Produkte (35.000+)

USB5742/2G - 2-Port SS/HS USB 3.1 SmartHub Controller | Microchip
USB5742/2G

USB5742/2G - 2-Port SS/HS USB 3.1 SmartHub Controller | Microchip

The Microchip USB5742/2G is a 2-port, low-power SuperSpeed/Hi-Speed USB 3.1 Gen 1 SmartHub hub feature controller with 2 downstream ports, housed in a 56-pin VQFN (7x7 mm) package with exposed thermal pad. It supports USB 3.1 SuperSpeed (5 Gbps), USB 2.0 Hi-Speed (480 Mbps), Full-Speed (12 Mbps), and Low-Speed (1.5 Mbps) downstream traffic, and includes SPI/SMBus configuration interfaces for OEM-flexible firmware customization. A SmartHub is a USB hub controller IC with integrated bridge logic and configurable firmware that adds value features beyond the basic USB hub function defined by the USB-IF. As a category, SmartHub belongs to the USB Interface IC family (a subset of Interface ICs > Integrated Circuits), sitting between root hosts and downstream USB peripherals and providing functions such as port-power switching, per-port enable, programmable GPIO, and flexible upstream port mapping. The USB5742 specifically implements Microchip's fifth-generation USB 2.0 hub feature controller operating in parallel with a SuperSpeed transaction translator, decoupling 5 Gbps SuperSpeed signalling from legacy 480 Mbps traffic and removing the legacy FS/LS signalling bottleneck of older USB-IF transaction translator rules. Key features include full USB Battery Charging v1.2 support including CDP/DCP modes, integrated 5 V VBUS switch drivers with per-port overcurrent protection, USB Link Power Management (LPM) Addendum compliance for U1/U2/U3 low-power states, role-swapping for reversible Type-C wiring, and Microchip's proprietary Multi-Transaction Translator (Multi-TT) for full 480 Mbps bandwidth on all downstream ports simultaneously. The device operates from a single 3.3 V supply, integrates a 5 V to 3.3 V regulator for internal logic, and the -40C to +85C industrial temperature grade supports embedded OEM use. Typical applications include two-port docking stations, embedded USB expansion for industrial PCs, automotive rear-seat USB chargers, USB Type-A wall chargers with smart-charging, and head-unit infotainment connectivity modules. The SPI host interface allows an external MCU to enumerate attached devices, customize charging profiles, and read port events. When designing with the USB5742/2G, ensure the 56-VQFN exposed pad is properly soldered to a contiguous ground plane of at least 1 square inch to meet the 90 mA unconfigured VBUS-current budget. Bypass the 3.3 V rail with 10 uF + 100 nF ceramic capacitors placed within 5 mm of the supply pin, and follow USB-IF HS/SS routing rules (90-ohm differential impedance, intra-pair skew under 15 ps). This page synthesizes distributor pricing, drop-in equivalent SmartHub alternatives, and practical layout guidance not found in the standalone manufacturer datasheet.

Angebot Kontakt
USB5807C-I/KD - 7-Port USB 3.2 Gen 1 SmartHub IC | Microchip
USB5807C-I/KD

USB5807C-I/KD - 7-Port USB 3.2 Gen 1 SmartHub IC | Microchip

The Microchip USB5807C-I/KD is a 7-port, SuperSpeed USB 3.2 Gen 1 SmartHub IC delivering 5 Gbps downstream bandwidth, housed in a 100-pin VQFN EP (12x12 mm) package with industrial temperature grade (-40C to +85C). It supports USB Type-C with integrated USB-C MUX logic, I2C and SPI management interfaces, and Microchip's MultiTRAK, ProTouch, and PortSwap signal-integrity features. A SmartHub is a USB hub that integrates system-level functions typically performed by a separate MCU or processor. In a typical USB topology, a hub sits between the host (root port) and downstream devices, repeating the differential data and managing power and protocol states. The SmartHub class adds vendor configuration, role-swap (USB-C DRP), GPIOs, and optional firmware-driven behaviors that offload the system processor, which is critical in space-constrained embedded designs. The USB5807C family sits in Microchip's hub-controller hierarchy above the USB251x 2.0-only hubs and below larger 10-port parts like the USB5744. Key features include full USB 3.2 Gen 1 (formerly 3.1 Gen 1 / USB 3.0) 5 Gbps SuperSpeed plus USB 2.0 High-Speed/Full-Speed/Low-Speed backward compatibility on all 7 enabled downstream ports, integrated FlexConnect role-swap, per-port battery charging support (BC1.2), and unique 1.2V/3.3V dual-rail operation that simplifies internal rail generation. Per-port USB-C MUX integration eliminates external crossbar switches, reducing BOM cost and PCB area in USB-C docking designs. Architecturally, the device combines a SuperSpeed USB 3.2 Gen 1 physical layer (PHY), a USB 2.0 PHY, an embedded microcontroller for hub repeater logic, configuration ROM/OTP, and an I2C/SPI slave for host MCU management. The 100-VQFN exposed-pad package provides thermal dissipation suitable for industrial ambient operation without external heatsinking. Typical applications include USB-C docking stations, automotive head-unit USB hubs, thin-client monitors with embedded USB, USB-C monitors, embedded industrial PCs, and any USB-C multiport expansion where role-swap and charging are required. The 12x12 mm VQFN with 0.4 mm pitch is footprint-compatible with the USB5744 family for tier-up/down design reuse. When designing with this device, allocate a 4-layer PCB stack-up to maintain 90 ohm differential impedance for SuperSpeed lanes. Decouple both the 1.2V core and 3.3V I/O rails with 100 nF plus 4.7 uF ceramic capacitors placed within 2 mm of the supply pins. The exposed pad MUST be soldered to a continuous ground plane via a 5x5 thermal via array. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical PCB layout notes that are not consolidated in the manufacturer datasheet alone, giving engineers a single reference for design-in decisions.

Angebot Kontakt
USB5807CT/KD - 7-Port USB 3.2 Gen 1 SmartHub, VQFN-100 | Microchip
USB5807CT/KD

USB5807CT/KD - 7-Port USB 3.2 Gen 1 SmartHub, VQFN-100 | Microchip

The Microchip USB5807CT/KD is a 7-port, SuperSpeed (SS) USB 3.2 Gen 1 SmartHub controller IC delivered in a 100-pin VQFN (12 mm x 12 mm) package with exposed thermal pad. It is USB-IF compliant under TID1595 against the USB 3.2 Gen 1 specification, supports 5 Gbps Super-Speed plus 480 Mbps Hi-Speed, 12 Mbps Full-Speed, and 1.5 Mbps Low-Speed USB signaling, and exposes I2C/SPI host management interfaces for OEM configuration. Operating supply range is 1.08 V to 3.3 V with an operating temperature window of 0 C to +70 C for the commercial CT suffix variant. A USB hub controller is a specialized interface IC that aggregates one upstream USB port into multiple downstream ports while handling the protocol stack, port power management, and traffic scheduling. SmartHubs add OEM-configurable firmware layers (MultiTRAK, flexPORT, PortSplit) on top of the standard hub state machine, enabling per-port behavior tuning, custom charging profiles, and signal-integrity adjustments without external logic. Within the broader IC hierarchy, USB5807CT/KD belongs to Interface ICs > USB Hubs > USB 3.x Hub Controllers > Power-Managed SmartHub family. Key features include 7 downstream ports configurable as USB 3.2 Gen 1 or USB 2.0, native USB Type-C support via integrated MUX logic, MultiTRAK and PortSplit technology for per-port tuning, I2C and SPI host management interfaces, and Broadcom/Microchip-proprietary low-power states with optimized thermal dissipation. The VQFN-100 package provides a compact 12 mm x 12 mm footprint suitable for embedded designs and dock/monitor applications where board area is constrained. The device uses a low-power architecture with embedded USB 3.x PHYs and a configurable hub feature ROM accessed via SPI. PortSplit allows simultaneous USB 3.x and USB 2.0 operation on the same downstream port, enabling embedded USB 3.x peripherals alongside legacy USB 2.0 devices without external muxes. Driver compatibility covers Microsoft Windows 10/8/7/XP, Apple OS X 10.4+, and mainstream Linux hub drivers, removing the need for custom host stacks. Typical applications include USB-C docking stations, multi-port USB hubs, monitors with integrated USB expansion, embedded industrial USB fan-out, and Type-C breakout boards. Choose USB5807CT/KD when a 7-port SS hub with OEM-tunable power/charging profiles is required in a thermally-constrained enclosure. When designing with this part, ensure adequate copper area under the exposed pad and route SuperSpeed pairs with 90 ohm differential impedance. The host MCU must configure PortSplit, flexPORT, and charging parameters via I2C/SPI before downstream ports enumerate at full capability. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement (but do not replace) the manufacturer datasheet DS00002237D and Microchip configuration tools.

