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XC3S400-4FG320I - 400K Gate Spartan-3 FPGA | Xilinx
XC3S400-4FG320I

XC3S400-4FG320I - 400K Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S400-4FG320I is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, 294,912 RAM bits, and 221 user I/Os, packaged in a 19 mm × 19 mm 320-pin fine-pitch ball grid array. It operates from a 1.2 V core supply and is identified by the -4 performance grade and I industrial temperature designation. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor in which digital logic and interconnects are programmed after manufacture. An FPGA belongs to the programmable-logic hierarchy, which combines parallel gate-level logic, block RAM, programmable I/O, and embedded processing resources. This combination allows one physical device to implement control logic, protocol interfaces, data acquisition, signal processing, or complete embedded systems without changing the printed circuit board. The XC3S400 provides 221 user I/Os for external buses, counters, serial links, memory interfaces, and mixed-signal control functions. Its 294,912 bits of block RAM support buffering, packet storage, lookup tables, and data-pipeline stages, while the -4 speed grade identifies its position within the Spartan-3 performance range. The industrial I suffix distinguishes it from commercial-temperature C variants. The 320-ball FBGA offers dense board connectivity but requires careful escape-routing, thermal analysis, and assembly control. Spartan-3 devices combine dedicated arithmetic and logic resources with programmable interconnect and a large selection of I/O standards. The 8,064 logic cells allow concurrent datapath and control operations, while block RAM avoids extensive use of logic for storage-heavy functions. Because the I/O count is fixed at 221 for the XC3S400, system planning must reserve enough pins for clocks, configuration access, power, ground, and high-speed interfaces. Typical uses include industrial automation, programmable logic controllers, sensor acquisition, motor-control interfaces, embedded communications, test equipment, and cost-sensitive control systems. The FPGA is especially useful where parallel logic, deterministic timing, configurable I/O, and field-updateable firmware must coexist in a compact package. Its 1.2 V core supply also allows modern low-voltage designs to consolidate multiple logic functions. PCB implementation should use the manufacturer's pinout and recommended layout guidance rather than a generic BGA fanout. Decoupling must be placed directly at the supply and ground balls, unused configuration pins must be handled exactly as specified, and every power ball must connect to the appropriate plane or via array. The high pin count also makes inspection, solderability, and thermal cycling important production considerations. This page combines the device's principal architecture and package data with same-family migration options, application guidance, and design checks. It focuses on the decisions that materially affect a Spartan-3 design: logic capacity, RAM, I/O availability, speed grade, temperature grade, package migration, configuration stability, and PCB implementation.

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XC3S400-4FG456C - 400K Spartan-3 FPGA | AMD Xilinx
XC3S400-4FG456C

XC3S400-4FG456C - 400K Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S400-4FG456C is a Spartan-3 field-programmable gate array with 400,000 system gates, 294,912 logic cells, 8,064 dedicated block RAM bits, 264 I/O sites, and a 456-BBGA package. It operates from a 1.2 V core supply and targets logic-intensive embedded systems requiring programmable combinational and sequential logic, dedicated memory, and a large general-purpose I/O complement. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. The XC3S400 belongs to the Spartan-3 FPGA hierarchy, which combines configurable logic, block RAM, programmable I/O, and dedicated arithmetic resources on one device. This position between fixed-function ASICs and microcontrollers makes it suitable when a design needs hardware-level parallelism, flexible interfaces, or product-specific logic that would be expensive to implement in silicon. The -4 designator identifies a Spartan-3 performance grade, while FG456 identifies the 456-ball fine-pitch BGA package and C identifies the commercial temperature designation. The 456-BBGA footprint supports a high pin count and dense board routing, making the device appropriate for industrial control, communications, instrumentation, embedded processing, and legacy platform designs that already use the Spartan-3 package. Its large I/O count can reduce the need for external interface logic when connecting the FPGA to buses, converters, memories, and control signals. The device includes 294,912 logic cells and 8,064 bits of dedicated block RAM. These resources allow parallel datapaths, state machines, protocol handling, data acquisition, and control functions to be implemented concurrently rather than executed sequentially by a general-purpose processor. Programming is performed through the Xilinx configuration flow, while the final configuration determines which interconnect and logic resources are active. Designers should preserve the exact 456-BBGA land pattern, power architecture, decoupling strategy, configuration interface, and I/O constraints when replacing another programmable device. Because this package contains many fine-pitch balls, assembly and inspection require qualified PCB manufacturing processes and appropriate BGA assembly capability. Any modernization should begin with a pin, configuration, I/O-standard, and timing comparison rather than assuming that a newer FPGA is automatically interchangeable. This product page combines the device identity, verified ordering information, package details, same-family replacement candidates, and practical implementation guidance. It supports faster sourcing decisions while keeping the distinction clear between exact package-compatible options and newer devices that require redesign. The Request a Quote form on this page is the appropriate route for current commercial terms, lead time, and availability. Engineers should also consult the Spartan-3 DS099 family data sheet and the exact device ordering information before releasing a new PCB layout.

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XC3S400-4FG456I - 400K Gate Industrial Spartan-3 FPGA | AMD
XC3S400-4FG456I

XC3S400-4FG456I - 400K Gate Industrial Spartan-3 FPGA | AMD

AMD XC3S400-4FG456I is an industrial-grade Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, and 264 user I/Os, packaged in a 456-ball FBGA. It uses 90 nm fabrication technology, supports a 1.14 V to 1.26 V core supply, and is specified for an industrial junction-temperature range of -40°C to +100°C. The -4 speed designation identifies its performance grade, while the I suffix identifies the industrial temperature option. A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor that combines programmable logic, flip-flops, memory blocks, and programmable I/O in one device. An FPGA belongs to the broader semiconductor and programmable-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed during development to implement control logic, interfaces, signal processing, and system functions without changing the printed circuit board. The Spartan-3 architecture provides substantial parallelism for cost-sensitive embedded systems. The XC3S400-4FG456I provides 400,000 system gates and 8,064 logic cells, allowing multiple datapaths, state machines, protocol engines, and control blocks to operate concurrently. Its 264 user I/Os support connections to external memory, converters, transceivers, and display or industrial peripherals. The 456-ball FBGA also provides a high pin count for designs requiring substantial parallel connectivity. Operating from a 1.14 V to 1.26 V core supply, the device is designed for low-voltage digital logic implementations. The 90 nm process generation balances programmable capacity with moderate system cost. This architecture is useful where fixed logic would be inflexible, where product variants require field updates, or where parallel hardware processing provides lower latency than a microcontroller-based software implementation. Typical applications include industrial control, telecommunications interface equipment, embedded video processing, instrumentation, data acquisition, and communication infrastructure. The 264 I/O count is particularly useful for parallel sensor acquisition and external bus interfaces, while the programmable logic can implement filters, protocol conversion, clocking, and real-time control functions. Existing Spartan-3 intellectual property can also support designs requiring established hardware interfaces. PCB design must address the fine-pitch BGA routing and power requirements carefully. Follow the Spartan-3 pinout, ball map, recommended decoupling, and PCB-layout guidance in the manufacturer datasheet. Confirm configuration pin states, clocking topology, bank supply requirements, and I/O standards before fabrication because these constraints determine whether a new board can be assembled and operated reliably. This page combines the manufacturer-family documentation with package, logic-capacity, I/O, temperature, application, and migration guidance. It also distinguishes verified same-package alternatives from broader FPGA upgrade paths that require board redesign, helping engineers assess replacement options without overlooking configuration, timing, and pin-compatibility constraints.

