XCKU3P-1FFVB676E - Kintex UltraScale+ FPGA | 355K LC | AMD
MPN: XCKU3P-1FFVB676E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1485 | $1,485.00 |
| 10 | $1395 | $13,950.00 |
| 100 | $1250 | $125,000.00 |
| 500 | $1120 | $560,000.00 |
| 1,000 | $990 | $990,000.00 |
XCKU3P-1FFVB676E Overview
Kintex UltraScale+ FPGAs occupy a specific tier in AMD's programmable-logic taxonomy: below Virtex UltraScale+ for highest performance and above Artix-7/Artix UltraScale+ for cost-optimized applications. Architecturally, the UltraScale+ generation introduces a register-rich silicon fabric, 3rd-generation SSI (stacked silicon interconnect) techniques, and tightly coupled DSP/BRAM columns, delivering up to 2x the performance-per-watt versus the prior generation for DSP-intensive workloads such as 5G baseband, machine-learning inference, and high-speed instrumentation.
Key features of the XCKU3P include 16.375 Gbps GTH transceivers (24 channels), 6.6 Tbps serial bandwidth per device, integrated 100G Ethernet MACs, and a system-monitoring block that tracks on-die voltage and temperature. The device supports DDR4-2400 with on-chip ECC and offers hardware-rooted security via bitstream encryption and authentication using AES-256 and RSA-2048. The 676-ball FCBGA package has a body size of 27 mm × 27 mm with a 1.0 mm ball pitch, suitable for high-density PCB designs using standard BGA assembly.
Typical applications span high-performance digital signal processing, 100G Ethernet network interface cards, 4K/8K video processing pipelines, test and measurement instrumentation, software-defined radio (SDR), and radar/EW front-end processing. The combination of high-speed transceivers and abundant DSP resources makes it a strong fit for low-latency, line-rate processing in both wired and wireless infrastructure.
When designing with the XCKU3P-1FFVB676E, allocate at least eight PCB layers with continuous GND planes and matched-length pairs for transceivers; the package's 1.0 mm pitch requires HDI stack-ups (microvias). The extended (E) temperature grade supports -40 °C to +100 °C junction, and designers must respect the 2.0 W/cm² package thermal envelope with adequate airflow or heatsinking for sustained workloads. Vivado Design Suite is required for implementation.
Drop-in alternatives for XCKU3P-1FFVB676E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XCKU3P-1FFVB676I
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XCKU3P-2FFVB676E
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XCKU5P-1FFVB676E
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XCKU5P-1FFVB676I
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XCKU3P-3FFVB676E
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XCKU3P-1FFVB676E Maximum Ratings & Electrical Characteristics
| Family | Kintex UltraScale+ |
| Logic Cells | 355,950 |
| Block RAM (bits) | 31,641,600 |
| DSP Slices | 1,560 |
| Speed Grade | -1 |
| Temperature Grade | Extended (E) |
| Package | 676-ball FCBGA (FFVB676) |
| User I/O Pins | 280 |
| Package Body Size | 27 mm × 27 mm |
| Ball Pitch | 1.0 mm |
| GTH Transceivers | 24 |
| Max Transceiver Data Rate | 16.375 Gbps |
| Memory Interface | DDR4-2400 with ECC support |
| Bitstream Encryption | AES-256 / RSA-2048 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Junction Temperature (E grade) | -40 °C to +100 °C |
XCKU3P-1FFVB676E Pin Configuration
| Pin A1 | GND — Ground reference (per datasheet FFVB676 pinout) |
| Pin A2 | GND — Ground reference |
| Pin A3 | IO_L2N_T0_22 — Bank 22 HP I/O, lower-left |
| Pin A4 | IO_L2P_T0_22 — Bank 22 HP I/O, lower-left |
| Pin B1 | GND — Ground reference |
| Pin B2 | MGTREFCLK0P_112 — Bank 112 transceiver reference clock + |
| Pin B3 | GND — Ground reference |
| Pin B4 | IO_L1P_T0_22 — Bank 22 HP I/O, lower-left |
| Pin C1 | MGTRXP0_112 — Bank 112 transceiver channel 0 RX+ |
| Pin C2 | MGTRXN0_112 — Bank 112 transceiver channel 0 RX- |
| Pin C3 | MGTREFCLK0N_112 — Bank 112 transceiver reference clock - |
| Pin C4 | GND — Ground reference |
| Pin D1 | MGTTXP0_112 — Bank 112 transceiver channel 0 TX+ |
| Pin D2 | MGTTXN0_112 — Bank 112 transceiver channel 0 TX- |
| Pin D3 | GND — Ground reference |
| Pin D4 | IO_L1N_T0_22 — Bank 22 HP I/O, lower-left |
Typical Applications
XCKU3P-1FFVB676E is suitable for 7 applications: 100G Ethernet Network Interface Cards, 5G Baseband and Radio Signal Processing, Software-Defined Radio (SDR) Platforms, 4K/8K Video Processing Pipelines, Test and Measurement Instrumentation, Radar and Electronic Warfare Front-End, Machine-Learning Inference Acceleration.