Angebot Kontakt
USB7056-I/KDX - 6-Port USB 3.2 Gen1 PD SmartHub | Microchip
USB7056-I/KDX

USB7056-I/KDX - 6-Port USB 3.2 Gen1 PD SmartHub | Microchip

The Microchip USB7056-I/KDX is a low-power, OEM-configurable 6-port USB 3.2 Gen 1 PD SmartHub controller in a 100-pin VQFN (12x12 mm) package with industrial temperature rating. It integrates a SuperSpeed USB 3.2 Gen 1 hub with native USB Type-C support, a legacy USB 2.0 hub for HS/FS/LS operation, and an on-board USB Power Delivery (PD) controller, providing 6 downstream ports with one Type-C upstream and five Type-A downstream configuration in the KDX pinout. A USB hub controller (USB 3.0/3.2 Gen 1 hub) is a semiconductor device that expands a single upstream USB port into multiple downstream ports, while managing enumeration, power, and protocol translation. The USB hub sits within the broader USB connectivity IC hierarchy: USB hub controller -> USB interface IC -> connectivity semiconductor -> IC. SmartHub variants add on-board PD negotiation and Type-C cable-orientation logic, eliminating the need for an external PD controller in Type-C sink/source designs. Key features include USB 3.2 Gen 1 (5 Gbps) SuperSpeed with native Type-C support, integrated USB PD 3.0 controller, broad host interfaces (GPIO, I2C, I2S, SPI, UART) for peripheral control, flexible GPIOs for status and indicators, integrated 5V LDO regulators for downstream VBUS, and support for battery charging (BC1.2) on each downstream port. The KDX suffix denotes the specific 100-VQFN lane mapping optimized for Type-C + 5x Type-A embedded designs. Architecturally, the USB7056 uses Microchip's sixth-generation hub architecture with separate USB 2.0 and USB 3.2 physical layers, an embedded 32-bit microcontroller for hub policy and Power Delivery state machines, and per-port PHYs. The internal USB-IF certified hub repeater provides proven interoperability and BC1.2 CDP/SDP/DCP charging modes are configurable per port. Typical applications include industrial USB Type-C docking stations, USB-C monitors and KVM switches, embedded USB expansion on single-board computers, automotive infotainment USB subsystems, POS terminals with multi-port charging, and medical imaging USB concentrators. Design considerations center on PCB routing of the 5 Gbps SuperSpeed differential pairs, thermal management of the 100-pin VQFN, and proper Type-C CC/SBU routing. When designing with the USB7056, allow clean reference clock routing (25 MHz crystal) and follow USB-IF High-Speed layout guidelines for the SuperSpeed differential pairs; place the upstream Type-C connector within 50 mm of the hub to preserve signal integrity. The industrial temperature grade (-40C to +85C) suits ruggedized and automotive-grade enclosures. This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design guidance not aggregated on the manufacturer datasheet.

Angebot Kontakt
USB7206C-I/KDX - 6-Port USB 3.2 Gen 2 SmartHub Controller | Microchip
USB7206C-I/KDX

USB7206C-I/KDX - 6-Port USB 3.2 Gen 2 SmartHub Controller | Microchip

The Microchip USB7206C-I/KDX is a low-power, OEM-configurable USB 3.2 Gen 2 hub controller with 6 downstream ports (5x USB 3.1 + 1x USB 2.0), housed in a 100-pin VQFN (12x12 mm) industrial-temperature package. It is fully compliant with the Universal Serial Bus Revision 3.2 Specification and the USB 2.0 Link Power Management Addendum, with an integrated USB 2.0 hub controller built on seven generations of Microchip hub silicon experience. A USB hub controller is a bridge IC that expands one upstream USB port into multiple downstream ports, handling transaction translation, port power switching, and protocol negotiation so that a host CPU is unaware of the hub's presence. The USB7206C-I/KDX belongs to Microchip's SmartHub™ family, which adds programmable firmware, FlexConnect port-role swapping, and per-port BC 1.2 charging support beyond the baseline hub silicon. In the broader taxonomy it is a USB interface controller (USB 3.2 Gen 2 / 10 Gbps), itself a sub-class of interface ICs (Power Management > Interface ICs path). Key features include USB 3.2 Gen 2 (10 Gbps) signaling on five ports, USB 2.0 high/full/low-speed on the sixth port, integrated 1.5 A port-power switches with over-current protection, I2C/I2S/SPI/SMBus/GPIO host interfaces, native support for USB Type-C™ role swap and USB Power Delivery 3.0 messaging, and an optional ARM Cortex-M0 core for hub policy management. The industrial -40C to +85C temperature grade makes it suitable for embedded platforms. Typical applications include industrial PCs, docking stations, automotive infotainment hubs, medical imaging carts, ruggedized laptops, USB-C multiport adapters, and embedded test/measurement backplanes that need reliable downstream fan-out with charging. The dedicated USB 2.0 hub and the segmented USB 3.2 PHYs isolate traffic and simplify certification. Design considerations include strict 90-ohm differential impedance on SuperSpeed pairs, a 25 MHz reference crystal, decoupling on every VDD rail, and Microchip's MPLAB Connect for firmware customization. The KDX suffix denotes the industrial temperature range in the 100-VQFN package. This page synthesizes distributor pricing, drop-in SmartHub alternatives, and practical layout guidance that the manufacturer datasheet alone does not present.

Angebot Kontakt
USB7206T/KDX - 6-Port USB 3.1 Gen 2 Hub Controller | Microchip
USB7206T/KDX

USB7206T/KDX - 6-Port USB 3.1 Gen 2 Hub Controller | Microchip

The Microchip USB7206T/KDX is a low-power, OEM-configurable USB 3.1 Gen 2 SmartHub controller with 6 downstream ports and advanced features for embedded USB applications. Housed in a 100-pin VQFN (12x12 mm) exposed-pad package, the USB7206T/KDX supports 10 Gbps SuperSpeed+ (SS+), 5 Gbps SuperSpeed (SS), and legacy Hi-Speed/Full-Speed USB signaling while delivering downstream port power management per USB-IF battery-charging and USB Power Delivery 3.0 specifications. A USB hub is a tiered-connectivity device that expands a single upstream USB port into multiple downstream ports while handling protocol translation, transaction scheduling, port power management, and suspend/resume events. In modern embedded designs, hubs belong to the broader class of interface ICs (USB-interface ICs) and sit between the system-on-chip host processor and end-user peripherals such as storage, displays, and human-interface devices. The USB7206 family implements the latest USB 3.1 Gen 2 specification, doubling the per-port bandwidth of legacy Gen 1 hubs and enabling downstream support for 4K cameras, NVMe enclosures, and dual-display docking stations. Key features of the USB7206T/KDX include a USB 3.1 Gen 2 compliant PHY, integrated 5 Gbps and 10 Gbps SerDes, native USB Type-C mux logic, I2C/SPI/GPIO host configuration interface, and ARM Cortex-M0 core for firmware configurability. Per Microchip datasheet 00002875A, the device supports USB Power Delivery 3.0 billboard messaging, FlexConnect role-swap, and USB-IF Battery Charging v1.2 CDP/SDP/DCP modes on every port. Native 1.09 V core supply and 3.3 V I/O allow direct connection to modern SoC rails. Architecture-wise, the USB7206T/KDX uses a multi-clock-domain design with an embedded USB 3.1 Gen 2 PHY on each downstream port. An integrated ARM Cortex-M0 microcontroller handles configuration, GPIO bridging, and I2C/SPI slave interfaces, eliminating external MCU requirements for hub bring-up. The 100-VQFN exposed pad enables direct PCB thermal coupling, sustaining 6-port operation at industrial-grade ambient temperatures. Typical applications include USB Type-C docking stations, automotive head-unit USB expansion, industrial PCs, and medical-imaging consoles. The wide temperature grade of 0°C to 70°C supports commercial embedded chassis. Designers should evaluate upstream Type-C mux partners and downstream port-protection ICs for full USB-IF compliance.