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XC3S400-4FT256C - 400K Gate Spartan-3 FPGA | AMD
XC3S400-4FT256C

XC3S400-4FT256C - 400K Gate Spartan-3 FPGA | AMD

AMD XC3S400-4FT256C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 configurable logic cells, 173 I/O, and a 1.2 V core supply, housed in a 256-LBGA package. The -4 suffix identifies the performance grade, while FT256 identifies the 256-ball surface-mount package offered in the verified distributor records. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, embedded memory, dedicated hard multipliers, and clock-management resources. This makes the Spartan-3 family useful when engineers need hardware-level parallelism, rapid design changes, or compact implementation of complex digital systems without committing to a custom application-specific integrated circuit. The verified listing identifies 400,000 system gates and 8,064 logic cells for the XC3S400 device. It provides 173 I/O in a 256-LBGA package and uses a 1.2 V core voltage. Related Spartan-3 data identifies 90 nm fabrication technology and a 630 MHz figure for the XC3S400-4FTG256C comparison variant; those values should not be transferred to XC3S400-4FT256C without confirmation from its own manufacturer datasheet. The device is suitable for parallel data processing, custom interface control, embedded signal processing, communications infrastructure, test equipment, and industrial control systems. Its 173 I/O permit substantial board-level connectivity, while the 8,064-cell logic resource supports parallel datapaths and state machines. The FT256 package can also simplify component density compared with larger leaded packages, but it requires careful PCB layout, thermal analysis, and BGA assembly capability. The commercial -4 grade is intended for cost-optimized designs rather than the extreme operating range implied by an industrial temperature suffix. Before releasing a design, engineers should verify the exact I/O standards, supported memory interfaces, configuration requirements, power-up behavior, and package pinout against the manufacturer documentation for XC3S400-4FT256C. A critical design consideration is that the FT256 package requires exact land-pattern, solder-mask, paste, via, and assembly-process control. Power rails and decoupling should be implemented according to the manufacturer's guidance, while configuration and programming interfaces should be checked for signal-integrity and termination requirements before layout signoff. This page consolidates verified distributor pricing, same-footprint Spartan-3 alternatives, application guidance, and design cautions that are not presented together on a manufacturer product page. It also distinguishes confirmed target-device facts from parameters that remain unavailable in the supplied source data.

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XC3S400-4FT256I - 400K Gates Spartan-3 FPGA | Xilinx
XC3S400-4FT256I

XC3S400-4FT256I - 400K Gates Spartan-3 FPGA | Xilinx

The Xilinx XC3S400-4FT256I is a Spartan-3 field-programmable gate array providing 400,000 system gates, 8,064 logic cells, and 173 user I/Os in a 256-ball FTBGA package. The device operates from a 1.14 V to 1.26 V core supply, uses 90 nm process technology, and is specified for industrial-temperature operation from 0 °C to 85 °C. Its -4 speed grade supports operation up to 630 MHz according to the compared manufacturer-family specification in the provided web data. A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured after fabrication. The Spartan-3 family belongs to the FPGA and programmable-logic hierarchy, providing configurable logic resources rather than a fixed instruction set. The XC3S400-4FT256I is intended for designs requiring substantial parallel logic, control, communications, or signal-processing functions while using a single highly integrated package. The main device characteristics include 400,000 system gates, 8,064 logic cells, 173 user I/Os, a 256-ball FTBGA package, and a 1.2 V nominal core supply. The listed family comparison identifies 90 nm technology and a 630 MHz performance figure for the XC3S400-4FT256I. Its industrial temperature range and lead-free package information make it relevant to industrial control, communications equipment, and embedded systems, although current availability and lifecycle status should be confirmed before new production commitments. The FTBGA package provides a dense connection arrangement for high-density programmable-logic designs. The 173 user I/Os can be assigned to digital interfaces, control signals, communications links, or mixed external circuitry, while the FPGA fabric allows parallel functions to be implemented with deterministic hardware timing. Unlike a microcontroller with a fixed peripheral architecture, the XC3S400-4FT256I allows system functions and interfaces to be defined during configuration, making it suitable for custom protocols, accelerators, and legacy system control logic. Typical applications include industrial automation controllers, communications equipment, embedded control systems, test and measurement platforms, and signal-processing modules. In these systems, the FPGA can implement parallel interfaces, protocol conversion, timing and sequencing functions, and custom hardware processing. The 400,000-system-gate density is substantially larger than small CPLDs, supporting multi-module designs while keeping the implementation in one programmable device. The primary design consideration is package-level integration. A 256-ball FTBGA requires careful PCB layout, via and escape-routing planning, thermal management, and assembly-process control. The core supply and I/O supply requirements, configuration interface, clocking, decoupling, and termination must follow the Spartan-3 device documentation. Because the XC3S400-4FT256I is associated with a discontinued-product notice in the provided AMD support result, engineers should preserve the exact MPN in legacy designs and evaluate any replacement against pinout, voltage, timing, and configuration compatibility. This product record combines verified distributor and manufacturer-search information with practical design guidance for industrial FPGA implementations. It highlights the density, logic-cell count, I/O count, package, voltage, temperature range, and source links while clearly separating confirmed data from specifications that require confirmation from the manufacturer datasheet.

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XC3S400-4FTG256C - 400K Gate Spartan-3 FPGA | AMD | 256-LBGA
XC3S400-4FTG256C

XC3S400-4FTG256C - 400K Gate Spartan-3 FPGA | AMD | 256-LBGA

The AMD XC3S400-4FTG256C is a Spartan-3 field-programmable gate array FPGA with 400,000 system gates, 8,064 logic cells, and a 256-LBGA package. It operates from a 1.2 V core supply and is specified for a 0 to 85 °C commercial operating-temperature range. The device combines programmable logic, block RAM, dedicated input/output resources, and configurable interconnect resources in a single integrated circuit. A field-programmable gate array is a digital semiconductor whose logic functions are established after fabrication by loading a configuration bitstream. FPGAs sit within the broader programmable-logic hierarchy, alongside CPLDs, and are used when parallel hardware processing, high logic density, configurable interfaces, or design revision flexibility are more important than the simplicity of a fixed-function ASIC. The Spartan-3 architecture is intended for embedded systems requiring moderate logic capacity without the cost and complexity of the largest FPGA families. The XC3S400-4FTG256C provides 8,064 logic cells and 294,912 system gates according to the manufacturer-related product listing. Its 256-LBGA package supports dense board integration, while the 1.2 V supply specification identifies it as a 1.2 V FPGA. The exact device speed grade is encoded by the -4 designation, and the FTG256 package, commercial temperature option, and RoHS-oriented lead-free construction are reflected in the ordering code. Typical uses include industrial control, communications infrastructure, instrumentation, video processing, embedded systems, and digital signal-processing front ends. The programmable architecture allows parallel datapaths, custom interface logic, protocol handling, and control functions to be consolidated into one device. Designers should verify pin-level power, configuration, clock, and differential-I/O requirements against the Spartan-3 family documentation before laying out the PCB. The most important design tradeoff is package migration. A part with the same logic-cell count but a different package cannot be assumed to be a drop-in replacement. When replacing the XC3S400-4FTG256C, confirm the exact FTG256 footprint, ball assignment, speed grade, temperature range, supply architecture, configuration interface, and high-speed I/O requirements. For new designs, the I/O count and selected package should be checked against the intended board outline and escape-routing strategy. This page combines the key ordering information for the XC3S400-4FTG256C with package-aware replacement guidance, comparison parameters, and practical design considerations. It is intended to help engineers identify whether a candidate is electrically and mechanically suitable before committing to a PCB or production BOM.