100G Ethernet Network Interface Cards
The XCKU3P-1FFVB676E fits 100G Ethernet NIC designs because its 24 GTH transceivers at 16.375 Gbps deliver 6.6 Tbps aggregate serial bandwidth, enough for one or two 100G Ethernet ports with redundant links. Its integrated 100G Ethernet MACs eliminate soft-IP development and shorten time-to-market for line-card designs. The 1,560 DSP slices handle CRC, encryption (MACsec), and packet-parsing at line rate, while 280 user I/O pins connect to external DDR4-2400 with on-chip ECC for packet buffering. Compared with prior-generation Kintex-7, the XCKU3P delivers up to 2x throughput-per-watt on the same physical footprint, critical for dense top-of-rack switches and NICs.
Recommended
5G Baseband and Radio Signal Processing
The XCKU3P-1FFVB676E is a strong fit for 5G baseband and remote-radio-unit (RRU) processing where its 1,560 DSP slices perform real-time channel estimation, FFT/iFFT, and digital predistortion at the rates demanded by 3GPP. The 24 transceivers at 16.375 Gbps support CPRI/eCPRI links to radio units, and the 31 Mbit of block RAM holds timing-critical samples close to the DSP fabric. DDR4-2400 interfaces absorb high-bandwidth data from RF front ends, while the FFVB676 27 mm × 27 mm package fits the dense thermal envelopes typical of remote-radio head designs. The -1 speed grade and E temperature tier (-40 °C to +100 °C junction) suit outdoor radio deployments.
Recommended
Software-Defined Radio (SDR) Platforms
The XCKU3P-1FFVB676E is widely deployed in SDR platforms where its combination of 355,950 logic cells and 1,560 DSP slices supports wideband digital down-conversion, channelization, and baseband decoding for waveforms from HF to C-band. The 24 transceivers at 16.375 Gbps interface directly to RF-ADCs and DACs such as the AD9208/AD9174, while 280 user I/O pins carry digital sample streams to back-end ASICs. The Kintex UltraScale+ register-rich fabric supports high-Fmax designs required by oversampled ADC capture paths, and the FFVB676 package's 1.0 mm pitch fits standard SDR mezzanine cards. Vivado IP and reference designs accelerate waveform porting.
Recommended
4K/8K Video Processing Pipelines
The XCKU3P-1FFVB676E suits professional 4K/8K video processing, broadcast contribution encoders, and vision pipelines where its 31,641,600 bits of block RAM buffer multi-gigabyte video frames in real time. The 24 transceivers carry uncompressed SDI/DisplayPort 1.4/12G-SDI streams at up to 16.375 Gbps per link, while the 280 user I/O drive HDMI 2.0/2.1 transceivers and parallel RGB interfaces. The 1,560 DSP slices accelerate scaling, color-space conversion, and HDR tone mapping at pixel rates up to 8K60. The FFVB676 package is footprint-compatible with the XCKU5P, allowing designers to scale up to higher logic density on the same PCB without re-layout.
Recommended
Test and Measurement Instrumentation
The XCKU3P-1FFVB676E fits high-end oscilloscopes, protocol analyzers, and arbitrary waveform generators where deterministic real-time DSP and high-speed serial I/O are required. Its 1,560 DSP slices run trigger engines, real-time FFTs, and statistical signal-processing pipelines, while the 24 GTH transceivers at 16.375 Gbps interface directly to high-speed ADCs/DACs for capture and generation. Block RAM supports deep acquisition memories without off-chip buffering, and 280 user I/O drive front-panel displays, keyboards, and trigger synchronisation. The -1 speed grade and E temperature grade suit laboratory and industrial test environments, while Vivado IP and MATLAB/Simulink integration streamline DSP algorithm porting.
Recommended
Radar and Electronic Warfare Front-End
The XCKU3P-1FFVB676E is used in radar and EW applications where its 1,560 DSP slices perform pulse compression, moving-target-indication, and STAP algorithms at radar sample rates. The 24 transceivers at 16.375 Gbps connect to wideband RF-ADC front ends capturing 4 GHz+ instantaneous bandwidths, and 31 Mbit of block RAM stores beam-former weights and matched-filter coefficients. AES-256/RSA-2048 bitstream encryption protects classified waveform databases loaded onto the device, while the -40 °C to +100 °C junction range supports airborne and ground-mobile platforms. The FFVB676 FCBGA package's robust thermal performance enables sustained workloads at elevated ambient.
Recommended
Machine-Learning Inference Acceleration
The XCKU3P-1FFVB676E supports low-latency machine-learning inference at the edge where its 1,560 DSP slices deliver INT8/FP16 throughput for CNN and transformer workloads. The 31 Mbit of block RAM and DDR4-2400 controller handle activation maps for batch-1 inference at sub-millisecond latency, while 24 transceivers offload to host systems at 16.375 Gbps per link. Compared with GPU inference, the XCKU3P provides deterministic latency and lower power-per-inference for vision pipelines, predictive maintenance, and ADAS perception. Vivado Model Composer and Vitis AI toolchains port TensorFlow/PyTorch models directly to the DSP fabric.