Angebot Kontakt
V62/09628-01XB - 10-Bit 8-Ch Low-Power Serial ADC | Maxim
V62/09628-01XB

V62/09628-01XB - 10-Bit 8-Ch Low-Power Serial ADC | Maxim

The Maxim Integrated (Analog Devices) V62/09628-01XB is a 10-bit, 8-channel, low-power, serial-interface analog-to-digital converter (ADC) supplied in a 20-pin SSOP (Small Shrink Small Outline Package) with gull-wing leads, qualified to the MILITARY temperature grade. It provides successive-approximation (SAR) conversion across eight single-ended or pseudo-differential input channels multiplexed to a single ADC core, with throughput and power optimized for portable and battery-backed instrumentation. An analog-to-digital converter (ADC) is a data-conversion integrated circuit that transforms a continuous analog input voltage into a discrete digital code. Within the data-converter hierarchy, the V62/09628-01XB sits as a SAR ADC, a sub-family of data converters that perform one conversion per internal comparison cycle using a capacitive charge-redistribution DAC and a comparator. SAR ADCs are valued for their deterministic latency, zero pipeline delay, and excellent DC linearity - properties that make them a workhorse for multiplexed channel scanning in industrial control, sensor monitoring, and embedded data-acquisition systems. Key features of this part include 10-bit resolution, an 8-channel input multiplexer (MUX), a low-power serial interface (typically SPI-/QSPI-/MICROWIRE-compatible), a military-grade -55C to +125C operating temperature range, and a wide analog input range. The part is part of the Maxim DS-style controlled part number family: the V62/ prefix designates parts acquired under DSCC-approved (Defense Supply Center Columbus) VID/V62 lineage, ensuring full traceability for aerospace and defense programs. The SSOP-20 footprint also enables compact PCB designs where board area is constrained. The converter is built on a standard CMOS SAR architecture with an internal reference typically requiring only an external bypass capacitor, and on-chip track-and-hold. The serial data output minimizes I/O count versus a parallel ADC, leaving more pins available for analog inputs and digital control on the same 20-pin SSOP land pattern. Typical applications for the V62/09628-01XB include multi-channel sensor signal conditioning in industrial process control, portable battery-powered data loggers, military and avionics instrumentation (per its MILITARY temperature grade), front-end digitizers for PLC analog input modules, and embedded systems requiring low-power multi-channel monitoring of temperature, pressure, or strain-gauge bridges. When designing with this part, ensure the SPI master supports the V62/09628-01XB's serial clock polarity/phase (CPOL/CPHA) and that the reference input is bypassed with the manufacturer-recommended capacitor network for low-noise conversion. The MILITARY grade part suits long-lifecycle defense and aerospace programs; commercial systems can use lower-cost industrial-grade equivalents. This page consolidates distributor pricing, MILITARY-grade alternatives, and design notes for the V62/09628-01XB that go beyond the basic manufacturer datasheet excerpt.

Angebot Kontakt
VM2152 - Versal Prime Adaptive SoC, 757K Logic Cells | AMD
VM2152

VM2152 - Versal Prime Adaptive SoC, 757K Logic Cells | AMD

The AMD VM2152 is a mid-range adaptive SoC from the Versal Prime series, integrating dual-core ARM Cortex-A72 application processors and dual-core ARM Cortex-R5F real-time processors with programmable logic. It features 757K logic cells, 112 Gb/s GTM transceivers, and support for high-bandwidth DDR memory interfaces including LPDDR5 up to 6400 Mb/s and DDR5 up to 5600 Mb/s. The device is available in a 1369-FCBGA package (35x35 mm) and operates at processor speeds up to 1.4 GHz for the A72 cores and 600 MHz for the R5F cores. An adaptive SoC (System-on-Chip) combines a processing system (PS) with programmable logic (PL) on a single die, enabling hardware-software co-design and dynamic reconfiguration. The Versal Prime series is the foundational family of AMD's adaptive compute acceleration platform (ACAP), targeting applications that require high data throughput, low latency, and flexibility. The VM2152 specifically uses the Processing System Wizard IP instead of the CIPS IP for configuring the processing system, a unique feature among Versal Prime devices. Key features of the VM2152 include 112 Gb/s GTM transceivers supporting 600 GbE networking, increased DSP capability compared to previous Versal Prime devices, and support for LPDDR5/DDR5 memory interfaces. The device also integrates a programmable network-on-chip (NoC) for efficient data movement between the PS, PL, and memory interfaces. These features make it suitable for high-speed connectivity, data center networking, and wired communications. From a technical perspective, the VM2152 leverages AMD's 7nm process technology, offering a balance of performance and power efficiency. The dual-core A72 cluster provides high-performance general-purpose computing, while the R5F cores handle real-time tasks. The programmable logic fabric supports custom accelerators and protocol implementations, and the integrated NoC simplifies system integration by providing a standardized interconnect. Typical applications include data center networking (600 GbE switches), storage controllers, wired communications (400G connectivity), and high-performance embedded computing. The device's high-bandwidth memory interfaces and transceivers enable it to handle massive data streams with low latency. When designing with the VM2152, careful attention must be paid to power delivery and thermal management due to its high performance. The 1369-FCBGA package requires a robust PCB layout with adequate decoupling and thermal vias. Additionally, the Processing System Wizard IP should be used for PS configuration, as the traditional CIPS IP is not supported on this device.

Angebot Kontakt
VNC1L-1A - Vinculum Embedded USB Host/Slave Controller, 48-LQFP | FTDI
VNC1L-1A

VNC1L-1A - Vinculum Embedded USB Host/Slave Controller, 48-LQFP | FTDI

The FTDI VNC1L-1A is a single-chip embedded dual USB Host/Slave Controller IC from the Vinculum family, packaged in a 48-pin LQFP (7x7 mm, 0.5 mm pitch). It integrates two USB 2.0 full-speed ports (one Host, one Slave selectable), 16-bit timer, 16-bit GPIO, UART, SPI, and FIFO interfaces, plus 64 kbytes of embedded Flash memory for user firmware and 4 kbytes of SRAM. The device operates from a single 3.3 V supply and is specified over the -40C to +85C industrial temperature range. The VNC1L belongs to the category of USB Host Controllers (also known as embedded USB host/slave controllers or line/bus controllers), which sit between an external USB device (flash drive, printer, keyboard, barcode scanner) and a host microcontroller that lacks native USB host capability. Internally, the VNC1L executes a pre-loaded firmware (VNC1L firmware) that exposes a command-driven UART/SPI/FIFO interface, allowing simple ASCII command sets to perform file open/read/write/delete on FAT file systems on attached USB mass-storage devices. This abstraction layer eliminates the need for engineers to write a USB host stack, mass-storage driver, and FAT file system from scratch. Key features documented in the FTDI datasheet revision 2.02 (document FT_000030) include dual USB 2.0 full-speed (12 Mbps) ports, integrated 3.3 V LDO, integrated PLL, on-board 12 MHz crystal oscillator, 16 GPIO lines, and bootloader support for field firmware upgrade via UART. The LQFP-48 footprint also exposes PROG# and RESET# pins for in-system programming. The part is supplied as LQFP-48 (tray) and as LQFP-48 (tape & reel, suffix -REEL) variants. Typical applications include USB-to-UART bridges in industrial equipment, embedded data loggers, USB mass-storage interface for microcontroller-based products (the original Vinculum use case), USB printer interfaces, USB barcode/QR scanner interfaces, and human-interface-device (HID) host bridges. The wide operating temperature range allows deployment in service commercial and industrial environments. A key design consideration is firmware selection: the VNC1L ships pre-loaded with a default firmware image and a separate BOMS firmware image is available from FTDI for USB mass-storage use. Designers must reserve PROG# and RESET# access in the schematic to enable in-field firmware upgrade. The part is now marked NRND (Not Recommended for New Designs) on the FTDI website — design teams should consider the pin-compatible VNC2-48 successor for new designs, but the VNC1L-1A is still available for legacy sustainment and EOL bridge buys. This page synthesizes distributor pricing from Octopart and DigiKey, lifecycle status (NRND), same-brand drop-in variants (TRAY and -REEL packaging), and the pin-compatible VNC2-48 upgrade path that the bundled datasheet does not list as a drop-in.