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XC3S400-4PQ208I - 400K Gate Spartan-3 FPGA | AMD | Industrial
XC3S400-4PQ208I

XC3S400-4PQ208I - 400K Gate Spartan-3 FPGA | AMD | Industrial

AMD XC3S400-4PQ208I is a Spartan-3 Field Programmable Gate Array (FPGA) IC with 400000 system gates, 8064 logic cells, 141 inputs/outputs, a 630 MHz maximum clock frequency, 1.2 V supply voltage, and 90 nm FPGA technology. The device is packaged in a 208-BFQFP lead-free package and is identified with the -4 speed grade and I industrial temperature designation. It belongs to the Spartan-3 FPGA family, a cost-optimized programmable-logic platform used to combine parallel processing, control logic, interfaces, and programmable digital functions in a single device. The XC3S400 is positioned between smaller Spartan-3 devices and larger members of the family, providing substantial logic capacity without requiring the largest packages. The -4 suffix denotes the device speed grade, while the I suffix identifies the industrial temperature option according to the supplied distributor and product-search data. The 208-pin package exposes more I/O than smaller 144-pin alternatives and is suitable for designs requiring multiple external interfaces, memory connections, clocks, and control signals. The 1.2 V core supply and 90 nm process place this device in the conventional low-voltage Spartan-3 generation. Typical implementation uses Xilinx ISE or a compatible FPGA design flow, configuration memory, JTAG boundary-scan access, and board-level decoupling. Designers should verify the complete pinout, configuration requirements, clocking limits, I/O standards, and power sequencing against the manufacturer datasheet before layout or firmware release. This page consolidates the verified distributor specifications, sourcing links, package information, and engineering considerations for the XC3S400-4PQ208I.

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XC3S400-4TQ144C - 400K Gate Spartan-3 FPGA | AMD
XC3S400-4TQ144C

XC3S400-4TQ144C - 400K Gate Spartan-3 FPGA | AMD

AMD XC3S400-4TQ144C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, 97 I/Os, and a 1.2 V core supply in a 144-pin TQFP package. The -4 speed grade is intended for designs requiring the specified Spartan-3 performance class, while the C suffix identifies the commercial operating-temperature option documented by the available product data. An FPGA is a programmable logic device within the broader semiconductor and digital-logic hierarchy. Unlike a fixed-function ASIC, an FPGA combines configurable logic, programmable routing, dedicated input/output resources, and embedded memory blocks on one device. This lets engineers revise digital architectures through configuration files instead of redesigning and fabricating custom silicon, making FPGAs useful for prototypes, industrial controllers, communication systems, and embedded signal-processing equipment. The Spartan-3 architecture provides 8,064 logic cells for implementing sequential and combinational functions. The device also includes 97 I/Os and 294,912 bits of block RAM, according to the DigiKey listing. A 1.2 V core operating voltage suits modern low-voltage digital designs, while the TQFP-144 package provides 144 leads for external power, configuration, clock, and user-interface connections. The part belongs to the Spartan-3 family, which combines programmable logic with dedicated multipliers, block RAM, and clock-management resources. Those blocks allow designers to implement parallel data paths, packet-processing pipelines, control logic, and memory-intensive functions without relying on external discrete logic. The commercial-temperature C-grade designation supports product designs operating from 0 °C to 85 °C when all specified electrical and environmental limits are observed. Typical uses include industrial automation, communication equipment, embedded control, test and measurement, video and image processing, and general-purpose digital prototyping. The 97 available I/Os are particularly useful for parallel buses, counters, status signals, memory interfaces, and communication links. Designers should account for configuration startup behavior, clocking, decoupling, and I/O-standard requirements when planning the surrounding PCB. For a new board, place all supply pins and their associated decoupling capacitors according to the manufacturer layout guidance, keep sensitive clock and configuration routing away from noisy digital nets, and validate every interface voltage against the selected I/O standard. Existing XC3S400 TQFP-144 designs should compare device speed grade, temperature grade, package drawing, configuration interface, and supply requirements before selecting a replacement. This page consolidates verified distributor information, same-family drop-in alternatives, commercial availability data, and practical migration guidance. It is intended to accelerate component identification and sourcing without presenting unverified package details or unsupported cross-brand substitutions as drop-in replacements.

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XC3S400-4TQ144I - 400K Gate Industrial Spartan-3 FPGA | AMD
XC3S400-4TQ144I

XC3S400-4TQ144I - 400K Gate Industrial Spartan-3 FPGA | AMD

AMD XC3S400-4TQ144I is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, 294,912 bits of embedded RAM, and 97 user I/Os in a 144-pin TQFP package. It operates from a 1.2 V core supply and is manufactured using a 90 nm process. The -4 suffix identifies one of the Spartan-3 performance grades, while the I suffix identifies the industrial-temperature ordering option. The TQFP-144 package provides a surface-mount form factor for systems requiring moderate logic density, dedicated block RAM, and programmable digital interfaces without the cost or complexity of a larger FPGA. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O behavior are configured after fabrication. In the product hierarchy, an FPGA sits above programmable logic devices and provides parallel combinational logic, sequential logic, block RAM, programmable I/O, and clocking resources. The Spartan-3 architecture is intended for cost-sensitive embedded applications in which designers need configurable hardware without developing a custom ASIC. Verified product data identifies 400,000 system gates, 8,064 logic cells, 294,912 RAM bits, and 97 user I/Os for XC3S400-4TQ144I. The listed maximum operating frequency is 630 MHz, and the device uses 1.2 V core technology. These resources make it suitable for control logic, communications interfaces, industrial automation, test equipment, embedded signal processing, and general-purpose programmable system functions. The 144-pin package balances external connectivity against board-space requirements. The -4 performance designation makes this device appropriate for designs that prioritize cost and power efficiency over the fastest available Spartan-3 grade. Its 8,064 logic cells and block RAM can support parallel datapaths, state machines, protocol handling, and control functions. Exact clock-rate, I/O-standard, and timing-budget conclusions should be based on the manufacturer datasheet and the selected I/O implementation rather than inferred solely from the maximum frequency listed by a distributor. Typical applications include industrial controller logic, data-acquisition front ends, communications bridges, embedded test systems, and compact control platforms. In these systems, the FPGA can implement parallel interfaces and state machines while offloading deterministic tasks from a microcontroller. The 97 available user I/Os are particularly useful for legacy parallel buses, control signals, status indicators, and external memory or peripheral connections. Designers should verify the exact bank supply voltages, supported I/O standards, configuration method, pinout, and timing constraints in the manufacturer datasheet before layout release. The TQFP package also requires attention to thermal dissipation and lead co-planarity. Configuration storage, clocking, decoupling, and JTAG access must be planned so that the device can be programmed and debugged in production without board rework. This page combines verified distributor specifications, official-product search results, same-family replacement options, package-level comparison data, and practical design guidance. It distinguishes confirmed parameters from unavailable details instead of filling gaps with assumed values, helping engineers select, compare, source, and implement the XC3S400-4TQ144I with greater confidence.

