XC7A35T-1FG484I - Artix-7 FPGA 33K LEs, 484-BGA | AMD/Xilinx
MPN: XC7A35T-1FG484I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $168.5 | $168.50 |
| 10 | $152.3 | $1,523.00 |
| 100 | $137.9 | $13,790.00 |
| 500 | $124.2 | $62,100.00 |
| 1,000 | $112.75 | $112,750.00 |
XC7A35T-1FG484I Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O can be configured by the designer after manufacture, distinguishing it from fixed-function ASICs and microcontrollers. Within AMD's programmable-logic hierarchy it sits in the Artix-7 family below Kintex-7 and Virtex-7, optimized for cost-sensitive, low-power, high-volume serial connectivity such as PCIe Gen2 and GTP transceivers. The Artix-7 family itself is one tier inside AMD's broader Adaptive Compute portfolio, which now includes Versal ACAPs.
Key headline parameters of the XC7A35T include 4 transceivers (GTP) capable of up to 3.75 Gbps, 90 DSP48 slices for high-throughput arithmetic, and 250 user I/O pins spread over 4 I/O banks supporting 1.2V to 3.3V single-ended standards plus LVDS pairs. Integrated hard IP includes a single PCIe Gen2 endpoint block and Configuration logic supporting 28 nm SelectIO primitives.
The FPGA is implemented on a 28nm high-k metal-gate CMOS process providing static power roughly 50% lower than the prior 45nm Spartan-6 family while delivering up to 1.5x higher performance per watt. The -1 speed grade targets cost-optimized designs; -2 and -3 grades offer higher Fmax at additional cost. The Flip-Chip BGA-484 (FG484 / FGG484) package uses 1.0mm ball pitch and shares a common footprint with the XC7A50T and XC7A75T in the same family, easing design migration.
Typical applications include low-cost PCIe endpoint boards, motor and motion control, video processing pipelines, industrial machine vision, software-defined radio front-ends, and portable medical imaging. Artix-7 transceivers and DSP slices make it well suited to any mid-density, low-power serial-link design.
When designing with this device, pair it with Xilinx Vivado Design Suite for synthesis, place-and-route and bitstream generation, and use an AMD Xilinx JTAG programmer such as the Platform Cable USB II for configuration. Confirm junction temperature stays below 100C for the industrial-grade variant and ensure the PCB footprint accommodates the 1.0 mm-pitch BGA.
This page synthesizes distributor pricing, drop-in alternatives within the same 484-FBGA footprint, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for XC7A35T-1FG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC7A35T-1FG484I (same form factor and footprint) — differing in Block RAM, Logic Cells, Package, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7A35T-2FGG484I
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$24.1 / Unit
View Datasheet →XC7A35T-1FGG484C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC7A50T-1FGG484I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC7A75T-1FGG484I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC7A35T-1FG484I Maximum Ratings & Electrical Characteristics
| Series | Artix-7 (XC7A35T) |
| Manufacturer | AMD / Xilinx |
| Logic Cells | 33,280 |
| Logic Slices (6-input LUTs) | 5,200 |
| Block RAM | 1,843,200 bits (180 x 36 Kb) |
| DSP48 Slices | 90 |
| User I/O Pins | 250 |
| Transceivers (GTP) | 4 (up to 3.75 Gbps) |
| Speed Grade | -1 |
| Temperature Grade | Industrial (-40C to +100C, suffix I) |
| Package | 484-ball Flip-Chip BGA, 1.0 mm pitch (FG484) |
| Process Node | 28 nm high-k metal-gate CMOS |
| Hard PCIe Gen2 Block | Yes (x1 Gen2 endpoint) |
| Mounting Type | Surface Mount |
| Configuration Memory | SPI / BPI / JTAG |
| Design Tools | Xilinx Vivado Design Suite, ISE (legacy) |
XC7A35T-1FG484I Pin Configuration
| Pin B12 | VCCINT — Internal core supply 1.0V typical (Artix-7 power pin, one of many) |
| Pin D5 | GND — Common ground (multiple GND balls across array) |
| Pin P19 | CCLK — Configuration clock for BPI/SPI modes |
| Pin T22 | DONE — Configuration DONE indicator, open-drain |
| Pin AB7 | PROG_B — Active-low full-chip configuration reset |
| Pin Y14 | TMS — JTAG test mode select |
| Pin AB9 | TDI — JTAG test data in |
| Pin W16 | TDO — JTAG test data out |
| Pin AA12 | TCK — JTAG test clock |
| Pin H21 | MGT_TX_P[0] — GTP transceiver 0 TX positive (differential pair, example ball) |
| Pin H22 | MGT_TX_N[0] — GTP transceiver 0 TX negative |
| Pin K21 | MGT_RX_P[0] — GTP transceiver 0 RX positive |
| Pin K22 | MGT_RX_N[0] — GTP transceiver 0 RX negative |
| Pin Multiple | IO_LXX_YY — Approximately 250 user I/O balls distributed in 4 SelectIO banks supporting 1.2V to 3.3V single-ended standards plus LVDS pairs; full ball-by-ball map is in AMD Artix-7 package pinout file UG475 |
Typical Applications
XC7A35T-1FG484I is suitable for 7 applications: Low-Cost PCIe Endpoint Card, Industrial Motor Control Loop, Video Processing / Image Pipeline, Portable Medical Imaging, Software-Defined Radio Front-End, Embedded Networking Switch / Router, Avionics / Defense Subsystem.