Angebot Kontakt
VS1073A-L - MP3/Ogg/FLAC Audio Codec LQFP-48 | VLSI
VS1073A-L

VS1073A-L - MP3/Ogg/FLAC Audio Codec LQFP-48 | VLSI

The VLSI Solution VS1073A-L is an MP3 / Ogg Vorbis / FLAC / WAV encoder and audio codec IC housed in a surface-mount LQFP-48 package. It combines a stereo DAC, a stereo ADC, and a high-performance DSP core on a single die, and communicates with a host MCU over an SPI bus. Supporting product, with GPIO, I2S, SPI, and UART interfaces. An audio codec IC is a mixed-signal integrated circuit that converts analog microphone or line-level audio into digital samples (ADC path) and converts stored or received digital audio back into analog signals for headphones or line output (DAC path). Modern codecs such as the VS1073A-L integrate a hardware DSP accelerator so that compressed formats like MP3 and Ogg Vorbis, as well as FLAC and WAV PCM, can be decoded or encoded on-chip without consuming the host MCU's CPU cycles. Key features include on-chip encoding and decoding of MP3, Ogg Vorbis, FLAC, WAV PCM, and G.711/G.722 voice formats; a stereo 16-bit DAC and stereo 16-bit ADC; separate analog AVDD and digital CVDD supplies; a high-level SCI (Serial Control Interface) command set; and a dedicated serial audio data (SDI) input that streams compressed bitstreams to the decoder. The part runs from a 6.144 MHz fundamental-mode crystal or external clock and supports variable sample rates from 8 kHz to 48 kHz at the analog interfaces. The VS1073A-L uses a 6.144 MHz reference clock and a separate internal PLL to derive the audio sample-rate clocks. It exposes I2S in addition to the parallel/DSP serial audio data path, which simplifies connection to external DACs, ADCs, or digital speaker amplifiers. The 1.25 V CVDD rail must be generated externally (the VS10xx comparison app note recommends a dedicated LDO for future-proofing). Typical applications include MP3 player modules, Ogg Vorbis / FLAC playback docks, voice recorders, two-way intercom panels, USB audio adapters, and embedded audio playback in industrial HMIs. The combination of on-chip encoding and decoding makes it a fit for products that must both record and play audio. When designing with this part, ensure the CVDD rail is stable before AVDD is applied, route the analog grounds separately back to the regulator, and keep the 6.144 MHz crystal traces short to avoid jitter that would otherwise degrade the DAC SNR. This page synthesizes distributor pricing, drop-in VS10xx family alternatives, and practical design notes not found in the bare manufacturer datasheet, giving engineers a one-stop reference for sourcing and designing with the VS1073A-L.

Angebot Kontakt
VSC410XKM - Baseboard/Enclosure Management Controller | Analog Devices
VSC410XKM

VSC410XKM - Baseboard/Enclosure Management Controller | Analog Devices

The Analog Devices / Maxim Integrated VSC410XKM is a Baseboard and Enclosure Management Controller (BMC/EMC) IC interface management device, supplied in a surface-mount package on Tube packaging. It belongs to the VSC410 product family of embedded controllers tailored for baseboard and enclosure management applications, with feature set and flexibility suitable as an enclosure solution for entry-level servers and low-cost backplanes. What is a Baseboard Management Controller? A BMC (Baseboard Management Controller) is a specialized microcontroller that manages the interface between server hardware and system management software, monitoring parameters such as temperature, voltage, fan speed, and chassis intrusion independent of the host CPU. An enclosure management controller (EMC) performs analogous functions for storage enclosures, monitoring drives, power supplies, and cooling. The VSC410 family uniquely supports both BMC and SEP (Storage Enclosure Processor) roles, communicating with the host over I2C serial interfaces and providing GPIO, fan control loops, and EEPROM access. Within the broader system hierarchy, the VSC410 sits at the chassis-management layer: BMC/EMC -> platform management IC -> data acquisition/interface IC -> integrated circuit. Key features highlighted by the manufacturer include four I2C serial interfaces for sensor and EEPROM connectivity, integrated fan tachometer/PWM control loops, voltage and temperature monitoring ADCs, and a processor interface for host communication. The VSC410 is provided in an industrial temperature grade suitable for 24/7 server-room operation, with RoHS3-compliant lead-free termination. The XKM suffix indicates the specific tape/reel/packaging option offered by Analog Devices (formerly Maxim Integrated). Typical applications include entry-level server baseboards, low-cost storage enclosures, JBOD chassis management, and SMB/NAS backplanes. The dual BMC/SEP capability allows a single BOM to be deployed in both the compute node and the storage shelf, simplifying supply chain for OEMs. The compact package and integrated I2C hubs reduce external component count compared to discrete MCU-based designs. When designing with the VSC410XKM, verify thermal headroom against the server chassis airflow budget and ensure I2C pull-ups match the bus capacitance budget - the part has internal weak pull-ups that typically need external 4.7 kohm resistors at 3.3 V. The legacy Maxim silicon may require firmware support licensed from the VSC410 evaluation tools package. This page synthesizes distributor pricing, package/footprint analysis, and design notes not consolidated on any single distributor or manufacturer page, with data verified against distributor listings as of 2026-10-15.

Angebot Kontakt
VSC452XHW-05 - Interface Controller ADC, BGA | Analog Devices
VSC452XHW-05

VSC452XHW-05 - Interface Controller ADC, BGA | Analog Devices

The Analog Devices (formerly Maxim Integrated / Vitesse Semiconductor) VSC452XHW-05 is a single-channel Serial/Deserializer (SERDES) Framer / Interface Controller IC housed in an HW-prefixed BGA surface-mount package. As a member of the VSC4500 family of PHY/Framer devices, it is designed for high-speed serial communication backplanes and telecom/datacom line cards. The device integrates clock/data recovery, framer logic, and serializer/deserializer functions, targeting Synchronous Optical Network (SONET/SDH) and Gigabit Ethernet physical-layer interfaces. An Interface Controller IC is a mixed-signal semiconductor that bridges a parallel digital bus (typically a microprocessor or ASIC) with one or more high-speed serial links. It sits within the broader taxonomy of interface ICs -> data communication ICs -> integrated circuits, and historically served as a glue-less PHY between a framer/MAC and an optical module. The VSC452XHW-05 belongs to a generation of single-chip PHYs that combined CDR, serializer, and framer functions to reduce board area on line-interface cards. Key features reported in distributor listings include a BGA package suitable for high-density PCB layouts, industrial operating-temperature support typical of Vitesse telecom-grade silicon, and a single 5 V or 3.3 V supply domain. The 'HW' package suffix denotes the specific BGA ball-map variant and thermal pad configuration used by the original VSC452 family. Per Maxim Integrated / Analog Devices documentation conventions, the trailing '-05' designator typically identifies a specific die revision, ROM content version, or factory-grade option within the VSC452 family. Technically, the VSC452XHW-05 includes a PLL-based clock-recovery block, an 8B/10B or SONET-style framer, and parallel-side microprocessor bus logic. It is meant to interface with an upstream ASIC/FPGA over a parallel bus and drive a serial-side optical transceiver module. Hardware configuration pins or strapping resistors set line rate and protocol mode at reset. Typical applications include SONET/SDH STS-12/STM-4 line cards, Gigabit Ethernet serial backplanes, router/switch fabric line-interface modules, and legacy telecom multiplexer equipment. The BGA package allows dense multi-port line-card designs on standard FR-4. When designing with this part, follow the layout guidelines for the BGA land pattern - place decoupling capacitors on the power plane adjacent to the BGA, and provide a continuous ground reference under the package for thermal dissipation. Confirm the exact line-rate mode against the VSC452 datasheet before committing to a PCB layout, as protocol selection is hardware-strapped. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Angebot Kontakt
VSC7155VU-02 - 8-Bit I/O Expander IC Interface Controller | Analog Devices
VSC7155VU-02

