XC3S50-4CPG132C0974 - Spartan-3 FPGA, 50K Gates, 132-CSBGA | AMD
Teilenummer: XC3S50-4CPG132C0974 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $41.5 | $41,50 |
| 10 | $36.8 | $368,00 |
| 100 | $32.4 | $3.240,00 |
| 500 | $28.75 | $14.375,00 |
| 1.000 | $25.1 | $25.100,00 |
XC3S50-4CPG132C0974 Übersicht
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer configures after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs), alongside CPLDs, and occupy the high-logic-density end of that family. Within a digital system, an FPGA typically handles parallel processing, high-speed glue logic, custom peripheral bridging, and rapid-prototype ASIC replacement.
Key differentiating features of the XC3S50 include 73,728 bits of distributed SelectRAM, 16 dedicated 18x18 hardware multipliers (DSP48-style slices for Spartan-3), four Digital Clock Managers (DCMs) for zero-delay clock alignment and frequency synthesis, and JTAG IEEE 1149.1/1532 boundary-scan support. The 132-ball CSBGA package supports up to 89 user I/Os at densities appropriate for industrial control, consumer, and communications glue logic. The speed grade -4 indicates a mid-range timing bin (faster than -5, slower than -3) optimized for design margin rather than peak performance.
The Spartan-3 architecture combines a sea-of-CLBs fabric with block RAM tiles, multipliers, and DCMs stitched together by a hierarchical routing network. The 90 nm process node and 1.2 V core voltage deliver low static power compared to earlier Spartan generations, and the device supports multiple I/O standards (LVTTL, LVCMOS, LVDS, PCI, HSTL, SSTL) on a per-pin basis for direct interfacing to memory, microprocessors, and differential links. The -C suffix indicates a commercial temperature grade (0 C to +85 C).
Typical applications include consumer electronics glue logic, industrial control and machine interfaces, low-cost DSP pre/post-processing, custom peripheral expansion for microcontrollers, and legacy ASIC replacement in production. Designers select the Spartan-3 family for non-volatile-free, lowest-cost FPGA deployment where the simplicity of SRAM configuration is acceptable.
When designing with the XC3S50-4CPG132C0974, ensure that the configuration memory (typically an external SPI flash or Platform Flash) is sized appropriately for the bitstream and that the JTAG chain is accessible for in-system programming. Consider migrating to the pin-compatible Spartan-3AN or Spartan-6 family for new designs that require non-volatile configuration or lower power.
This page synthesizes distributor pricing, drop-in Spartan-3 family alternatives, and practical design notes not found in the bare manufacturer datasheet front matter.
Drop-in-Alternativen für XC3S50-4CPG132C0974 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC3S50-5CPG132C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC3S50A-4CPG132C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC3S50-4CPG132I
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →XC3S200-4CPG132C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC3S400-4CPG132C
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC3S50-4CPG132C0974 Grenzwerte & elektrische Eigenschaften
| Series | Spartan-3 |
| Number of Logic Cells | 1,728 |
| Number of Logic Blocks / Slices | 192 slices (1,728 LC equivalent) |
| System Gates | 50,000 |
| Total RAM Bits | 73,728 |
| Number of I/O | 89 |
| Gehäuse | 132-CSBGA (TFBGA), 8x8 mm |
| Speed Grade | -4 (mid-range timing) |
| Temperature Grade | Commercial (0 C to +85 C) |
| Core Voltage | 1.2 V |
| Process Node | 90 nm |
| Digital Clock Managers (DCMs) | 4 |
| Configuration Interface | JTAG (IEEE 1149.1/1532), SelectMAP, SPI |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Lead Free | Yes |
XC3S50-4CPG132C0974 132-csbga (tfbga), 8x8 mm Pinbelegungsleitfaden
Pinbelegung für XC3S50-4CPG132C0974 (132-csbga (tfbga), 8x8 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XC3S50-4CPG132C0974.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC3S50-4CPG132C0974 ist geeignet für 6 Anwendungs: Industrial Control and Machine Interface Glue Logic, Custom Peripheral Expansion for Microcontrollers, Legacy ASIC Replacement in Production, Low-Cost DSP Pre/Post-Processing, Consumer Electronics Custom Bus Interfaces, Test and Measurement Front-End Logic.
Industrial Control and Machine Interface Glue Logic
The XC3S50-4CPG132C0974 fits industrial control applications by bridging custom parallel and serial buses between microcontrollers, sensors, and actuators. Its 89 user I/Os handle multi-channel PWM timing, encoder feedback, and discrete I/O expansion within 50,000 system gates - more than sufficient for protocol conversion (Modbus, CANopen, RS-485) and small state-machine controllers. The commercial 0C to +85C temperature rating suits factory-floor enclosures. The 4 dedicated DCMs allow zero-delay clock distribution across multi-board systems, and the 73,728 bits of distributed RAM store lookup tables for command translation.
Empfohlen
Custom Peripheral Expansion for Microcontrollers
Designers pair the XC3S50-4CPG132C0974 with cost-sensitive microcontrollers to add custom peripherals without the overhead of an ASIC. The 1,728 logic cells implement LCD controllers, key-scanning matrices, motor control peripherals, and graphical user interface layers for embedded displays. With 16 dedicated 18x18 hardware multipliers and ample block RAM, the device can offload DSP-style firmware tasks from the host MCU. Surface-mount BGA mounting and a small 8x8 mm package footprint suit compact hand-held and panel-mount industrial products.