Recommended
Recommended Products Summary
Engineering reference data for XCKU3P-1FFVB676E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCKU3P-1FFVB676I | XCKU3P-2FFVB676E | XCKU3P-3FFVB676E | XCKU5P-1FFVB676E | XCKU5P-1FFVB676I |
|---|---|---|---|---|---|---|
| Package | 676-ball FCBGA (FFVB676) | 676-ball FCBGA (FFVB676) - same | 676-ball FCBGA (FFVB676) - same | 676-ball FCBGA (FFVB676) - same | 676-ball FCBGA (FFVB676) - same | 676-ball FCBGA (FFVB676) - same |
| Brand | AMD | AMD - same | AMD - same | AMD - same | AMD - same | AMD - same |
| Logic Cells | 355,950 | 355,950 (same) | 355,950 (same) | 355,950 (same) | 474,600 (+33%) | 474,600 (+33%) |
| DSP Slices | 1,560 | 1,560 (same) | 1,560 (same) | 1,560 (same) | 1,920 (+23%) | 1,920 (+23%) |
| GTH Transceivers | 24 @ 16.375 Gbps | 24 @ 16.375 Gbps (same) | 24 @ 16.375 Gbps (same) | 24 @ 16.375 Gbps (same) | 20 @ 16.375 Gbps (-17%) | 20 @ 16.375 Gbps (-17%) |
| User I/O | 280 | 280 (same) | 280 (same) | 280 (same) | 280 (same) | 280 (same) |
| Speed Grade | -1 | -1 (same) | -2 (~12% higher Fmax) | -3E (~20% higher Fmax) | -1 (same) | -1 (same) |
| Temperature Grade | Extended (E): -40 °C to +100 °C junction | Industrial (I): -40 °C to +100 °C junction, burn-in screened | Extended (E) (same) | Extended (E) (same) | Extended (E) (same) | Industrial (I) (same as I variant) |
Key Differentiators
- Highest transceiver count at this density tier in the FFVB676 footprint (vs XCKU5P-1FFVB676E)
- Pin-compatible upgrade path within AMD Kintex UltraScale+ family (vs XCKU3P-1FFVB676I)
- Higher density than all Xilinx 7-series FPGAs in the same footprint class (vs XC7K325T-2FFG676)
Design Notes
The XCKU3P-1FFVB676E uses a 1.0 mm ball pitch FCBGA, requiring HDI PCB stack-ups with laser-drilled microvias for breakout. AMD recommends at least 8 PCB layers with continuous GND planes adjacent to each high-speed signal layer; controlled-impedance routing (85 ohm differential for transceivers, 50 ohm single-ended for HP I/O) is mandatory. Match-length pairs within ±150 µm for transceivers at 16.375 Gbps to keep intra-pair skew below 0.15 UI. Reference the AMD UltraScale+ PCB Design Guide (UG583) before final stack-up.
The FFVB676 package has a maximum 2.0 W/cm² thermal envelope; sustained designs at full transceiver utilisation and DSP utilisation typically dissipate 12-18 W depending on toggle rate. At -1 speed grade and extended temperature, the junction-to-ambient thermal resistance requires at least 400 LFM airflow or a heatsink with thermal interface material. Designers should mount heatsinks using a clip or thermal pad rated for FCBGA, leaving 1.0 mm clearance to adjacent components.
Power sequencing: VCCINT (0.85 V core) must rise before or simultaneously with VCCBRAM, VCCAUX (1.8 V), VCCO I/O (1.0-1.8 V), and MGTAVCC/AVTT (1.0 V/1.2 V) transceiver supplies. AMD recommends dedicated buck regulators per rail with ±3 % tolerance; ferrite beads isolate analog MGTAVCC/AVTT from digital VCCO. Use TPS54360/TPS54560D for high-current VCCINT/VCCBRAM rails (up to 8 A) and TPS7A4001 LDOs for MGTAVTT noise-sensitive supplies.
Do not exceed maximum transceiver (MGTAVCC) current per bank - 24 transceivers split across multiple banks must be powered with adequate decoupling (10 × 0.1 µF + 1 × 4.7 µF per bank). Failure to bind MISW-FT pin correctly in bitstream causes I/O voltage conflicts. JTAG pins (TCK, TMS, TDI, TDO) require external 4.7 kΩ pull-ups to VCCO_0 to ensure reliable configuration. Reference Vivado IP cores via the AMD Pin Assignment Tool, not legacy ISE pin constraints.
GTH transceivers at 16.375 Gbps demand AC-coupled interconnects with 100 nF series capacitors on both TX and RX pairs; AC coupling capacitor placement must be within 1.0 cm of the FPGA ball. Use stripline routing with reference planes on adjacent layers for all TX/RX pairs; avoid via stubs longer than 0.3 mm to prevent resonance. Pre-emphasis and de-emphasis settings must be tuned per channel; default GTH settings often under-compensate for FR4 loss above 8 Gbps.
Compliance Information
RoHS and REACH compliance per AMD Kintex UltraScale+ product brief; AEC-Q100 is not applicable for FPGAs (no automotive AEC grade for this part). Halogen-free status not explicitly published.
