XCKU3P-1FFVB676I vs XCKU3P-1FFVB676E Comparison

Detailed side-by-side comparison of XCKU3P-1FFVB676I by AMD and XCKU3P-1FFVB676E by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XCKU3P-1FFVB676I XCKU3P-1FFVB676I - Kintex UltraScale+ FPGA | AMD

XCKU3P-1FFVB676I - Kintex UltraScale+ FPGA | AMD

XCKU3P-1FFVB676I ✓ Active

Specification Comparison

Parameter XCKU3P-1FFVB676I XCKU3P-1FFVB676E
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Kintex UltraScale+ FPGA —
Programmable Logic Blocks 162720 blocks —
Speed Grade -1 -1
Package 676-BBGA FCBGA 676-ball FCBGA (FFVB676)
Ball Count 676 balls —
Programmable Logic 31641600 gates —
Fabric Capacity Indicator 355950 units —
I/O Capability Indicator 280 units —
Logic Architecture [DATA_NEEDED: programmable logic architecture details] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
DSP Slice Count [DATA_NEEDED: DSP slice count] —
Maximum I/O Count [DATA_NEEDED: maximum user I/O count] —
High-Speed Serial Transceivers [DATA_NEEDED: transceiver count] —
Supply Voltage Range [DATA_NEEDED: operating supply voltage range] —
Operating Temperature Grade Industrial temperature suffix I —
Mounting Type Surface mount Surface Mount (BGA)
RoHS Status [DATA_NEEDED: RoHS compliance] Compliant
REACH Status [DATA_NEEDED: REACH compliance] —
AEC-Q100 Qualification Not applicable —
Family — Kintex UltraScale+
Logic Cells — 355,950
Block RAM (bits) — 31,641,600
DSP Slices — 1,560
Temperature Grade — Extended (E)
User I/O Pins — 280
Package Body Size — 27 mm × 27 mm
Ball Pitch — 1.0 mm
GTH Transceivers — 24
Max Transceiver Data Rate — 16.375 Gbps
Memory Interface — DDR4-2400 with ECC support
Bitstream Encryption — AES-256 / RSA-2048
Junction Temperature (E grade) — -40 °C to +100 °C

Datasheets & Resources

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