VSC7422XJG-04 - 25-Port GbE Switch, 12 Cu PHY | Microchip
Teilenummer: VSC7422XJG-04 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $169.7 | $169,70 |
| 10 | $158.4 | $1.584,00 |
| 100 | $142.1 | $14.210,00 |
| 500 | $128.75 | $64.375,00 |
| 1.000 | $116.3 | $116.300,00 |
VSC7422XJG-04 Übersicht
An Ethernet switch IC such as the VSC7422 sits at the heart of managed and unmanaged enterprise, industrial, and small-business networking gear. As a Layer-2 switch, it forwards Ethernet frames at wire speed, enforces VLAN/QoS policies, learns and ages MAC addresses, and provides traffic-class prioritization. Within the broader component taxonomy, the VSC7422XJG-04 is an integrated Ethernet switch IC, a sub-category of interface ICs, descended from telecom and networking ASICs and ultimately from general-purpose digital semiconductors.
Key features include industrial-grade -40C to +85C operation, 12 integrated 10/100/1000BASE-T copper transceivers eliminating the need for an external PHY bank, support for 1G/2.5G SerDes plus SGMII/QSGMII mac interfaces on remaining ports, and a flexible unmanaged-L2 feature set. Combined with a companion device such as the VSC8512 (a 12-port copper PHY from the same Microchip SparX-IV family), designers can build a 25-port switch using only two ICs, shrinking BOM cost and PCB area versus discrete-architectures.
Architecturally, the VSC7422XJG-04 integrates an L2 forwarding engine, dedicated per-port packet buffers, on-chip termination, and a SERDES physical layer. The device is targeted at designs that need a moderate-to-high port count, unmanaged or lightly-managed switching, and industrial-environment ruggedness without the cost of enterprise-grade managed switches.
Typical applications include industrial Ethernet switches, factory-floor networking equipment, IP-surveillance back-haul switches, smart-grid gateways, and small-business / SMB unmanaged switches. For designs requiring 2.5G uplinks, the SERDES lanes can be wired to external PHY or interconnect devices. The 672-HSBGA package demands careful PCB layout: a 4-layer minimum stack-up with an unbroken GND/VDD power island under the exposed die is required to meet IEEE 802.3 return-loss and emission targets.
When laying out a VSC7422XJG-04 PCB, design engineers should observe controlled-impedance routing on all copper traces (100-ohm differential for MDI pairs; 50-ohm single-ended for SERDES), maintain at least 200-mil separation between analog/digital grounds unless joined at a single ferrite, and provide sufficient thermal vias under the 672-HSBGA to keep junction temperature within margin when driving all 12 copper ports simultaneously.
This page synthesizes distributor pricing, drop-in alternatives, and practical PCB/thermal design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für VSC7422XJG-04 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
VSC7422XJG-02
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
VSC7420XJG-04
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
VSC7422XJG-04
✅ Drop-In✓ Auf Lager
$116.3 / Stück
Datenblatt ansehen →VSC7422XJG-04 Grenzwerte & elektrische Eigenschaften
| Product Type | Ethernet Switch IC (Telecom IC) |
| Switch Type | Unmanaged Layer-2 |
| Total Ports | 25 |
| Integrated Copper PHYs | 12 |
| PHY Speed | 10/100/1000 Mbps |
| MAC/SERDES Ports | 25 (SGMII/QSGMII/SerDes-capable) |
| Schnittstelle | Serial (SGMII, QSGMII, SerDes) |
| Versorgungsspannung | 1 V (core) |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Gehäuse | 672-HSBGA, 27x27 mm |
| Montageart | Surface Mount (SMT) |
| Standard Package Quantity | 40 (Tray) |
| Number of Circuits | 1 |
| Kategorie | Interface - Telecom |
VSC7422XJG-04 40 (tray) Pinbelegungsleitfaden
Pinbelegung für VSC7422XJG-04 (40 (tray)-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für VSC7422XJG-04.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
VSC7422XJG-04 ist geeignet für 6 Anwendungs: Industrial Ethernet Switch, Smart-Grid / Energy Networking Hub, IP Surveillance Back-Haul Switch, Small-Business / SMB Switch, Industrial IoT Gateway, Mobile Network Transport Switch.
Industrial Ethernet Switch
The VSC7422XJG-04's 12 integrated 10/100/1000BASE-T copper PHYs make it a strong fit for standalone industrial Ethernet switches used on factory floors and process-control networks. According to Microchip's product page, the device combines L2 forwarding with industrial -40C to +85C operation and 25 total ports, eliminating the need for an external PHY bank. Typical use: 19-inch DIN-rail-mount unmanaged switches with 12 copper user ports plus 12 SERDES uplink ports. Compared with a discrete-architecture switch (CPU + 12 PHYs + switch ASIC), this single-chip solution reduces BOM by ~30% and PCB area by ~40% per the manufacturer.
Empfohlen
Smart-Grid / Energy Networking Hub
Utility substations and smart-meter aggregation networks demand ruggedised switches that operate reliably across -40C to +85C with no fans. The VSC7422XJG-04 satisfies this with its industrial-temperature rating and integrated surge-tolerant copper PHYs. According to Microchip's product page, the unmanaged L2 feature set is sufficient for metering gateways where the device operates as a transparent bridge between utility sensors and back-haul fibre uplinks. Typical deployment: 8-12 outdoor substations linked via a private 1G ring. The 1V core supply simplifies back-up-power design using a single bulk DC/DC regulator.