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XC3S400-5FG320C - 400K Gate Spartan-3 FPGA | AMD
XC3S400-5FG320C

XC3S400-5FG320C - 400K Gate Spartan-3 FPGA | AMD

The AMD XC3S400-5FG320C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 configurable logic cells, 221 I/O sites, and operation up to 725 MHz, housed in a 320-ball fine-pitch BGA package. The device combines programmable logic, dedicated memory resources, and selectable I/O resources in a single CMOS device. Its 1.2 V core voltage and 90 nm fabrication process identify it as a cost-optimized FPGA for embedded systems where deterministic digital logic is more important than the very high performance of modern application processors. An FPGA is a semiconductor whose digital behavior is defined after manufacture by loading a configuration bitstream into on-chip configuration memory. In the device hierarchy, the XC3S400-5FG320C is a Spartan-3 FPGA, a programmable-logic device within the broader FPGA and semiconductor categories. Unlike a fixed-function microcontroller or application-specific IC, an FPGA can implement parallel data paths, state machines, protocol controllers, and custom interfaces while retaining upgradeability through field reconfiguration. The principal resource figures are 400,000 system gates, 8,064 logic cells, and 221 I/O sites. The manufacturer documentation index identifies a maximum performance figure of 725 MHz for this ordering code. The 320-ball FBGA package supports dense PCB routing and is intended for space-constrained embedded equipment rather than breadboard-based prototyping. Configuration storage, configuration pin functions, and complete ball assignments should be taken from the Spartan-3 pinout and configuration documentation before a PCB is released. The -5 portion of the ordering code identifies the device speed grade, while the C suffix identifies the commercial temperature grade. The target therefore differs from lower-speed or industrial-temperature variants in timing qualification and operating-temperature class, although the logical architecture and 320-ball package remain compatible. Because Spartan-3 devices rely on configuration memory, the power-up behavior, configuration source, bitstream integrity, and startup timing must be included in the complete system design rather than treated as firmware-only concerns. Typical uses include industrial control and automation, communication protocol conversion, data acquisition, embedded video, instrumentation, and general-purpose digital signal processing. Parallelizable tasks such as bus arbitration, packet filtering, sensor conditioning, or control-law execution can be implemented as parallel hardware logic. A microcontroller may still be preferable for complex operating-system software, while an FPGA is advantageous when deterministic response, custom I/O, or post-deployment logic updates justify programmable hardware. For a new design, first verify that every available ball, supply rail, decoupling requirement, configuration interface, and supported I/O standard is compatible with the selected board revision. Preserve the manufacturer's recommended power sequencing, use a configuration scheme that produces a valid startup state, and validate timing with the actual board-level clock and external interfaces. Do not treat a faster speed-grade substitute as automatically equivalent without rerunning timing analysis for the installed design. This product record combines the verified device identifiers, package and logic-resource details, speed-grade comparisons, sourcing guidance, and practical migration considerations. It is intended to help engineers distinguish electrically similar orderings from true PCB-compatible replacements while focusing attention on the timing, temperature, configuration, and qualification differences that determine whether a substitution is production-safe.

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XC3S400-5FG456C - 400K Gate Spartan-3 FPGA | AMD
XC3S400-5FG456C

XC3S400-5FG456C - 400K Gate Spartan-3 FPGA | AMD

The AMD XC3S400-5FG456C is a Spartan-3 field-programmable gate array containing 400,000 system gates and 8,064 configurable logic cells in a 456-ball fine-pitch ball grid array package. The device operates from a 1.2 V core supply, uses 90 nm fabrication technology, and supports performance ratings up to 725 MHz. It provides 264 I/O sites, making it suitable for designs that combine substantial parallel logic, embedded memory, and external interfaces on one programmable device. A field-programmable gate array, or FPGA, is a semiconductor whose digital functions are defined by a user-loaded bitstream rather than a fixed mask used for an application-specific integrated circuit. Within the product hierarchy, the XC3S400-5FG456C is an FPGA, a programmable-logic semiconductor, and a member of the AMD Spartan-3 family. This positioning makes it useful for prototypes, embedded control systems, industrial equipment, communications interfaces, and other designs that benefit from hardware flexibility, short development cycles, and field reconfiguration. Principal features include 400,000 system gates, 8,064 logic cells, 264 I/O sites, a 456-ball FBGA package, and a 725 MHz performance rating. The 1.2 V operating supply corresponds to the device's low-voltage internal core. Spartan-3 devices support configurable logic, block RAM, dedicated multipliers, digital clock management, and programmable I/O resources. Designers use these resources for parallel datapaths, control state machines, data acquisition, packet processing, and interface bridging. The XC3S400-5FG456C combines a 456-ball package with approximately 264 user I/O sites. This high pin count supports memory-intensive and interface-heavy systems, but it also requires careful escape routing, multilayer PCB construction, and controlled-impedance signal integrity. The -5 speed suffix identifies the device's performance grade, while the commercial-temperature designation supports general industrial and commercial implementations when the complete system thermal environment remains within the specified limits. Typical applications include industrial automation controllers, data-acquisition and signal-processing systems, communications infrastructure, embedded video or imaging control, test equipment, and custom accelerator logic. In these systems, the FPGA can execute parallel algorithms, manage multiple external buses, and adapt its behavior through configuration updates without changing the printed circuit board. A key design consideration is that software migration is not automatically compatible across speed grades, package markings, or Spartan-3 device families. A replacement should be checked against the package ball map, voltage requirements, I/O standards, configuration interface, and timing constraints. The manufacturer DS099 Spartan-3 family datasheet should be used to validate the selected device, pinout, electrical limits, and configuration requirements. This product page combines the manufacturer family documentation with package, resource, interface, and replacement information intended to accelerate engineering evaluation. It also distinguishes speed-grade alternatives from industrial or package-marked variants, helping designers identify a candidate that matches the original PCB while recognizing any temperature, timing, or qualification differences that must still be reviewed before production release.

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XC3S400-5FT256C - 400K Spartan-3 FPGA | AMD
XC3S400-5FT256C

XC3S400-5FT256C - 400K Spartan-3 FPGA | AMD

The AMD XC3S400-5FT256C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, 173 I/O, and a 1.2 V core supply in a 256-LBGA package. It belongs to the Spartan-3 family of programmable logic devices, combining configurable logic, block RAM, dedicated I/O, and programmable interconnect resources in one surface-mount device. A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor used to implement logic functions through downloadable configuration data. In the product hierarchy, an FPGA is a programmable logic device and a semiconductor. Compared with application-specific integrated circuits, an FPGA permits design changes without fabricating a new ASIC, making it useful for prototypes, industrial control, communications, instrumentation, and embedded systems that require parallel processing or flexible I/O. The XC3S400-5FT256C provides 294,912 configuration bits according to the device listing, 8,064 logic cells, 173 I/O, and 400,000 system gates. Its -5 speed designation identifies the performance grade, while the C suffix denotes the commercial temperature option. A 725 MHz internal clock speed is listed for this device. These resources allow moderately complex control logic, parallel data processing, state machines, and peripheral interfacing to be consolidated in a compact package. The device uses a 1.2 V core supply and a 256-lead low-profile ball grid array package. The Spartan-3 architecture combines programmable logic and routing with dedicated hard resources that reduce the amount of general-purpose logic needed for memory-intensive and high-speed interface designs. Exact RAM capacity, supported I/O standards, configuration-memory organization, and pin-level functions must be confirmed in the manufacturer datasheet before a board is released. Typical uses include industrial automation controllers, data-acquisition systems, communication interfaces, video-processing pipelines, instrumentation, and embedded control platforms. The 173 available I/O make the device suitable for designs combining multiple buses, status signals, counters, and serial links. For systems requiring more parallel data paths, designers can also evaluate larger devices in the same family or migrate to a newer FPGA architecture when board area and power budgets permit. PCB implementation requires careful attention to the 256-ball footprint, power rails, decoupling, configuration interface, and high-speed routing. Place decoupling capacitors close to the supply and ground balls, route configuration signals away from sensitive inputs, and follow the manufacturer layout and pinout guidance. A complete 256-pin assignment cannot be reproduced reliably without the package pin table, so the datasheet should remain the controlling document during schematic and layout review. This page combines the exact XC3S400-5FT256C device identifiers, verified distributor technical summaries, package and pinout guidance, a practical same-footprint alternative, and engineering notes for programming, layout, migration, and sourcing. It is intended to accelerate initial engineering decisions while directing final component and pin decisions to the manufacturer documentation.