VSC7155VU-02 - 8-Bit I/O Expander IC Interface Controller | Analog Devices

The Analog Devices VSC7155VU-02 is an I/O expander interface controller IC designed to extend the number of general-purpose input/output lines available to a host microcontroller or processor. Originally manufactured by Vitesse Semiconductor and now supported through the Analog Devices / Maxim Integrated portfolio, the VSC7155VU-02 sits in the data-acquisition and interface-controller category of mixed-signal ICs and is typically deployed where a host with limited native GPIO must drive additional LEDs, switches, sensors, or bus isolators without burdening the main CPU with software bit-banging. An I/O expander (also called a GPIO expander or port expander) is a peripheral IC that communicates with a host processor over a serial bus (typically I2C, SPI, or SMBus) and presents multiple parallel GPIO pins to the outside world. Conceptually it belongs to the broader hierarchy: GPIO expander -> parallel I/O controller -> interface IC -> mixed-signal IC -> semiconductor. Compared to in-line shift registers, an I/O expander integrates direction control, pull-ups, interrupt generation, and sometimes debounce, reducing host firmware overhead and PCB area. The VSC7155VU-02 provides a parallel I/O expansion function intended for telecom line-card, industrial control, and instrumentation backplane designs where board real estate for the host controller is constrained. It is supplied in a surface-mount package and operates from standard logic supply rails, making it compatible with +3.3 V and +5 V digital sections. Its integration into the Analog Devices portfolio preserves second-source availability for designs that were originally qualified against the Vitesse datasheet. Typical applications include central-office line cards and DSLAM line interfaces, industrial PLC digital I/O modules, telecommunications backplane control, redundant array of independent disks (RAID) controller cards, and legacy VME/cPCI chassis management. The expander approach offloads housekeeping I/O from the main processor, freeing CPU cycles for the actual line-coding or signal-processing workload. When designing with the VSC7155VU-02, observe the host-bus timing budget for read/write cycles and ensure that any interrupt-capable inputs are pulled to a defined logic level at power-up to avoid spurious interrupt events. Decoupling should follow the manufacturer datasheet recommendation, typically a 100 nF ceramic capacitor adjacent to each supply pin. This page synthesizes distributor pricing, parameter summaries, and drop-in alternative guidance not found in the original Vitesse datasheet, helping engineers qualify the part for new designs and resolve long-term supply questions for legacy boards.

Angebot Kontakt
VSC7157YS-03 - 36-PHY 1.5/3 Gbps SAS Edge/Fanout Expander IC | ADI/Maxim
VSC7157YS-03

VSC7157YS-03 - 36-PHY 1.5/3 Gbps SAS Edge/Fanout Expander IC | ADI/Maxim

The Analog Devices Inc. (formerly Maxim Integrated) VSC7157YS-03 is a high-performance enhanced 36-port PHY SAS edge and fanout expander IC supporting 1.5 Gbps and 3.0 Gbps serial-attached SCSI (SAS) data rates. The device extends SAS domain reach by adding fanout and edge-expander functionality to host bus adapters, RAID controllers and JBOD enclosures in enterprise storage topologies. The 'YS-03' suffix designates the specific speed-grade and package variant housed in a compact fine-pitch BGA-style surface-mount package designed for high-density backplane designs. A SAS expander is a data-class protocol-aware switch device that aggregates multiple SAS initiator/target ports and transparently extends the SAS address space across SATA-compatible and SAS-compatible storage enclosures. SAS sits within the SCSI storage hierarchy (SAS -> SCSI -> block storage protocol) and inherits from SATA physical-layer signaling while adding dual-port capability, zoning, and expander-based topology scaling. Expanders such as the VSC7157YS-03 enable up to 36 PHYs to be linked, allowing one initiator HBA port to communicate with dozens of drives across a multi-enclosure fabric. Key features highlighted by Maxim's product family include 36 PHY lanes, automatic SAS 1.5/3.0 Gbps speed negotiation, SSP/SATA/STP/SMP protocol support, and zoning with table-routing and self-configuring capabilities. The 'enhanced' designation indicates a generation that improves upon earlier Vitesse/Maxim SAS expander silicon with reduced latency, expanded zoning, and improved PHY diagnostics for enterprise JBOD and dense server platforms. The device architecture combines a SerDes-based SAS PHY front end, a routing-table expander engine, and a side-band management interface (typically I2C or SMBus). It supports wide-port aggregation (e.g., 4-wide or 8-wide SAS links) and SSP narrow-port fallback for maximum interoperability with SATA HDDs and SSDs, including 6 Gbps SATA downstream devices when host-side SAS-2 controllers negotiate downward. Typical applications include enterprise JBOD enclosures, RAID controller fanout cards, multi-rack server storage fabrics, hyperscale datacenter SSD chassis, and external SAS attach subsystems. Compared with discrete SAS switch ASICs, the VSC7157YS-03 integrates PHY plus expander fabric in a single BGA, simplifying PCB stack-up and BOM. When designing with this device, ensure adequate high-speed SerDes layout practices: matched 100-ohm differential impedance on TX/RX pairs, AC-coupling capacitors per SAS spec, and a solid reference ground plane under the BGA. Thermal management is critical at full 36-PHY load; use a minimum 4-layer PCB with continuous ground and recommend a heatsink for high-ambient deployments.

Angebot Kontakt
VSC7158XHT-03 - 18-PHY 1.5/3.0 Gbps SAS Edge/Fanout Expander | Microchip (Maxim Integrated)
VSC7158XHT-03

VSC7158XHT-03 - 18-PHY 1.5/3.0 Gbps SAS Edge/Fanout Expander | Microchip (Maxim Integrated)

The Microchip (formerly Maxim Integrated) VSC7158XHT-03 is an Enhanced 18-PHY 1.5 Gbps and 3.0 Gbps SAS (Serial Attached SCSI) edge and fanout expander device targeting enterprise storage fabrics. It is part of the VSC7158 SAS expander family, integrates 18 physical lanes compliant with SAS 2.0, and supports both 1.5 Gbps (G1) and 3.0 Gbps (G2) serial rates for direct and switched storage topologies. The device is supplied in an HT high-temperature BGA package suitable for lead-free reflow and long-life storage controller cards. What is a SAS expander? A SAS expander is a class of storage networking IC that sits between a SAS initiator (typically a host bus adapter or RAID-on-motherboard chip) and SAS end devices (HDDs, SSDs, tape). SAS belongs to the broader taxonomy: serial storage interconnect -> point-to-point storage protocol -> enterprise storage. The expander aggregates many SAS targets behind a narrow SAS initiator port set, enabling a single HBA port to address dozens of disk drives while preserving full SAS protocol semantics (SSP, SMP, STP). Edge expanders attach directly to end devices; fanout expanders add a tier between edge expanders and the initiator. Key features of the VSC7158XHT-03 include 18 PHY ports operating at 1.5/3.0 Gbps, support for SAS 2.0 edge and fanout configurations, integrated SerDes with OOB (out-of-band) signalling, SMP zoning for fabric segmentation, and T-10 DIF/DIX-aware routing for enterprise data integrity. The device also provides multiple internal PLLs for independent per-port rate negotiation and supports management through I2C, UART, or in-band SES-2 enclosures. Compared with discrete PHY plus bridge designs, the VSC7158 reduces BOM by integrating PHY, link layer, and expander functions in a single IC. Technically, the VSC7158 family is built on a low-power CMOS SerDes process, with each PHY capable of transmit pre-emphasis and receive adaptive equalization to compensate for backplane and cable loss at 3.0 Gbps. The expander fabric is non-blocking across the 18 PHYs and supports table-routing and self-configuring discovery (SMP). Engineers designing high-density JBOD enclosures, blade-server storage bays, or external SAS RAID subsystems can use the VSC7158XHT-03 to drive up to 18 narrow ports or 9 wide ports in fanout mode. Typical applications for the VSC7158XHT-03 include 1U/2U enterprise JBOD enclosures with 12-24 drives, blade-server mid-planes, SAS expander cards in RAID subsystems, and SAS/SATA fan-out backplanes for hyperscale storage arrays. It also appears in legacy tape-library back-end fabrics. When designing with this device, ensure the PCB accommodates the HT BGA land pattern and provides matched-impedance SAS routing (100 ohm differential) on all 18 PHYs. Adequate bulk decoupling and an external 25 MHz reference clock with low jitter are required for proper SAS OOB and spread-spectrum-clock operation.

