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EP4SGX360KF43C2N - Stratix IV GX FPGA, 353K LE, 880 I/O | Intel
EP4SGX360KF43C2N

EP4SGX360KF43C2N - Stratix IV GX FPGA, 353K LE, 880 I/O | Intel

The Intel EP4SGX360KF43C2N is a high-density Stratix IV GX family field-programmable gate array (FPGA) fabricated on a 40 nm process node, integrating 353,600 logic elements, 23,105,536 bits of embedded memory, and 880 user I/Os in a 1760-ball flip-chip BGA (FCBGA-1760 / KF43) package. It is supplied from a 0.9 V core rail, supports industrial-grade temperature operation, and is a lead-free, RoHS-compliant device intended for high-performance digital logic, signal-processing, and serial-protocol designs. A Stratix IV GX FPGA is a programmable logic device that combines general-purpose logic fabric, dedicated DSP blocks, embedded SRAM, high-speed transceivers, and hard PCIe/clock IP into a single IC. Within the broader semiconductor hierarchy, the device sits at: FPGA -> programmable logic device -> logic IC -> integrated circuit. It belongs to the Stratix IV family and the GX transceiver sub-series, meaning the silicon integrates multi-gigabit transceivers (MGTs) capable of operating at line rates commonly used by PCIe Gen1/Gen2, Gigabit Ethernet, XAUI, Serial RapidIO, and Serial ATA, in addition to the user-programmable fabric. Key differentiating features of the EP4SGX360KF43C2N include 14,144 adaptive logic modules (ALMs) and approximately 720 DSP blocks (typical for the 360 variant), embedded transceivers supporting multiple industry-standard protocols, hard memory controllers, up to 880 user I/Os, and support for high-speed external memory interfaces such as DDR3, QDR II+, and RLDRAM II. The KF43 speed grade balances timing margin and Fmax for cost-sensitive, throughput-oriented systems. The 1760-ball FC-FBGA package uses flip-chip interconnect technology that minimizes inductance for the high-speed serial and parallel I/O. Typical applications include high-throughput digital signal processing (radar, beamforming, software-defined radio), ASIC prototyping, communication infrastructure line cards, PCIe Gen2 endpoint cards, broadcast video processing, and high-end test and measurement equipment. The combination of transceivers, large logic capacity, and substantial embedded memory allows one silicon platform to absorb functions that would otherwise require separate processors, ASSPs, and discrete memory. When designing with this FPGA, plan the power-rail network around the 0.9 V core, dedicated PLL/DSP supply pins, and the high-current transceivers separately; use the Quartus II design suite for synthesis, place-and-route, timing closure, and power estimation. The 1760-ball package requires multi-layer PCB stack-up with controlled-impedance routing for transceivers and matched-length pairs for the LVDS/DDR interfaces.

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EP4SGX360KF43C3 - Stratix IV GX FPGA, 353K LE | Intel
EP4SGX360KF43C3

EP4SGX360KF43C3 - Stratix IV GX FPGA, 353K LE | Intel

The Intel (formerly Altera) EP4SGX360KF43C3 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) delivering 353,600 logic elements in a 1760-ball FC-BGA package with integrated transceivers. It is built on a 40 nm process technology and operates from a 0.9 V core supply, targeting high-throughput serial I/O, ASIC prototyping, and DSP-intensive designs. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, memory blocks, DSP blocks, and I/O can be programmed after manufacturing to implement arbitrary digital functions. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs, ASSPs, and microcontrollers as a class of programmable logic devices; the Stratix IV family is positioned at the high-performance end for networking, wireless baseband, and high-speed serial applications. Key features of the EP4SGX360KF43C3 include 880 user I/O pins, 14,144 LABs (Logic Array Blocks), 23,105,536 bits of embedded memory, embedded 8B/10B-capable transceivers operating up to 8.5 Gbps, hardware DSP blocks for high-GFlop signal processing, and a 1760-pin FC-BGA (Fine-Pitch Chip-Scale Ball Grid Array) package. The device family supports configuration via passive serial, fast passive parallel, JTAG, and dedicated configuration pins. Architecturally, the EP4SGX360KF43C3 separates core logic, I/O, and transceiver power domains, enabling independent voltage scaling. The 40 nm low-power process offers lower static and dynamic power versus prior 65 nm Stratix III devices, while the GX variants add dedicated PHY for PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G protocols. Typical applications include high-end telecom line cards, software-defined radio (SDR) baseband, ASIC prototyping, broadcast video switching, and defense signal processing. The combination of dense logic, embedded transceivers, and large on-chip memory suits designs where multiple discrete ASSPs would otherwise be required. When designing with this device, pay close attention to PCB layout for the FC-BGA substrate, supply decoupling for the multi-rail power architecture, and thermal management for the high-density package. Quartus II software (v11.0+) is required for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical PCB/thermal design guidance that is not present in the bare manufacturer datasheet, helping engineers accelerate board bring-up and component selection.