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XC3S400-5PQ208C - 400K Gate Spartan-3 FPGA | Xilinx
XC3S400-5PQ208C

XC3S400-5PQ208C - 400K Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S400-5PQ208C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 configurable logic cells, and 141 I/O sites in a 208-pin PQFP package. The device operates from a 1.2 V core supply and is associated with a 725 MHz device speed rating, making it suitable for embedded logic, control, communications, and general-purpose programmable systems. Its commercial-temperature designation indicates operation from 0°C to 85°C according to the available distributor specifications. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic can be configured after fabrication. FPGAs sit above programmable logic devices in the hardware hierarchy and combine configurable logic blocks, programmable interconnect, input/output blocks, and embedded memory resources. The Spartan-3 architecture uses a 90 nm process and provides a substantial logic capacity while using a conventional 208-pin PQFP surface-mount package, avoiding the larger ball-grid-array footprints used by many comparable devices. The XC3S400-5PQ208C provides 8,064 logic cells, 400,000 system gates, and 141 I/O. The -5 suffix identifies the device speed grade, while PQ208 identifies the 208-pin PQFP package. The available component listings also identify the device as lead-free and classify the package as 208-BFQFP. Exact core-voltage tolerances, configuration-memory organization, I/O standards, and recommended decoupling values were not supplied in the verified data and therefore are not inferred here. Typical applications include industrial control and automation, embedded instrumentation, communications gateways, digital signal-processing front ends, and general-purpose logic consolidation. The 141 I/O sites allow the FPGA to interface with parallel data buses, control signals, clocks, and external memory, while the 8,064 logic cells support state machines, protocol handling, data formatting, and arithmetic logic. Designers should assess clock-rate requirements carefully because a faster internal fabric does not guarantee that an external interface meets its specified timing. For a new PCB, the key design consideration is package-level planning. The 208-pin PQFP footprint requires adequate escape routing, exposed via access, and careful decoupling around the 1.2 V supply. A finished Spartan-3 design must also include a supported configuration path and a valid bitstream generated for the exact device, speed grade, and package identifier. Legacy software support should be verified before committing the part to a long-lived production program. This page consolidates verified distributor specifications, same-package replacement information, package and sourcing constraints, and engineering selection guidance. It also distinguishes directly compatible PQ208 alternatives from FG320 options that require a different PCB footprint, helping prevent a functionally similar FPGA from being mistaken for a true drop-in replacement.

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XC3S400-5TQ144C - 400K Gate Spartan-3 FPGA | Xilinx
XC3S400-5TQ144C

XC3S400-5TQ144C - 400K Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S400-5TQ144C is a Spartan-3 field-programmable gate array with 400,000 system gates, a 1.2 V supply, and a 144-pin LQFP package. It is designed for programmable-logic applications requiring a balance of logic capacity, embedded block RAM, digital I/O, and device availability in a compact surface-mount package. The commercial temperature designation indicates operation from 0°C to +85°C according to the verified distributor specifications. The “-5” suffix identifies the device speed grade, while “TQ144C” identifies the 144-lead package and commercial grade. As an FPGA, the XC3S400-5TQ144C combines configurable logic blocks, programmable interconnect, block RAM, dedicated input/output resources, and embedded processor capabilities in a single semiconductor device. It belongs to the hierarchy FPGA > programmable logic device > digital semiconductor. Unlike a fixed-function application-specific integrated circuit, its internal functions are established through a configuration bitstream, allowing one device to implement multiple control, interface, arithmetic, and signal-processing functions. The verified distributor information identifies the component as a 400,000-system-gate Spartan-3 FPGA operating at 1.2 V in a 144-LQFP package. Its 144-pin surface-mount format is suitable for compact industrial, communications, control, and embedded-processing systems where larger BGA packages would be impractical. The active-low configuration pins, dedicated configuration resources, clock-management capabilities, and distributed and block RAM allow designers to implement parallel data paths and stateful control logic without combining numerous discrete devices. System timing should be evaluated against the -5 speed grade, the selected I/O standard, the external clock architecture, and the specific Spartan-3 family documentation. An LCSC result lists the XC3S400-5TQ144C as in stock with a price from $17.8523, making current supply and price useful differentiators. This page combines verified distributor specifications, price information, package details, practical design guidance, and strictly drop-in replacement candidates. It also separates confirmed values from engineering data that still requires manufacturer-documentation verification.

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XC3S4000-4FG676I - 4M Gate Spartan-3 FPGA, 676-BGA | AMD
XC3S4000-4FG676I

XC3S4000-4FG676I - 4M Gate Spartan-3 FPGA, 676-BGA | AMD

The AMD Xilinx XC3S4000-4FG676I is a Spartan-3 field-programmable gate array with 4 million system-gate equivalents, 62,208 logic cells, 489 I/O lines, and 1,769,472 RAM bits in a 676-ball fine-pitch BGA package. It is designed for cost-sensitive, high-volume embedded systems requiring substantial programmable logic in a single device. A field-programmable gate array is a digital integrated circuit whose logic, interconnect, and configurable I/O are programmed after manufacture. Within the product hierarchy, an FPGA belongs to programmable logic devices and is broader than a fixed-function application-specific integrated circuit. The Spartan-3 architecture combines configurable logic blocks, distributed and block RAM, dedicated multipliers, and programmable I/O so engineers can implement parallel data processing, control, communications, and interface functions on one device. The XC3S4000 part of the Spartan-3 family provides 4 million system-gate equivalents, while the -4 suffix identifies its performance grade. The device provides 62,208 logic cells, 489 I/O lines, and 1,769,472 bits of RAM. Its 676-BGA package supports a high pin count, allowing extensive parallel connectivity in compact industrial, communications, instrumentation, and embedded-control equipment. The Spartan-3 architecture is organized around configurable logic blocks connected by programmable routing resources. Dedicated block RAM and arithmetic resources allow designers to place buffering, packet handling, filtering, and fixed-point processing close to the logic that consumes the data. This architecture is valuable when system throughput, parallel processing, or flexible post-deployment updates matter more than the absolute operating frequency of a large application-specific processor. Typical uses include industrial control systems, network-interface controllers, video and image-processing pipelines, communications equipment, test and measurement instruments, and embedded control platforms. The large I/O count also supports buses, memory interfaces, high-speed acquisition channels, and external peripheral connectivity when board constraints allow the associated signal-integrity engineering. Design planning must account for the BGA assembly process, power delivery across many supply balls, decoupling, thermal performance, and high-speed routing. Differential and sensitive interfaces should use controlled-length geometry and reference planes, while configuration, JTAG, decoupling, and clock circuitry should follow the manufacturer’s Spartan-3 design guidance. Verify every selected pin, voltage requirement, speed limit, and package dimension against the official device documentation before schematic release. This product record combines the device identity, package information, sourcing fields, technical specifications, drop-in candidates, application guidance, and design notes needed for initial engineering evaluation. The 676-ball footprint requires deliberate PCB layout and assembly planning, so migration decisions should be based on confirmed pin compatibility rather than family name or gate-count similarity alone.

