XCKU3P-2FFVA676E vs XCKU3P-1FFVB676E Comparison
Detailed side-by-side comparison of XCKU3P-2FFVA676E by AMD and XCKU3P-1FFVB676E by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XCKU3P-2FFVA676E | XCKU3P-1FFVB676E |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Kintex UltraScale+ FPGA | — |
| Logic Cells | 355,950 cells | 355,950 |
| Configurable Logic Blocks | 20,340 CLBs | — |
| Input/Output Connections | 304 I/O | — |
| Nominal Core Voltage | 0.85 V | — |
| Package | 676-BBGA FCBGA | 676-ball FCBGA (FFVB676) |
| Programmable Logic Type | FPGA | — |
| Device Family | Kintex UltraScale+ | — |
| Speed Grade | -2 | -1 |
| Temperature Grade | Extended | Extended (E) |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | — |
| High-Speed Transceivers | [DATA_NEEDED: transceiver count and data rate] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slices | [DATA_NEEDED: DSP slice count] | 1,560 |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Mounting Type | Surface mount | Surface Mount (BGA) |
| Family | — | Kintex UltraScale+ |
| Block RAM (bits) | — | 31,641,600 |
| User I/O Pins | — | 280 |
| Package Body Size | — | 27 mm × 27 mm |
| Ball Pitch | — | 1.0 mm |
| GTH Transceivers | — | 24 |
| Max Transceiver Data Rate | — | 16.375 Gbps |
| Memory Interface | — | DDR4-2400 with ECC support |
| Bitstream Encryption | — | AES-256 / RSA-2048 |
| Junction Temperature (E grade) | — | -40 °C to +100 °C |