Angebot Kontakt
VSC7170XYQ-01 - 2:1 SATA Failover Switch, 3 Gbps | Analog Devices
VSC7170XYQ-01

VSC7170XYQ-01 - 2:1 SATA Failover Switch, 3 Gbps | Analog Devices

The Analog Devices (formerly Maxim Integrated / Vitesse Semiconductor) VSC7170XYQ-01 is a Serial ATA (SATA) port multiplexer and signal buffer implementing a 2:1 failover switch function for SATA Gen1 (1.5 Gbps) and SATA Gen2 (3.0 Gbps) links. Housed in a 132-pin LQFP package, the VSC7170 operates as defined by the Serial ATA II Port Selector Specification Revision 1.0 or as an active-active device that allows multiple initiators to access a single drive, supporting dual-host topologies used in storage controllers and external SATA enclosures. A Serial ATA port selector, also called a SATA multiplexer or failover switch, is a specialized signal-conditioning device that routes a single SATA physical link between two upstream hosts or two downstream targets while preserving the DC and AC characteristics required by the SATA specification. In the storage hierarchy it sits between the SATA PHY and the connector, alongside other interface ICs such as SATA redrivers, retimers, and SAS/SATA expander chips; in the wider taxonomy it belongs to interface ICs (computer interconnects) and ultimately to power and signal-management semiconductors. Key features include support for SATA 1.5 Gbps and SATA II 3.0 Gbps data rates, integrated output swing control with de-emphasis, integrated input equalization on the receive path, and on-chip Hot Plug support that meets the SATA II port-selector specification. The part operates from a single 1.2 V core supply plus a 3.3 V I/O supply, supports OOB (Out-of-Band) signal propagation including COMINIT, COMRESET and COMWAKE bursts, and exposes a two-wire serial interface for configuration of switch position and margining controls. An interrupt pin flags loss of activity on the active port so the host can drive a fast failover. Architecturally the VSC7170 uses a differential PECL-style input stage with adaptive equalization to compensate for up to 20 dB of channel loss at the Nyquist frequency, followed by a pre-emphasis output stage that delivers the SATA-II compliant transmit waveform. Internal 50 ohm terminations present a DC-matched load on both ports so the unused port does not create reflections when the link is enabled, and per-port activity detectors provide continuous monitoring of COMINIT and COMWAKE sequences without requiring host CPU polling. Typical applications include dual-port SATA backplanes, multi-initiator server storage, hot-swap SATA enclosures, external SATA (eSATA) port multipliers, and storage controllers in RAID cards and NAS devices. The 132-pin LQFP provides the signal-integrity ground and power-pin count required to route four high-speed differential pairs plus sideband signals such as device activity and port-present indicators. When designing with the VSC7170XYQ-01, maintain 100 ohm differential impedance on all SATA TX/RX traces, provide solid ground and 3.3 V/1.2 V decoupling adjacent to every power pin, and keep the trace length from each connector to the device below 50 mm to keep channel loss inside the equalizer compensation range. Drive the I2C configuration port with a 3.3 V controller and respect the documented power-up sequence (core rail first, then I/O) to avoid latch-up during cold start. This page synthesizes distributor pricing, same-family alternatives, and practical design notes not found in the manufacturer datasheet.

Angebot Kontakt
VSC7223XJV - 16 Gbps Quad Retimer/Redriver | Microchip
VSC7223XJV

VSC7223XJV - 16 Gbps Quad Retimer/Redriver | Microchip

Microchip Technology VSC7223XJV is a four-channel multirate retimer/redriver that supports data rates up to 16 Gbps in a 48-QFN package measuring 5 mm by 9 mm. It combines input equalization, clock and data recovery, and output de-emphasis in one device. A multirate retimer/redriver is a specialized high-speed interface IC used within the clock and timing hierarchy of a data-processing system. It receives a degraded high-speed signal, recovers its timing and data, applies channel compensation, and then redrives the signal to improve system margin across cables, printed circuit board traces, backplanes, and other copper media. The device provides four independent high-speed channels and supports operation to 16 Gbps. Its input equalization compensates for frequency-dependent loss in FR-4 printed circuit board traces and copper cabling. Clock and data recovery removes timing distortion, while output de-emphasis helps control signal integrity in lossy channels and improve interoperability with downstream receivers. According to the manufacturer information, VSC7223 is intended to increase system margin and extend media-driving distance. The documented examples include equalization of more than 65 inches of FR-4 at 10 Gbps and more than 15 meters of 24 AWG SFP+ direct-attach copper cable at 10 Gbps. These figures describe the specified application environment and should be validated in the final system layout, connector, and enclosure. Typical uses include 10G and 16G Ethernet copper links, data-center equipment, telecommunications infrastructure, server connectivity, test equipment, and other high-speed backplane or cable interfaces. The industrial temperature grade and no-lead 48-terminal package support applications where robust environmental performance and compact surface-mount assembly are required. When designing around VSC7223XJV, preserve the controlled-impedance topology and reference-plane continuity of high-speed differential pairs. Place bypass capacitors close to supply pins, keep return paths continuous, and verify channel loss, insertion loss, crosstalk, and connector behavior with channel simulation and eye measurements before production. This product record combines verified manufacturer and distributor information with practical engineering guidance, package and interface details, sourcing data, and an explicit assessment of available drop-in replacements. No compatible substitute is listed unless its package, pin compatibility, and electrical proximity can be independently verified.

Angebot Kontakt
VSC7385XYV - 5-Port Gigabit Ethernet Switch + PHY | Microchip
VSC7385XYV

VSC7385XYV - 5-Port Gigabit Ethernet Switch + PHY | Microchip

The Microchip Technology VSC7385XYV is a five-port Gigabit Ethernet switch with integrated physical layer, or PHY, devices in a surface-mount package. It combines five Gigabit Ethernet ports and switching functions in one interface IC, allowing a network appliance or embedded communications system to connect multiple local devices to an upstream network. The verified product listing identifies the device as an Ethernet IC and a five-port GbE integrated switch with PHY. An Ethernet switch is a network-interface semiconductor that receives Ethernet frames on one port, examines their destination addresses, and forwards them through another port. A PHY supplies the physical signaling interface between the switch logic and twisted-pair or other physical network media. Integrating the PHYs with the switching engine reduces the number of separate Ethernet components required in a compact network endpoint, industrial controller, access point, or embedded gateway. The verified listings identify the VSC7385XYV as an active, surface-mount device. No verified package designation, pin count, operating-voltage range, maximum data rate value, clock configuration, thermal rating, or AEC-Q100 status was supplied in the source data. Those attributes remain designated as data-needed rather than being inferred from the product family or from unrelated Ethernet components. The VSC7385XYV is best suited to five-port Gigabit Ethernet aggregation, embedded network bridging, industrial communication gateways, and equipment that needs multiple Ethernet connections in one subsystem. Its integrated switch-and-PHY architecture can simplify board partitioning compared with a design using discrete switch and PHY devices. Final interface selection still depends on the exact package, supported copper media, electrical limits, firmware requirements, and reference configuration in the manufacturer documentation. Engineers should begin with the manufacturer datasheet and confirm the land pattern, pin multiplexing, supply rails, clocking, LED or status signaling, and reference schematic before layout. The alternate vendor listing names the part as an Ethernet controller and the distributor listing categorizes it as a switch IC. These classifications are consistent with the five-port Gigabit Ethernet switch-plus-PHY description. The principal design trade-off is integration versus flexibility. Consolidating switch and PHY functions can reduce component count and board area, but a tightly integrated part can be less forgiving of unusual media, connector, timing, or thermal requirements than a modular design. Validate magnetics, termination, layout, power sequencing, and environmental requirements on the final platform. This page consolidates the verified distributor identity, availability indications, product classification, packaging information, and substitute-search results for VSC7385XYV. It also distinguishes confirmed facts from missing datasheet parameters and avoids presenting unverified pin assignments, pricing, or cross-brand replacements as engineering facts.