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XC3S4000-4FG900C - 4M Gate Spartan-3 FPGA | AMD
XC3S4000-4FG900C

XC3S4000-4FG900C - 4M Gate Spartan-3 FPGA | AMD

The AMD Xilinx XC3S4000-4FG900C is a Spartan-3 field-programmable gate array with 4,000,000 system gates, 62,208 logic cells, 6,912 configurable logic blocks, 1,769,472 RAM bits, and 633 user I/O in a 900-FBGA package. It operates from a 1.14 V to 1.26 V core supply and is specified for a 0 °C to 85 °C commercial temperature range. A field-programmable gate array, or FPGA, is a programmable digital integrated circuit whose logic, memory, and I/O resources can be configured after manufacture. Within the semiconductor hierarchy, an FPGA is a configurable logic device used for parallel processing, interface bridging, signal generation, data acquisition, and embedded control. The Spartan-3 family targets cost-sensitive designs requiring more logic density than small programmable logic devices while retaining a relatively simple implementation flow. Key resources include 62,208 logic cells distributed across 6,912 CLBs or LABs, together with 1,769,472 RAM bits for buffers, lookup tables, or distributed data storage. The device provides 633 user I/O, supporting interfaces to external memory, transceivers, converters, processors, and network equipment. Its 1.2 V-class core operation reduces power relative to many older FPGA generations, while the -4 speed designation identifies its performance grade. The 900-FBGA package concentrates a large amount of programmable logic and I/O into a compact surface-mount footprint. Fine-pitch ball-grid construction makes accurate PCB layout, via planning, assembly-profile inspection, and power distribution essential. Unlike a microcontroller, the FPGA executes hardware-defined parallel datapaths after configuration rather than relying primarily on sequential software execution. Typical uses include industrial control, communications infrastructure, video and image processing, test equipment, storage controllers, networking, and embedded signal-processing systems. The large LUT and RAM inventory is particularly useful for parallel filters, protocol engines, bus bridges, and high-speed data paths where multiple operations must execute concurrently. Before finalizing a board, verify the 900-ball land pattern against the manufacturer package drawing, provide clean core and I/O supplies, and confirm the selected Xilinx synthesis, implementation, and programming tools support the Spartan-3 device. Because this is a fine-pitch BGA package, assembly yield, solder-mask definition, X-ray inspection, and thermal design should be reviewed with the PCB fabricator. This page combines the published device resources, package characteristics, operating limits, sourcing path, replacement options, and practical implementation considerations in one engineering-focused reference for FPGA design and procurement teams.

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XC3S4000-4FG900I - 4M-Gate Spartan-3 FPGA | AMD | 900-BBGA
XC3S4000-4FG900I

XC3S4000-4FG900I - 4M-Gate Spartan-3 FPGA | AMD | 900-BBGA

The AMD/Xilinx XC3S4000-4FG900I is a Spartan-3 field-programmable gate array with 4,000,000 system gates, 62,208 logic elements, 633 user I/O, and a 900-ball BGA package. It uses 1.2 V FPGA technology, operates at the -4 speed grade, and is specified for industrial-temperature applications. A Spartan-3 FPGA is a programmable digital semiconductor used to implement logic, control, signal processing, communication, and interface functions in a single configurable device. Its architecture combines configurable logic blocks, dedicated RAM, programmable input/output blocks, digital clock managers, and dedicated multipliers. Within the product hierarchy, it is an FPGA, a programmable logic device, and a semiconductor used instead of a large combination of fixed-function logic ICs. The device provides 4,000,000 system gates and 62,208 logic elements, making it suitable for medium-complexity embedded systems. Its 633 I/O sites support communication interfaces, memory connections, control buses, and external data paths. The -4 speed designation identifies its performance grade, while the 1.2 V technology node supports lower-voltage logic implementations than older generations of programmable logic. The 900-BBGA package provides a high connection count for designs requiring substantial external connectivity. Its large thermal and routing footprint differs from the smaller XC3S400-4FT256I, making a mechanical and pinout comparison essential before considering any migration. Configuration data, design constraints, and board-level power requirements must be reviewed rather than inferred from the family name alone. Typical uses include industrial control, instrumentation, embedded communications, data acquisition, test equipment, and signal-processing systems. The Spartan-3 architecture can connect processors and peripherals through programmable logic, implement protocol bridges, and consolidate functions that would otherwise require multiple configurable or fixed-function devices. Power and layout planning are critical because the 900-BBGA device has many power, ground, configuration, and I/O connections. Follow the pin-description table and recommended decoupling guidance in the DS099 family datasheet. Verify the exact pinout, allowable voltage ranges, clock requirements, and configuration method before releasing a PCB or selecting a replacement. This product record combines the device identity, published resource counts, package details, same-footprint family options, commercial sourcing guidance, and design checks into an engineer-oriented reference. The comparison table separates verified differences from fields requiring confirmation, helping designers evaluate the XC3S4000-4FG900I without assuming that another Spartan-3 device is automatically interchangeable.

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XC3S4000-5FG676C - 4M-Gate Spartan-3 FPGA | AMD Xilinx
XC3S4000-5FG676C

XC3S4000-5FG676C - 4M-Gate Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S4000-5FG676C is a Spartan-3 field-programmable gate array with 4,000,000 system gates, 489 I/O, and a 1.2 V supply in a 676-ball BGA package. The -5 speed grade supports designs requiring more timing margin than the -4 grade, while the commercial C temperature designation targets an operating range of 0°C to 85°C. A field-programmable gate array is a semiconductor whose logic fabric, programmable interconnect, and input/output resources are configured after manufacture. The Spartan-3 FPGA family belongs to the broader FPGA and programmable-logic hierarchy, allowing engineers to implement parallel data processing, control logic, interface bridging, and embedded systems in one reconfigurable device instead of combining multiple fixed-function components. The XC3S4000-5FG676C combines a 4-million-system-gate device with 489 I/O in a large 676-BGA package. Its 1.2 V core supply is characteristic of a high-density FPGA that separates core and I/O supply requirements. The -5 speed grade, commercial temperature marking, lead-free package designation, and legacy Spartan-3 architecture make the device most relevant to established designs that retain an existing board, bitstream, and software toolchain. The large I/O count provides substantial connectivity for memory interfaces, high-speed parallel buses, data converters, and external control peripherals. Because the package exposes many balls, power delivery and signal-integrity design are especially important. Designers should follow the manufacturer's decoupling, printed-circuit-board layout, and thermal guidance while confirming that the selected board pattern matches the exact 676-ball package. Typical uses include industrial automation, communications infrastructure, video and image processing, test equipment, embedded control, and legacy digital signal-processing platforms. The device is appropriate when existing Spartan-3 intellectual property, firmware, and tool-flow compatibility are more valuable than selecting a newer FPGA family. Before migration, verify timing closure, I/O voltage compatibility, memory-interface behavior, configuration requirements, and thermal performance. A different speed grade or temperature grade may fit the same family, but it is not automatically a drop-in replacement for a production design without engineering review and timing revalidation. This product page organizes the device identity, package characteristics, drop-in migration options, application guidance, comparison parameters, and design cautions. It also highlights where speed-grade and temperature-grade differences matter, helping engineering teams distinguish a mechanically compatible substitution from a functionally validated replacement.

