XCKU3P-1FFVA676E vs XCKU3P-1FFVB676E Comparison

Detailed side-by-side comparison of XCKU3P-1FFVA676E by AMD and XCKU3P-1FFVB676E by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XCKU3P-1FFVA676E XCKU3P-1FFVB676E
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Kintex UltraScale+ FPGA (Field Programmable Gate Array) —
Logic Cells 355,950 (as published in distributor listings) 355,950
Number of Gates 31,641,600 (as published in distributor listings) —
User I/O Count 256 —
Maximum Clock Frequency 667 MHz —
Package 676-BBGA (FCBGA), 31 x 31 mm 676-ball FCBGA (FFVB676)
Total Ball Count 676 —
Device Series Kintex UltraScale+ (KU3P) —
Speed Grade -1 -1
Programming Technology SRAM-based, volatile configuration (FPGA) —
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature Grade [DATA_NEEDED: operating temperature grade for the -1 non-I suffix] —
Core Supply Voltage Range [DATA_NEEDED: core supply voltage range] —
Auxiliary Supply Voltage Range [DATA_NEEDED: auxiliary supply voltage range] —
DSP48E2 Arithmetic Slices [DATA_NEEDED: DSP48E2 slice count] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
Transceiver Count and Speed [DATA_NEEDED: GTY transceiver count and maximum data rate] —
Configuration Interface [DATA_NEEDED: configuration interface list (SPI, BQS, JTAG) —
RoHS Status [DATA_NEEDED: RoHS status] Compliant
MSL (Moisture Sensitivity Level) [DATA_NEEDED: MSL rating] —
Family — Kintex UltraScale+
Block RAM (bits) — 31,641,600
DSP Slices — 1,560
Temperature Grade — Extended (E)
User I/O Pins — 280
Package Body Size — 27 mm × 27 mm
Ball Pitch — 1.0 mm
GTH Transceivers — 24
Max Transceiver Data Rate — 16.375 Gbps
Memory Interface — DDR4-2400 with ECC support
Bitstream Encryption — AES-256 / RSA-2048
Junction Temperature (E grade) — -40 °C to +100 °C

Datasheets & Resources

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