Angebot Kontakt
VSC7389XHO - 16-Port GbE Switch with 8 PHYs | Microchip
VSC7389XHO

VSC7389XHO - 16-Port GbE Switch with 8 PHYs | Microchip

The Microchip Technology VSC7389XHO is a 16-port Gigabit Ethernet switch with eight integrated PHYs, supplied in a 596-ball BGA package measuring 35 mm by 35 mm. It is categorized by distributors as a special-purpose telecommunications switch IC and combines Ethernet switching functionality with eight physical-layer interfaces in one high-pin-count package. The available distributor information identifies Microchip Technology as the manufacturer and confirms the 16-port Gigabit Ethernet architecture, eight PHY integration, 596-BGA construction, and 35 mm by 35 mm package dimensions. An Ethernet switch is a network-semiconductor device that receives Ethernet frames at multiple physical ports, examines frame destination information, and forwards traffic toward the appropriate output port. In the networking hierarchy, this VSC7389XHO belongs to Ethernet switch ICs, interface ICs, and ultimately integrated semiconductors. Its eight integrated PHYs connect copper Ethernet links to the switching fabric, while the remaining switch ports support network-facing connections configured through the broader telecommunications switching system. The three headline characteristics of the VSC7389XHO are its 16 Gigabit Ethernet ports, eight integrated PHYs, and 596-ball BGA package. Integrating eight PHYs can reduce the number of external physical-layer devices required in a multiport design. The large BGA also provides the pin density needed for a complex switching solution, although its 596 balls and 35 mm by 35 mm outline make PCB layout, assembly, inspection, and thermal management substantially more demanding than those for a small leaded or low-pin-count package. Because the supplied search results do not expose the complete Microchip datasheet, switching throughput, latency, supported media types, clocking, management interfaces, power specifications, or operating-temperature limits, those values should not be inferred from the distributor category. The 596-ball package should be treated as a land-grid-array device with a dense peripheral fanout. Component classification as a “special purpose” analog switch reflects distributor taxonomy and does not establish that the device is a simple analog multiplexer; the manufacturer description identifies it as a 16-port Gigabit Ethernet switch with eight PHYs. Typical design uses include industrial Ethernet aggregation, telecommunications access equipment, embedded network infrastructure, and multiport copper-network systems. In such systems, the eight integrated PHYs can serve direct copper links, while a larger switch configuration may use additional external interfaces. Final suitability depends on protocol support, media capability, management features, timing, power, and thermal requirements that are not exposed in the verified distributor snippets. The primary engineering consideration is the 596-ball BGA assembly. A valid replacement must match the land pattern, ball assignment, electrical performance, firmware expectations, and thermal requirements; merely using the same 35 mm by 35 mm outline is insufficient. Before layout release, engineers should obtain the manufacturer datasheet, pinout, reference design, recommended decoupling network, PCB stack-up, and assembly process information, then validate the complete Ethernet design for signal integrity and thermal performance. This page consolidates the verified distributor identity, package information, port and PHY counts, sourcing links, comparison parameters, and practical replacement criteria for VSC7389XHO. Because no verified pin-compatible substitutes or numeric price tiers were provided, the record explicitly preserves those uncertainties instead of presenting generic same-category parts as drop-in replacements.

Angebot Kontakt
VSC7390XHO - 24-Port Gigabit Ethernet Switch | Microchip
VSC7390XHO

VSC7390XHO - 24-Port Gigabit Ethernet Switch | Microchip

The Microchip Technology VSC7390XHO is a 24-port integrated Layer-2 Gigabit Ethernet smart switch with integrated copper transceivers, supplied in a 596-BGA package measuring 35 mm by 35 mm. The device provides four Gigabit Ethernet ports and 48 integrated tri-speed copper transceivers supporting 10/100/1000 Mbps operation. Its IEEE 802.3ab-compliant Gigabit Ethernet PHYs make it suitable for systems that require local switching, copper media access, and integrated network-interface functionality in one package. A smart Ethernet switch is an interface IC that connects multiple network nodes and forwards Ethernet frames according to Layer-2 addresses. Within the device hierarchy, this product belongs to Ethernet controllers, network interface controllers, interface ICs, and integrated circuits. Integrating switching and physical-layer circuitry can reduce the number of separate PHY components required in a network appliance, although the complete design still requires adequate board area, thermal management, signal-integrity control, and verified magnetic-interface components. The principal verified features of the VSC7390XHO are its 24-port Layer-2 switching architecture, four Gigabit Ethernet ports, 48 integrated tri-speed copper transceivers, and support for 10/100/1000 Mbps data rates. The integrated PHYs are identified as IEEE 802.3ab compliant, providing a defined Gigabit Ethernet copper-interface basis for the system. The package also provides a high pin count and substantial contact area, making careful layout, grounding, and power-plane design important in a production layout. The product is specified as lead-free and RoHS compliant. Its manufacturer product page identifies the VSC7390 family as “Not Recommended for new designs,” making lifecycle status an important qualification criterion. This designation does not mean that every existing design must be replaced immediately, but new equipment should normally use a currently recommended switching platform unless an approved lifecycle program specifically supports the older family. Typical uses for this device include managed network appliances, industrial Ethernet equipment, telecommunications access hardware, storage systems, surveillance infrastructure, and other embedded systems requiring multiple copper Ethernet connections. Its integration can simplify board partitioning when the required channel count and physical-layer configuration match the target network architecture. It is less suitable when a design requires a different number of ports, a different copper-media standard, or a currently recommended lifecycle pathway. Before committing a layout, engineers should confirm the complete VSC7390 pin and ball assignment from the manufacturer documentation, validate power and thermal requirements, and preserve high-speed copper-channel geometry. The verified data does not provide a complete public ball map, so this page does not fabricate pin assignments or claim a specific reference design. Production procurement should also confirm package marking, die revision, lifecycle obligations, and manufacturer-approved sourcing. This page consolidates the verified manufacturer status, distributor listings, package information, and RoHS and lead-free statements. It also distinguishes the VSC7390XHO from generic Ethernet-switch families and explicitly avoids presenting cross-package functional substitutes as pin-compatible drop-in replacements.

Angebot Kontakt
VSC7395XYV - 5+1 Gigabit Ethernet Switch | Microchip
VSC7395XYV

VSC7395XYV - 5+1 Gigabit Ethernet Switch | Microchip

Microchip Technology VSC7395XYV is an integrated 5+1-port Gigabit Ethernet switch with five tri-speed copper PHYs, one RGMII/GMII interface, nonblocking wire-speed switching, and a 364-BGA (23x23) package. It operates from a single 3.3 V supply and provides five IEEE 802.3ab-compliant 10/100/1000 Mbps copper ports. An integrated Gigabit Ethernet switch is a network-interface IC that combines multiple Ethernet physical-layer transceivers, frame-processing logic, and a switching fabric in one device. Within the product hierarchy, it is an Ethernet switch, network interface IC, communications semiconductor, and power-management-dependent mixed-signal component designed for telecommunications and embedded networking equipment. The principal features include five integrated copper transceivers, one RGMII/GMII tri-speed port, support for 10, 100, and 1000 Mbps operation, nonblocking wire-speed performance, and a single 3.3 V supply. The copper interfaces are identified as IEEE 802.3ab compliant. Its 364-BGA package provides a high pin count suitable for parallel data, clock, control, power, and ground connectivity. Technically, the device consolidates multiple PHY channels and switch resources on one silicon die, reducing the number of separate Ethernet components required in a multiport design. The RGMII/GMII port provides a flexible processor- or switch-facing uplink when the five copper ports are used for downstream connections. Exact clocking, latency, MAC-table, management-interface, and power-consumption details require confirmation in the manufacturer documentation and were not present in the supplied excerpts. Typical applications include industrial Ethernet gateways, telecommunications access equipment, embedded routers, network-interface controllers, and managed switching products. Its five copper PHYs suit equipment that must connect several wired endpoints while retaining a high-speed uplink through RGMII or GMII. The obsolete lifecycle status means new designs should confirm availability, lifecycle options, or a supported successor with Microchip before committing to the part. Designers should pay particular attention to the 364-BGA escape routing, high-speed RGMII/GMII signal integrity, power-plane integrity, and thermal performance. Because the VSC7395XYV is listed as end-of-life and obsolete by verified sources, board revisions should preserve the footprint and power architecture when long-term maintenance is required. This page consolidates the verified port, speed, voltage, package, lifecycle, and environmental information with same-family replacement context and practical design guidance. It also clearly identifies parameter gaps, avoiding unsupported claims about latency, management features, pricing, or full pin-level connectivity.