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XC3S4000-5FG900C - 4M Gate Spartan-3 FPGA | AMD Xilinx
XC3S4000-5FG900C

XC3S4000-5FG900C - 4M Gate Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S4000-5FG900C is a Spartan-3 field-programmable gate array with 4 million system gates, 62,208 logic cells, and up to 633 I/O, operating from a 1.2 V core supply in a 900-pin FBGA package. The XC3S4000-5FG900C combines a 90 nm CMOS process, a commercial temperature grade, and a speed grade of 5 for designs requiring substantial programmable logic in a single integrated circuit. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after fabrication. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, embedded memory resources, and clock-management circuitry. This implementation density allows one device to replace many interconnected discrete logic devices while preserving the flexibility to update a design through its configuration interface. The principal benefits of the XC3S4000-5FG900C are its 4 million-system-gate capacity, 62,208 logic cells, 633 I/O, and 725 MHz stated device performance. Its 1.2 V core supply suits modern low-voltage digital systems, while the 900-pin FBGA exposes a large number of user I/O for high-speed parallel interfaces, memory interfaces, control logic, and multi-channel data acquisition. Technically, the device uses 90 nm CMOS fabrication and belongs to the Spartan-3 FPGA family. The speed-grade designation identifies the device performance class, while the final C suffix identifies the commercial-grade ordering option. A large-ball-grid-array package supports dense PCB routing but requires careful escape routing, power-plane design, thermal management, and assembly-process control because direct inspection of hidden board connections is difficult after soldering. Typical applications include industrial control systems, communications infrastructure, instrumentation, video processing, embedded test equipment, and high-density digital interfaces. The large I/O count is especially useful when a design must connect multiple converters, memory devices, transceivers, clocks, and external control logic while maintaining predictable timing across the FPGA fabric. A key design consideration is that the 900-pin package demands careful PCB stack-up and power planning. Follow the manufacturer's pinout, differential-pair rules, decoupling recommendations, and exposed thermal strategy exactly; incorrect ball assignment or return-path discontinuities can prevent reliable configuration even when the logic design itself is correct. This product record combines the exact ordering code, core architecture, resource information, package details, temperature grade, and published device figures with procurement-focused comparisons. It also identifies same-footprint Spartan-3 options for speed-grade or temperature-grade changes while clearly distinguishing engineering fit from a guaranteed drop-in substitution.

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XC3S400A-4FTG256C - Spartan-3A FPGA, 400K Gates, 256-FTBGA | AMD
XC3S400A-4FTG256C

XC3S400A-4FTG256C - Spartan-3A FPGA, 400K Gates, 256-FTBGA | AMD

The AMD (Xilinx) XC3S400A-4FTG256C is a Spartan-3A Field Programmable Gate Array (FPGA) with 400,000 system gates, 8,064 logic cells, and 195 user I/Os housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) measuring 17 × 17 mm. Built on a 90 nm CMOS process, the part operates across 0°C to +85°C commercial temperature range and supports up to 770 MHz internal clock performance per the Spartan-3A family datasheet. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (semiconductor IC) that lets engineers configure digital logic, memory blocks, and I/O behavior after manufacture. Within the broader taxonomy, the Spartan-3A sits under FPGA -> programmable logic -> logic ICs -> integrated circuits -> semiconductor. FPGAs like the Spartan-3A family are used as flexible hardware platforms that replace large clusters of discrete glue logic, custom ASICs, and processor peripherals, enabling rapid design iteration without a fabrication spin. Key differentiating features of the XC3S400A include 368,640 bits of embedded Block RAM distributed across 20 dedicated blocks (each 18 Kbit), 4 dedicated silicon hardware multipliers (18 × 18-bit signed), 4 Digital Clock Managers (DCMs) for clock conditioning, and integrated configuration support for SPI, BPI, and JTAG modes. The 256-FTBGA package offers high board-density and a low-profile mounting footprint suitable for portable and embedded products, while the commercial speed/grade designation ("-4") reflects the timing/voltage balance selected for general-purpose logic systems. Architecturally, the Spartan-3A uses a structured ASIC-style fabric of Configurable Logic Blocks (CLBs), a hierarchical routing network, and a hardened set of I/O standards including LVCMOS, LVTTL, LVDS, and HSTL. The four silicon multipliers deliver deterministic DSP performance independent of slice utilization, while the four DCMs provide frequency synthesis, phase shifting, and jitter filtering on a per-clock-domain basis. Typical applications for the XC3S400A-4FTG256C include industrial control and factory automation backplanes, video/image processing front-ends, low-density DSP pipelines, embedded display controllers, automotive infotainment prototyping, communications glue logic, and legacy parallel-interface bridges between microcontrollers and high-speed peripherals. Its combination of moderate logic density and ample Block RAM makes it a strong fit for cost-sensitive designs that would otherwise require several smaller FPGAs. When designing with the 17 × 17 mm FTG256 package, allocate at least four PCB layers with a solid ground plane under the device to control simultaneous switching noise (SSN). All I/O banks must share a common Vcco reference per bank, and unused pins should be left floating per AMD/Xilinx guidelines to avoid leakage paths during configuration. This page synthesizes distributor pricing, drop-in same-package alternatives (XC3S400A-4FTG256I and XC3S400-4FTG256C), and practical design notes not consolidated in the manufacturer datasheet alone.

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XC3S50-4CP132I - 50K-Gate Spartan-3 FPGA | Xilinx
XC3S50-4CP132I

XC3S50-4CP132I - 50K-Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S50-4CP132I is a 50,000-system-gate Spartan-3 field-programmable gate array in a 132-terminal, approximately 8 mm square TFBGA package. Verified listings identify the device as a 192-CLB FPGA, while one comparison source states 630 MHz and 90 nm process technology. The “-4” ordering code identifies the performance grade, “CP” identifies the package family, “132” identifies the terminal count, and “I” identifies the industrial temperature grade. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and programmable I/O resources can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic device and a configurable semiconductor. Spartan-3 devices target cost-sensitive embedded systems where parallel logic, state machines, protocol handling, data acquisition, and modest control functions must fit into a compact board area. The verified sources report 50,000 system gates and 192 configurable logic blocks. The DigiKey result for the closely identified XC3S50-4CPG132I also reports 73,728 registers and 1,728 logic cells, but those figures were not explicitly supplied for XC3S50-4CP132I and therefore are not treated as target specifications here. The target belongs to the Spartan-3 family and is suitable for consumer, automotive, industrial, telecommunications, communications-hardware, and embedded-control applications. The CP132 package uses ball terminals and is identified by sources as TFBGA or CSPBGA. Because it is a fine-pitch, 132-terminal surface-mount package, PCB layout quality directly affects assembly yield and long-term reliability. Its approximately 8 mm square body demands exact land-pattern, solder-mask, stencil, and component-placement verification against the manufacturer package drawing before fabrication. Typical designs use configurable logic for acquisition control, sensor conditioning, digital filtering, communications, industrial interfaces, and compact embedded systems. Unlike a microcontroller, this FPGA performs parallel operations in hardware and can achieve deterministic latency after configuration. Designers must still supply configuration memory or another supported configuration source, clocking, decoupling, I/O standards, and a valid power-distribution network. The primary procurement caution is lifecycle and exact-ordering-code validation. Multiple distributors reported inventory in October 2026, but long-term availability should be confirmed for the production quantity rather than inferred from a single marketplace listing. Rochester Electronics reported 22.534 units and a starting unit price of $2.10, while another marketplace result reported 5,641 pieces; these figures are source-specific and should not be treated as guaranteed consolidated stock. This page consolidates verified package, capacity, market-availability, and cross-reference information with a strict analysis of whether any candidate is truly drop-in compatible. Unlike a generic distributor listing, it also distinguishes exact evidence from unavailable electrical, pin-level, lifecycle, and certification details so engineers can identify what still requires manufacturer-documentation review.

