XCKU3P-2FFVB676I vs XCKU3P-1FFVB676E Comparison
Detailed side-by-side comparison of XCKU3P-2FFVB676I by AMD and XCKU3P-1FFVB676E by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XCKU3P-2FFVB676I | XCKU3P-1FFVB676E |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Kintex UltraScale+ field-programmable gate array (FPGA) | — |
| Product Type | FPGA IC | — |
| Manufacturer | AMD | — |
| Series | Kintex UltraScale+ | — |
| Device Designation | KU3P | — |
| Speed Grade | -2 | -1 |
| Logic Cell Count | 162,720 cells | — |
| Input/Output Count | 280 I/O | — |
| Package Type | FCBGA-676 | — |
| Package Format | 676-BBGA, FCBGA | — |
| Programmability | Field-programmable digital logic | — |
| Temperature Grade | Industrial grade | Extended (E) |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Core Supply Voltage | [DATA_NEEDED: VCCINT operating voltage] | — |
| Auxiliary Supply Voltage | [DATA_NEEDED: VCC AUX supply voltage] | — |
| Configuration Interface | [DATA_NEEDED: configuration interface details] | — |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| Maximum I/O Performance | [DATA_NEEDED: maximum I/O data rate] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slices | [DATA_NEEDED: DSP slice count] | 1,560 |
| Package Dimensions | [DATA_NEEDED: package body dimensions] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Family | — | Kintex UltraScale+ |
| Logic Cells | — | 355,950 |
| Block RAM (bits) | — | 31,641,600 |
| Package | — | 676-ball FCBGA (FFVB676) |
| User I/O Pins | — | 280 |
| Package Body Size | — | 27 mm × 27 mm |
| Ball Pitch | — | 1.0 mm |
| GTH Transceivers | — | 24 |
| Max Transceiver Data Rate | — | 16.375 Gbps |
| Memory Interface | — | DDR4-2400 with ECC support |
| Bitstream Encryption | — | AES-256 / RSA-2048 |
| Mounting Type | — | Surface Mount (BGA) |
| Junction Temperature (E grade) | — | -40 °C to +100 °C |