Low-Cost PCIe Endpoint Card
The XC7A35T-1FG484I integrates a single PCIe Gen2 hard IP block that lets engineers implement an x1 endpoint without consuming fabric logic, while the four GTP transceivers drive the PCIe SERDES pair plus two auxiliary 3.75 Gbps links. With 33,280 logic cells the device has headroom for DMA engines, MSI-X interrupt controllers, and low-level protocol glue. The 484-FBGA package supports up to 250 user I/O so the board can expose parallel GPIOs, I2C and SPI for host control. Typical board designs pair the FPGA with a PCIe edge connector, a 100 MHz external reference clock, and a small SPI flash for bitstream storage.
Recommended
Industrial Motor Control Loop
The XC7A35T-1FG484I suits multi-axis motor drives because its 90 DSP48 slices deliver the multiply-accumulate throughput needed for field-oriented control loops running at 20-50 kHz per axis. Industrial-grade temperature rating (-40C to +100C) handles under-hood electronics and the 250 user I/Os connect easily to PWM generators, encoder feedback QEP channels, and resolver excitation. The integrated block RAM (1.84 Mb) holds control-loop coefficients and reference frames, while the small -1 speed grade keeps cost low for high-volume motor drives sold to factory-automation OEMs.
Recommended
Video Processing / Image Pipeline
The XC7A35T fits mid-resolution image pipelines where DSP48 slices accelerate 3x3 convolution kernels, while 1.84 Mb block RAM buffers line-scan data at 1080p60. Its 4 GTP transceivers accept MIPI CSI-2 input via a bridge or directly from a parallel image sensor, and 250 I/Os accommodate HDMI/DVI output at the FPGA pins. The -I industrial temperature range allows deployment in outdoor machine-vision cameras. Designers typically pair the FPGA with DDR3/LPDDR2 memory using the built-in memory controller hard IP for frame buffering.
Recommended
Portable Medical Imaging
The Artix-7's low static power (roughly 50% lower than Spartan-6 at the same throughput) makes the XC7A35T well suited to battery-powered ultrasound and portable patient monitors. DSP48 slices provide the MACs for beamforming and FIR filtering in ultrasound front-ends, while block RAM accumulates scan-line data. Industrial temperature rating and 28nm process reliability satisfy IEC 60601 medical safety expectations when paired with appropriate analog front-end isolation. The 1.0 mm-pitch BGA fits inside palm-sized enclosures.
Recommended
Software-Defined Radio Front-End
The four GTP transceivers (3.75 Gbps each) of the XC7A35T digitize IF bands up to 1 GHz and feed DSP48 slices for digital down-conversion and channelization. The 484-ball FBGA exposes enough I/O for two dual-channel ADC interfaces plus synchronization ports. -I grade temperature supports outdoor SDR deployments and the modest -1 speed grade keeps per-unit cost low for volume radio deployments. Typical designs use the FPGA as the digital engine, with a separate RF front-end and a host ARM SoC running the network stack.
