XC7A75T-1FGG484I vs XC7A35T-1FG484I Comparison

Detailed side-by-side comparison of XC7A75T-1FGG484I by AMD and XC7A35T-1FG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC7A75T-1FGG484I XC7A75T-1FGG484I - 75,520-Cell Artix-7 FPGA | AMD

XC7A75T-1FGG484I - 75,520-Cell Artix-7 FPGA | AMD

XC7A75T-1FGG484I ✓ Active

Specification Comparison

Parameter XC7A75T-1FGG484I XC7A35T-1FG484I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Artix-7 Field Programmable Gate Array (FPGA) —
Logic Cells 75,520 cells 33,280
I/O Count 285 I/O —
Maximum Performance Frequency 464 MHz —
Core Supply Voltage 950 mV to 1.05 V —
Package Type FCBGA-484 —
Ball Count 484 balls —
Clock Management Resources MMCM and PLL —
Series Artix-7 Artix-7 (XC7A35T)
Mounting Type Surface Mount Surface Mount
Programmable Logic Reconfigurable FPGA architecture —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Block RAM [DATA_NEEDED: block RAM capacity] 1,843,200 bits (180 x 36 Kb)
DSP Resources [DATA_NEEDED: DSP resource count] —
Pinout [DATA_NEEDED: complete 484-ball pinout] —
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Manufacturer — AMD / Xilinx
Logic Slices (6-input LUTs) — 5,200
DSP48 Slices — 90
User I/O Pins — 250
Transceivers (GTP) — 4 (up to 3.75 Gbps)
Speed Grade — -1
Temperature Grade — Industrial (-40C to +100C, suffix I)
Package — 484-ball Flip-Chip BGA, 1.0 mm pitch (FG484)
Process Node — 28 nm high-k metal-gate CMOS
Hard PCIe Gen2 Block — Yes (x1 Gen2 endpoint)
Configuration Memory — SPI / BPI / JTAG
Design Tools — Xilinx Vivado Design Suite, ISE (legacy)

Datasheets & Resources

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