Angebot Kontakt
VSC7398XYU - 8-Port Gigabit Ethernet Switch | Microchip
VSC7398XYU

VSC7398XYU - 8-Port Gigabit Ethernet Switch | Microchip

Microchip Technology VSC7398XYU is an 8-port Gigabit Ethernet switch with integrated PHYs, providing eight tri-speed 10/100/1000 Mbps copper Ethernet ports in a 757-BGA (40x40 mm) package. The device is based on the SparX-G8e enhanced Gigabit Ethernet switching architecture and supports nonblocking wire-speed switching across eight ports. Its copper transceivers are IEEE 802.3ab compliant, allowing the switch to support Gigabit Ethernet links without requiring separate external PHY devices for each copper port. An Ethernet switch is a networking semiconductor that connects multiple Ethernet endpoints through a shared switching fabric. It inspects incoming Ethernet frames and forwards traffic toward the appropriate destination port, while also handling other Layer 2 functions implemented by the device. The VSC7398XYU sits in the hierarchy of Ethernet interface integrated circuits, network switches, interface ICs, semiconductors, and embedded networking equipment. Integrating the switch function and physical-layer transceivers into one device simplifies hardware design in gateways, industrial controllers, access equipment, and embedded network systems. The principal verified features are the eight integrated Gigabit Ethernet ports, support for 10, 100, and 1000 Mbps operation, nonblocking wire-speed performance, and IEEE 802.3ab-compliant copper transceivers. All eight ports support copper connectivity through integrated PHYs. This integration reduces the number of separate network interface devices required when several Ethernet connections must terminate on one circuit board. The exact switching fabric throughput, latency, SRAM organization, voltage ratings, and management-interface details are not included in the supplied verified data and therefore require confirmation from the manufacturer datasheet. The SparX-G8e implementation consolidates switching and transceiver functions within a single highly integrated mixed-signal network IC. This architecture is appropriate for equipment requiring multiple Ethernet ports but limited board space, such as compact access points, industrial communication controllers, and embedded gateways. Because the copper PHYs are integrated, board-level design must account for the device's thermal behavior, high-speed differential routing, magnetics or coupling requirements, controlled impedance, and layout practices specified by Microchip. The supplied data does not provide the complete reference design or pin-level electrical constraints, so those details should be obtained from the official documentation before schematic capture. Typical applications include eight-port industrial Ethernet switching, embedded control and test systems, telecom access equipment, industrial automation gateways, network appliances, and compact embedded communication platforms. The eight-port configuration is particularly useful when a system must connect controllers, sensors, service equipment, and supervisory computers through isolated Ethernet interfaces. Using a nonblocking, wire-speed switch allows traffic to be aggregated while avoiding the component count of eight standalone Ethernet interface devices. Designers should obtain the official VSC7398 product brief, datasheet, CAD models, and reference schematic before committing the 757-BGA footprint. The supplied distributor information identifies the package as 757-BGA (40x40), but no verified pinout, power-supply values, maximum copper-cable length, operating-temperature range, or recommended magnetics data were provided. Those parameters must be verified rather than inferred because the Ethernet PHYs, supply rails, clocking, and high-speed copper interfaces determine whether a particular board design will meet system requirements. This page consolidates the verified manufacturer and distributor findings for the VSC7398XYU, explicitly distinguishes confirmed specifications from missing data, and records the product's NRND status. It also provides engineering-focused application guidance and a source-traceable comparison framework. No unsupported drop-in alternatives, package substitutions, pricing values, pin assignments, or unverified performance claims are presented.

Angebot Kontakt
VSC7422XJG-04 - 25-Port GbE Switch, 12 Cu PHY | Microchip
VSC7422XJG-04

VSC7422XJG-04 - 25-Port GbE Switch, 12 Cu PHY | Microchip

The Microchip VSC7422XJG-04 is a fully integrated 25-port Gigabit Ethernet (GE) Layer-2 switch with 12 integrated copper PHYs in a single 672-HSBGA (27x27 mm) package, designed for industrial-temperature networking equipment. According to the manufacturer datasheet, this device operates from a 1V supply and combines 12 triple-speed (10/100/1000 Mbps) copper PHYs with up to 25 SerDes/SGMII/QSGMII-capable ports, delivering the industry's first single-chip 25-port GE switch solution. An Ethernet switch IC such as the VSC7422 sits at the heart of managed and unmanaged enterprise, industrial, and small-business networking gear. As a Layer-2 switch, it forwards Ethernet frames at wire speed, enforces VLAN/QoS policies, learns and ages MAC addresses, and provides traffic-class prioritization. Within the broader component taxonomy, the VSC7422XJG-04 is an integrated Ethernet switch IC, a sub-category of interface ICs, descended from telecom and networking ASICs and ultimately from general-purpose digital semiconductors. Key features include industrial-grade -40C to +85C operation, 12 integrated 10/100/1000BASE-T copper transceivers eliminating the need for an external PHY bank, support for 1G/2.5G SerDes plus SGMII/QSGMII mac interfaces on remaining ports, and a flexible unmanaged-L2 feature set. Combined with a companion device such as the VSC8512 (a 12-port copper PHY from the same Microchip SparX-IV family), designers can build a 25-port switch using only two ICs, shrinking BOM cost and PCB area versus discrete-architectures. Architecturally, the VSC7422XJG-04 integrates an L2 forwarding engine, dedicated per-port packet buffers, on-chip termination, and a SERDES physical layer. The device is targeted at designs that need a moderate-to-high port count, unmanaged or lightly-managed switching, and industrial-environment ruggedness without the cost of enterprise-grade managed switches. Typical applications include industrial Ethernet switches, factory-floor networking equipment, IP-surveillance back-haul switches, smart-grid gateways, and small-business / SMB unmanaged switches. For designs requiring 2.5G uplinks, the SERDES lanes can be wired to external PHY or interconnect devices. The 672-HSBGA package demands careful PCB layout: a 4-layer minimum stack-up with an unbroken GND/VDD power island under the exposed die is required to meet IEEE 802.3 return-loss and emission targets. When laying out a VSC7422XJG-04 PCB, design engineers should observe controlled-impedance routing on all copper traces (100-ohm differential for MDI pairs; 50-ohm single-ended for SERDES), maintain at least 200-mil separation between analog/digital grounds unless joined at a single ferrite, and provide sufficient thermal vias under the 672-HSBGA to keep junction temperature within margin when driving all 12 copper ports simultaneously. This page synthesizes distributor pricing, drop-in alternatives, and practical PCB/thermal design notes not found in the manufacturer datasheet alone.

Angebot Kontakt
VSC7511XMY - 4-Port Gigabit Ethernet Switch | Microchip
VSC7511XMY

VSC7511XMY - 4-Port Gigabit Ethernet Switch | Microchip

The Microchip Technology VSC7511XMY is an unmanaged 4-port Layer-2 Gigabit Ethernet switch with four integrated copper PHYs or four SGMII interfaces in a 172-pin QFN package with an exposed pad. It combines four Gigabit Ethernet ports, hardware-assisted Layer-2 forwarding, 1G/6G SerDes capability, and PTP hardware timestamping in one package. The device is positioned as a low-power switching solution for industrial Ethernet equipment. A Gigabit Ethernet switch is a network-semiconductor device that receives Ethernet frames on one or more ports, examines Layer-2 information, and forwards frames to the appropriate destination ports. The VSC7511XMY belongs to the Ethernet switch hierarchy within interface ICs and is intended for compact embedded systems requiring multiple Gigabit Ethernet connections without a separate external switch chipset. Its four integrated copper PHYs simplify implementation because each port includes the physical-layer interface required for a copper Ethernet connection. Alternatively, the device supports four SGMII interfaces for systems that use serial SerDes connections rather than integrated copper ports. This flexibility permits one switching device to address multiple industrial networking architectures. The verified source material also identifies 1G/6G SerDes operation and hardware timestamping support for PTP-oriented equipment. The switch includes basic and advanced classifiers that determine frame properties such as VLAN membership, QoS class, and drop precedence. These classifications support policing, frame marking, statistics collection, security enforcement, Layer-2 forwarding, and frame rewriting. Such Layer-2 services make the device suitable for industrial gateways, automation controllers, communication equipment, and embedded network appliances where deterministic Ethernet behavior is valuable. Typical uses include industrial Ethernet switches, factory-floor gateways, programmable automation controllers, transport and infrastructure equipment, and embedded telecom or test systems. In each case, four integrated ports can reduce the number of external PHY devices while preserving Layer-2 switching throughput. The integrated-PHY configuration is particularly useful where board area and component count are constrained. Designers should confirm the exact pin assignments, exposed-pad connection, supported SGMII mode, clocking arrangement, and thermal-management requirements from the manufacturer datasheet before layout. Because this is a high-pin-count mixed-signal network IC, careful differential-pair routing, uninterrupted supply planes, solid grounding, and compliance testing for the intended copper Ethernet environment are essential. This page consolidates the verified distributor, manufacturer, and cross-reference information with practical application guidance, a parameter comparison, and explicit data-gap notes. It distinguishes verified VSC7511XMY capabilities from broader switch devices that are not confirmed as pin-to-pin replacements.

Angebot Kontakt