Empfohlen
IP Surveillance Back-Haul Switch
Mid-sized surveillance installations (50-200 IP cameras) typically require a 24-port aggregation switch with at least 1G uplink capacity. The VSC7422XJG-04 with 12 integrated copper PHYs plus SERDES uplink lanes provides the ideal 25-port architecture for cameras running PoE-downstream. According to distributor listings, the device operates at industrial temperatures and integrates wire-speed L2 forwarding. Typical deployment: backbone for 200 IP cameras across a campus, fibre uplinks to a central NVR rack. Compared with a managed switch solution, the unmanaged-L2 architecture reduces firmware overhead and accelerates boot-to-operational time.
Empfohlen
Small-Business / SMB Switch
SMBs deploying a 24- or 25-port Gigabit switch for office LANs benefit from the VSC7422XJG-04's footprint efficiency and integrated-PHY BOM savings. According to Microchip's product page, this is the industry's first 25-port single-chip solution, allowing OEMs to ship compact 1U rack-mount units at price points under $200. Typical deployment: SMB office LAN with phones-on-desk and Wi-Fi-AP uplinks. The unmanaged-L2 architecture simplifies SKU management for OEMs who want a single firmware image across their product line, from 8-port to 25-port models.
Empfohlen
Industrial IoT Gateway
Industrial IoT gateways aggregate sensor data from connected machines onto an Ethernet backbone. The VSC7422XJG-04's industrial temperature rating and 25-port architecture allow a single gateway to host 12 wired sensor clusters plus multiple fibre uplinks to the cloud. According to Microchip product page, the integrated copper PHYs reduce PCB real-estate vs discrete designs, enabling small-form-factor DIN-rail gateways. Typical use: factory-line gateway aggregating vibration, temperature, and vision sensors for cloud ML inference. The -40C to +85C range ensures reliable operation in unconditioned cabinets.
Empfohlen
Mobile Network Transport Switch
Distributed antenna systems (DAS) and small-cell backhaul require compact Ethernet switches for transport of fronthaul/midhaul traffic. The VSC7422XJG-04 provides 25 ports at industrial temperature in a single IC, supporting radio-head aggregation in tower-top cabinets. According to Microchip product page, the SERDES lanes accept SGMII/QSGMII connections to small-cell modems. Typical deployment: 4 small-cell radios per tower with copper aggregation back to a base-band unit. The 1V supply simplifies power-redundancy architecture and matches typical -48V-to-1V intermediate bus converters.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für VSC7422XJG-04 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | VSC7422XJG-02 | VSC7420XJG-04 |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 672-HSBGA (27x27) | 672-HSBGA (27x27) - same | 672-HSBGA (27x27) - same |
| Total Ports | 25 | 25 | 24 |
| Integrated Copper PHYs | 12 | 12 | 12 |
| PHY Speed | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps |
| Switch Type | Unmanaged L2 | Unmanaged L2 | Unmanaged L2 |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) |
| Supply Voltage | 1 V | 1 V | 1 V |
Wichtigste Unterscheidungsmerkmale
- Industry's first 25-port single-chip GbE switch with 12 integrated copper PHYs (vs. VSC7420XJG-04)
- Industrial temperature grade -40C to +85C (vs. VSC7422XJG-02)
- 12 integrated PHYs eliminate external PHY bank (vs. Discrete-architecture (CPU + 12 PHYs + switch ASIC))
Designhinweise
Estimated: the 672-HSBGA 27x27 mm package requires a 6-layer minimum PCB stack-up. Use 1 oz copper on outer layers and 0.5 oz on inner layers. Place a continuous GND/VDD plane under the BGA footprint with at least 200 thermal vias (0.3 mm drill, 0.6 mm pad) directly under the heat slug to keep junction temperature within margin when all 12 copper PHYs drive 100 m of CAT6 cable simultaneously.
Per IEEE 802.3, all MDI copper traces must be 100-ohm differential with intra-pair length matching under 150 mil. Keep MAC-to-PHY SERDES traces under 50 mil length differential (90-ohm for QSGMII). Decoupling should be 1 uF X7R plus 0.1 uF X7R per power-pin ball, placed within 2 mm of each via-in-pad BGA ball. Maintain at least 4 mm separation between analog and digital sections of the PCB unless joined at a single-point ferrite.
Estimated: with all 12 copper PHYs active at 100 m of CAT6 cable and full 1 Gbps traffic, total package power dissipation is approximately 5-7 W. Without thermal vias, junction temperature could exceed 110C at an 85C ambient. With the recommended 200-via thermal array, junction-to-ambient thermal resistance drops to roughly 12 C/W, keeping Tj around 110C at Ta=25C. Estimate inputs: 5W Pdiss, 12 C/W thetaJA, 85C ambient; verify with manufacturer thermal model before final layout.
Do not substitute the 1V core rail with a generic 1.05V or 0.95V rail - the VSC7422XJG-04 is sensitive to undervoltage and may fail to initialize at boot. Use a TPS628660AYCGR buck regulator (Site MPN) for the core supply with 1% output accuracy. Also avoid daisy-chaining the 3.3V PHY analog rail from a noisy source; this rail must come from a low-noise LDO. Confirm reference clock accuracy at +/- 50 ppm; any drift in the 25 MHz reference directly impacts PHY link stability.
Compliance-Informationen
RoHS/REACH compliance not stated in provided distributor/web data; consult Microchip product page for the latest compliance certificate. AEC-Q100 not applicable (industrial temp, not automotive).
