XCKU5P-1FFVB676E vs XCKU3P-1FFVB676E Comparison
Detailed side-by-side comparison of XCKU5P-1FFVB676E by AMD and XCKU3P-1FFVB676E by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XCKU5P-1FFVB676E | XCKU3P-1FFVB676E |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Kintex UltraScale+ Field Programmable Gate Array | — |
| Logic Cells | 474,600 cells | 355,950 |
| User I/O | 280 I/O | — |
| Block RAM | 17,280 Kb | — |
| DSP Slices | 1,824 slices | 1,560 |
| Process Technology | FinFET | — |
| Speed Grade | -1 | -1 |
| Temperature Grade | Extended | Extended (E) |
| Junction Temperature Range | 0°C to 100°C | — |
| Package Type | 676-FCBGA | — |
| Package Dimensions | 27 x 27 mm | — |
| Package Pin Count | 676 balls | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Product Family | Kintex UltraScale+ | — |
| Programmable Logic | FPGA | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Packaging Type | [DATA_NEEDED: shipping package type] | — |
| Standard Packaging Quantity | [DATA_NEEDED: standard packaging quantity] | — |
| Family | — | Kintex UltraScale+ |
| Block RAM (bits) | — | 31,641,600 |
| Package | — | 676-ball FCBGA (FFVB676) |
| User I/O Pins | — | 280 |
| Package Body Size | — | 27 mm × 27 mm |
| Ball Pitch | — | 1.0 mm |
| GTH Transceivers | — | 24 |
| Max Transceiver Data Rate | — | 16.375 Gbps |
| Memory Interface | — | DDR4-2400 with ECC support |
| Bitstream Encryption | — | AES-256 / RSA-2048 |
| Junction Temperature (E grade) | — | -40 °C to +100 °C |