequency — 667 MHz
Supply Voltage — [DATA_NEEDED: supply voltage range]
DSP Slices — [DATA_NEEDED: DSP48A slice count]
Configuration Memory — [DATA_NEEDED: configuration memory type]
I/O Standards — [DATA_NEEDED: supported I/O standards per bank]
Manufacturer — AMD (formerly Xilinx)
Order Code Suffix — C = commercial temperature grade

Datasheets & Resources

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