Recommended
Embedded Networking Switch / Router
The XC7A35T's 4 GTP transceivers deliver 4 SGMII/1000BASE-KX serial links enabling a small 4-port wire-speed switch or an enterprise edge router. The 33,280 logic cells hold L2 forwarding tables, ACL engines, and QoS schedulers, while block RAM stores MAC tables. Combined with the integrated PCIe Gen2 endpoint and 250 user I/Os for management and packet buffer memory, the FPGA forms the heart of a compact managed switch. Industrial temperature and 28nm process node reliability target 24/7 telecom and industrial networking gear.
Recommended
Avionics / Defense Subsystem
The XC7A35T-1FG484I brings 33,280 logic cells to MIL-STD-1553, ARINC 429, and RapidIO control subsystems, where radiation tolerance of the 28nm CMOS process is adequate for LEO orbits and high-altitude UAVs. The 4 GTP transceivers connect to chassis backplanes at 3.125 Gbps and the 250 I/Os handle legacy avionic buses. Designers augment the FPGA with an isolated DC-DC converter and a watchdog microcontroller. Note that for true rad-hard or rad-tolerant applications, AMD/Xilinx recommends the Kintex-7/XQR family; this part is typically used in non-critical avionics subsystems only.
Recommended
Recommended Products Summary
Engineering reference data for XC7A35T-1FG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7A35T-2FGG484I | XC7A35T-1FGG484C | XC7A50T-1FGG484I | XC7A75T-1FGG484I |
|---|---|---|---|---|---|
| Package | 484-ball Flip-Chip BGA, 1.0 mm pitch (FG484) | 484-ball FBGA 1.0 mm (FGG484) - identical footprint | 484-ball FBGA 1.0 mm (FGG484) - identical footprint | 484-ball FBGA 1.0 mm (FGG484) - identical footprint | 484-ball FBGA 1.0 mm (FGG484) - identical footprint |
| Brand | AMD (formerly Xilinx) | AMD | AMD | AMD | AMD |
| Logic Cells | 33,280 | 33,280 (same die) | 33,280 | 52,160 | 75,520 |
| Speed Grade | -1 | -2 (higher Fmax) | -1 | -1 | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Block RAM (Mb) | 1.84 | 1.84 | 1.84 | 2.70 | 3.78 |
| DSP48 Slices | 90 | 90 | 90 | 120 | 180 |
| User I/O | 250 | 250 | 250 | 250 | 250 |
| Approx. 1k-piece price (USD) | 112.75 | ~150 | ~95 | ~165 | ~270 |
Key Differentiators
- Only -1 speed-grade industrial variant with exact -1 / I / FG484 suffix (vs XC7A35T-2FGG484I)
- Higher logic density at the same FBGA footprint (vs XC7A50T-1FGG484I)
- Industrial temperature rating (-40C to +100C) (vs XC7A35T-1FGG484C)
Design Notes
The Artix-7 family operates the logic fabric at VCCINT = 1.0V, the I/O banks at VCCO (any of 1.2V / 1.5V / 1.8V / 2.5V / 3.3V per bank), and the GTP transceivers at MGTAVCC = 1.0V plus MGTAVTT = 1.2V. Decoupling must include at least one 100uF bulk cap near the package, multiple 4.7uF mid-frequency caps, and one 0.1uF / 0.01uF cap pair on every power pin. Sharing the MGTAVTT rail with VCCINT through a ferrite bead is acceptable but a separate LDO is preferred for clean SERDES jitter performance.
Use a 1.0 mm-pitch BGA land pattern matched to the FG484 / FGG484 mechanical drawing in UG475. Microvia-in-pad or filled-and-capped vias under the balls are recommended because signal via breakout density under the array is tight. The 484-ball FG484 / FGG484 package has die-up orientation with the heat-spreader exposed on top; a thermal management strategy (copper pour at minimum, heat-spreader-and-fan for >2W) should be planned even though Artix-7 static power is modest.
Estimated: typical Artix-7 quiescent power for the XC7A35T is 1.5-2.5W at 0% toggle, while full-utilization designs can reach 4-6W. Decoupling caps must be physically within 200 mil of the corresponding power pins - long traces force the FPGA into brown-out events at the GTP transceivers. Xilinx Vivado requires an explicit part-number pin declaration to be regenerated when migrating from -1 to -2 speed grade even when the package is unchanged.
Compliance Information
RoHS / REACH compliance per AMD/Xilinx product environmental declarations; AEC-Q100 not applicable - Artix-7 is not automotive qualified at the -I industrial range; consult AMD XA/XR family for rad-tolerant alternatives.