Empfohlen
Legacy ASIC Replacement in Production
The XC3S50-4CPG132C0974 is a mature AMD/Xilinx Spartan-3 part frequently deployed to replace obsolete ASICs where board layouts and pin counts already exist. Its 132-CSBGA footprint, 89 I/Os, and 1,728 logic cells provide a known-good migration target for boards designed against older vendor parts. The 50K-gate capacity handles typical interface conversion, custom memory timing controllers, and bus arbitration logic at a unit-cost below $1 at volume. Engineers can recompile legacy ASIC netlists into a Spartan-3 bitstream with minimal board rework.
Empfohlen
Low-Cost DSP Pre/Post-Processing
The XC3S50-4CPG132C0974 supports small DSP pre- and post-processing pipelines through 16 dedicated 18x18 multipliers and 73,728 bits of SelectRAM. Applications include FIR filters, audio biquad stages, image binarization, and small FFT butterflies - tasks that free the host processor from real-time audio and signal processing overhead. The 1.2 V core plus Spartan-3 dynamic power gating enable low-power operation during idle DSP frames. JTAG real-time debug (ChipScope-style) verifies filter coefficients without breaking the system datapath.
Empfohlen
Consumer Electronics Custom Bus Interfaces
Consumer devices such as set-top boxes, smart appliances, and home networking gateways benefit from the XC3S50-4CPG132C0974's ability to bridge custom parallel buses to standard interfaces like I2C, SPI, UART, and even MIPI. With 1,728 logic cells and 89 user I/Os, the chip can multiplex multiple slow peripherals onto a single fast host bus, offload buffer management, and convert between bus protocols. CSBGA mounting at 8x8 mm fits inside densely-packed consumer enclosures.
Empfohlen
Test and Measurement Front-End Logic
Test instrumentation OEMs use the XC3S50-4CPG132C0974 to implement custom test pattern generators, protocol analyzers, and JTAG/BScan expansion cards. The Spartan-3 logic fabric handles real-time pattern timing, parallel stimulus generation, and on-the-fly capture buffers with up to 73K bits of distributed RAM. JTAG IEEE 1149.1 support enables legacy BScan chain integration. Commercial temperature rating and BGA mounting suit bench-instrument enclosures.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC3S50-4CPG132C0974 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC3S50-5CPG132C | XC3S50A-4CPG132C | XC3S50-4CPG132I | XC3S200-4CPG132C |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | 132-CSBGA (TFBGA) 8x8 mm | 132-CSBGA (TFBGA) 8x8 mm - same | 132-CSBGA (TFBGA) 8x8 mm - same | 132-CSBGA (TFBGA) 8x8 mm - same | 132-CSBGA (TFBGA) 8x8 mm - same |
| Family | Spartan-3 (90 nm) | Spartan-3 (90 nm) - same family | Spartan-3A (90 nm) - upgrade | Spartan-3 (90 nm) - same family | Spartan-3 (90 nm) - same family, higher density |
| Speed Grade | -4 (mid-range) | -5 (slower) | -4 (same) | -4 (same) | -4 (same) |
| System Gates | 50,000 | 50,000 | 50,000 | 50,000 | 200,000 |
| Logic Cells | 1,728 | 1,728 | 1,728 | 1,728 | 4,320 |
| User I/O | 89 | 89 | 89 | 89 | 89 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
Wichtigste Unterscheidungsmerkmale
- True density upgrade exists in same package (vs. XC3S50-5CPG132C)
- Commercial-grade cost-down option at same capacity (vs. XC3S50-4CPG132I)
- Spartan-3A upgrade path for non-volatile configuration (vs. XC3S50A-4CPG132C)
Designhinweise
Estimated: at 50% toggle rate with all 89 I/Os active, the XC3S50-4CPG132C consumes approximately 200-400 mW from the 1.2 V core plus I/O supply. Provide separate decoupling for VCCINT (1.2 V core), VCCO (I/O banks), and VCCAUX (auxiliary 2.5 V) - each rail must have 0.1 uF and 10 uF ceramic caps within 5 mm of the BGA balls, per the DS099 Spartan-3 Family datasheet power-supply section. For battery-backed or hot-swap applications, sequence VCCINT before VCCO to avoid I/O driver stress.
The 132-CSBGA package uses 0.5 mm ball pitch on an 8x8 mm substrate, which is at the edge of standard 4-mil FR4 capability. Estimated: trace width should be 0.1-0.15 mm (4-6 mil) with matched 100 ohm differential pairs for LVDS; signal layers should reference a solid ground plane on layer 2. For high-speed LVDS or DDR signaling, design stackup with 4-6 layers minimum and 100-ohm controlled impedance per IEEE 1149.1 guideline. Do not place signal vias within the BGA escape area outside the breakout region.
Critical: do not assume the configuration mode is set by hardware defaults - the MODE[0:2] pins must be tied high or low before power-up and must not be left floating. A floating MODE pin can cause the Spartan-3 to enter Master Serial while expecting Slave Parallel or vice versa, leaving the device unable to configure. Additionally, the JTAG TDI/TDO chain must include the recommended pull-up (TDI) and pull-down (TDO) resistors; otherwise the JTAG controller may fail to enumerate even when bitstream loading succeeds. See UG332 Spartan-3 Generation Configuration User Guide for proper JTAG chain design.
Compliance-Informationen
RoHS and lead-free compliance per AMD/Xilinx product page. AEC-Q100 not applicable for industrial FPGA grade; automotive designs should select a different family.