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XC3S50-4CPG132C - 4-Speed Spartan-3 FPGA | AMD
XC3S50-4CPG132C

XC3S50-4CPG132C - 4-Speed Spartan-3 FPGA | AMD

The AMD XC3S50-4CPG132C is a Spartan-3 field-programmable gate array supplied in a 132-ball TFBGA package, with 89 I/O and a distributor-listed logic-resource value of 73728. The ordering code identifies a -4 speed grade and a commercial-temperature grade through the C suffix. AMD acquired the original Xilinx Spartan-3 product line, so historical design materials commonly identify this device as XC3S50 rather than by its current corporate name. A field-programmable gate array, or FPGA, is a reconfigurable digital integrated circuit in which configurable logic blocks, programmable interconnect, and input/output resources implement a digital design. Within the semiconductor hierarchy, an FPGA sits above a programmable logic device and occupies the broader categories of programmable logic and digital logic ICs. Unlike a fixed-function microcontroller or application-specific processor, an FPGA allows parallel hardware architectures, timing control, and post-configuration logic updates. The verified distributor listing identifies 89 I/O, a 73728 logic-resource value, a 1728 feature value, and a 132-TFBGA package. The exact interpretation of the 73728 and 1728 distributor fields should be confirmed against the applicable Spartan-3 family data sheet before they are used in a resource budget. The part is identified as a Spartan-3 FPGA IC and is listed by DigiKey, Octopart, Win Source, IC-Components, and other distributors. The -4 suffix denotes the device speed grade within the Spartan-3 ordering system. A -4 grade is generally selected when design timing must be closed under a specified system clock, while it should not be treated as a guaranteed replacement for every speed grade. The C suffix identifies the commercial temperature grade, but exact minimum and maximum junction or ambient temperature limits require verification from the original manufacturer data sheet because those limits were not included in the retrieved snippets. The 132-ball TFBGA package supports compact, high-density board layouts, although its fine ball pitch makes inspection and rework more demanding than with a leaded package. Typical design uses include custom interface controllers, data-acquisition logic, embedded control functions, protocol bridges, and parallel signal processing. The 89 I/O count is a useful initial planning figure, but designers must also account for dedicated configuration pins, power pins, and other package balls that cannot be assigned as general user I/O. Because a BGA pin map was not included in the verified source material, the complete pin assignment cannot be reproduced safely. Before layout release, obtain the official Spartan-3 package data, confirm every power, ground, configuration, and user-I/O ball, and use the manufacturer land pattern and decoupling guidance. Do not infer the 132-ball map from the 89 user-I/O count. This page consolidates the verified distributor identity, package information, ordering-code details, cross-reference findings, and practical migration guidance. It also separates confirmed values from fields that still require manufacturer-document verification, helping engineers assess this legacy FPGA without treating distributor search snippets as a substitute for the complete data sheet.

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XC3S50-4CPG132C0974 - Spartan-3 FPGA, 50K Gates, 132-CSBGA | AMD
XC3S50-4CPG132C0974

XC3S50-4CPG132C0974 - Spartan-3 FPGA, 50K Gates, 132-CSBGA | AMD

The AMD (formerly Xilinx) XC3S50-4CPG132C0974 is a Spartan-3 Field Programmable Gate Array offering 50,000 system gates, 1,728 logic cells, and 89 user I/Os in a 132-ball Chip-Scale BGA (CSBGA / TFBGA) package. The device is part of the lowest-density Spartan-3 family, designed for cost-sensitive, high-volume applications requiring programmable logic glue, custom bus interfaces, and low-cost DSP functions without the overhead of higher-density FPGAs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer configures after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs), alongside CPLDs, and occupy the high-logic-density end of that family. Within a digital system, an FPGA typically handles parallel processing, high-speed glue logic, custom peripheral bridging, and rapid-prototype ASIC replacement. Key differentiating features of the XC3S50 include 73,728 bits of distributed SelectRAM, 16 dedicated 18x18 hardware multipliers (DSP48-style slices for Spartan-3), four Digital Clock Managers (DCMs) for zero-delay clock alignment and frequency synthesis, and JTAG IEEE 1149.1/1532 boundary-scan support. The 132-ball CSBGA package supports up to 89 user I/Os at densities appropriate for industrial control, consumer, and communications glue logic. The speed grade -4 indicates a mid-range timing bin (faster than -5, slower than -3) optimized for design margin rather than peak performance. The Spartan-3 architecture combines a sea-of-CLBs fabric with block RAM tiles, multipliers, and DCMs stitched together by a hierarchical routing network. The 90 nm process node and 1.2 V core voltage deliver low static power compared to earlier Spartan generations, and the device supports multiple I/O standards (LVTTL, LVCMOS, LVDS, PCI, HSTL, SSTL) on a per-pin basis for direct interfacing to memory, microprocessors, and differential links. The -C suffix indicates a commercial temperature grade (0 C to +85 C). Typical applications include consumer electronics glue logic, industrial control and machine interfaces, low-cost DSP pre/post-processing, custom peripheral expansion for microcontrollers, and legacy ASIC replacement in production. Designers select the Spartan-3 family for non-volatile-free, lowest-cost FPGA deployment where the simplicity of SRAM configuration is acceptable. When designing with the XC3S50-4CPG132C0974, ensure that the configuration memory (typically an external SPI flash or Platform Flash) is sized appropriately for the bitstream and that the JTAG chain is accessible for in-system programming. Consider migrating to the pin-compatible Spartan-3AN or Spartan-6 family for new designs that require non-volatile configuration or lower power. This page synthesizes distributor pricing, drop-in Spartan-3 family alternatives, and practical design notes not found in the bare manufacturer datasheet front matter.

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XC3S50-4CPG132I - 1728-Logic-Cell Spartan-3 FPGA | AMD
XC3S50-4CPG132I

XC3S50-4CPG132I - 1728-Logic-Cell Spartan-3 FPGA | AMD

AMD XC3S50-4CPG132I is a Spartan-3 field-programmable gate array with 1,728 logic cells, 89 user I/O, and 73,728 RAM bits in a 132-pin TFBGA/CSPBGA package. The device operates from a 1.14 V to 1.26 V supply and is specified for a -40°C to 100°C junction-temperature range. Its -4 speed designation identifies the performance grade used by the ordering code, while the I suffix identifies the industrial temperature option. A field-programmable gate array is a semiconductor device whose digital logic and interconnect structures are configured after manufacture. An FPGA sits above programmable logic within the broader semiconductor hierarchy and differs from a fixed-function application-specific integrated circuit because one package can implement many control, interface, datapath, or communication designs. This configurability is useful when product requirements evolve, production volumes warrant custom logic, or a system needs parallel processing beyond a simple microcontroller. The verified device data identifies 192 LABs or CLBs, 89 I/O, and 73,728 RAM bits. These resources support parallel state machines, control logic, data acquisition, communications, and embedded control functions. The Spartan-3 architecture is specifically associated with a 1.2 V-class supply in the supplied results, but individual bank requirements, configuration interfaces, AC/DC limits, and timing values must be checked in the official family documentation before implementation. Typical uses include industrial controllers, data-acquisition systems, communication peripherals, instrumentation, embedded processors, and compact control platforms. Its 89 available I/O provide external interfaces for clocks, serial links, digital buses, status indicators, and actuator controls. Designers should account for the 132-ball package when planning fanout and PCB escape routing, and must preserve the exact ball assignments used by the selected board design. For a new board, XC3S50-4CPG132I is appropriate when its 1,728 cells and 73,728 RAM bits satisfy the design and when an industrial-temperature, 1.2 V-class FPGA is required. For a direct replacement, compatibility must include the 132-ball footprint, exact ball map, supply rails, I/O standards, configuration interface, timing margin, and bitstream support rather than package count alone. This product record combines verified source specifications, procurement context, and engineering checks that should precede substitution. It distinguishes confirmed values such as cell count, RAM, I/O, voltage, package, and temperature from data that still requires the official pinout, price, lifecycle, and electrical-characteristic tables.

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