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EP4SGX360KF43C3N - 353,600-Cell FPGA | Intel | DSP
EP4SGX360KF43C3N

EP4SGX360KF43C3N - 353,600-Cell FPGA | Intel | DSP

Intel EP4SGX360KF43C3N is a Stratix IV GX field-programmable gate array with 353,600 logic cells, 141,440 CLBs as reported by distributor sources, 880 user I/O connections, and 23,105,536 bits of embedded memory. It is supplied in a 1760-ball FCBGA/BGA package. The part targets high-density digital logic, high-speed signal processing, and communications systems that require programmable hardware acceleration and substantial on-chip memory. A field-programmable gate array is a semiconductor device containing configurable logic blocks, programmable interconnects, memory resources, and specialized processing elements. An FPGA sits below application-specific integrated circuits and above fixed-function digital ICs in the programmable-device hierarchy because it can be configured after manufacturing. This makes it useful for implementing parallel algorithms, interface bridging, packet processing, and signal-processing pipelines while allowing design changes without a new silicon spin. Verified data identifies 23,105,536 memory bits, 353,600 logic cells, 141,440 CLBs, and 880 I/O pins. The 1760-ball package provides the physical interface for the device, while the programmable fabric can be adapted to different algorithms and protocols. The available source data also describes high-speed DSP blocks configurable for 9 x 9-bit, 12 x 12-bit, 18 x 18-bit, and 36 x 36-bit full-precision multipliers operating at up to 600 MHz. Architecturally, the device combines programmable logic with embedded memory and dedicated DSP capability. This combination is valuable when a design needs both dense control logic and repeatable arithmetic operations. The large memory capacity supports FIFOs, buffers, and true dual-port memory structures, while the multiplier configurations support filters, transforms, and other parallel numeric operations. The distributor data also lists a 717 MHz figure, but the exact meaning of that figure should be confirmed from the manufacturer datasheet before it is used as a system-level performance limit. Typical applications include communications infrastructure, radar and sensor processing, industrial imaging, test and measurement, and high-performance DSP systems. The device can implement parallel datapaths, protocol conversion, video or image preprocessing, and real-time control functions. Because the FPGA is programmable, design teams can modify functionality through configuration and intellectual-property changes rather than changing the component footprint. A key design consideration is the high pin count and complexity of the 1760-ball package. PCB layout, power integrity, signal integrity, thermal management, configuration, and timing closure must be planned before fabrication. The user should obtain the official manufacturer documentation and verify package dimensions, speed-grade details, supply requirements, and pin assignments before release to production. This page combines the verified distributor specifications, available source links, and a conservative replacement analysis; values not present in the supplied evidence are marked for confirmation rather than inferred.

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EP4SGX360KF43C4 - 353K LE Stratix IV GX FPGA, 880 I/O, FCBGA-1760
EP4SGX360KF43C4

EP4SGX360KF43C4 - 353K LE Stratix IV GX FPGA, 880 I/O, FCBGA-1760

The Altera (Intel) EP4SGX360KF43C4 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process and housed in a 1760-ball FC-BGA (FCFBGA) package. It integrates 353,600 logic elements, 23,105,536 bits of embedded memory (divided across 880 M9K/M144K blocks), 880 user I/O pins, and dedicated high-speed transceivers, making it one of the largest members of the Stratix IV GX family. The "C4" speed grade targets commercial-temperature applications with the standard performance tier of the family. What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic functionality, interconnect, and I/O behavior are configured after manufacturing by the customer using a hardware description language. FPGAs sit above general-purpose microcontrollers and ASICs in the flexibility/performance trade-off: ASICs deliver the highest performance per watt but cannot be reconfigured; microcontrollers run software but are bound to a fixed instruction set. Stratix IV family FPGAs target high-throughput signal processing, high-speed serial connectivity, and protocol bridging between ASIC/ASSP blocks. The 880 user I/Os support a wide range of single-ended and differential I/O standards including LVDS, LVPECL, HSTL, and SSTL, while the integrated high-speed transceivers enable multi-gigabit serial links such as PCIe, Serial RapidIO, XAUI, and CEI. Embedded DSP blocks operate as 9 x 9, 12 x 12, 18 x 18, and 36 x 36 full-precision multipliers at up to 600 MHz, providing a deterministic DSP fabric for FFTs, FIR filters, and modulation/demodulation blocks. Typical applications include high-end wireless baseband processing, software-defined radio (SDR), radar and electronic-warfare signal chains, medical imaging accelerators, high-performance ASIC prototyping, and 10G/40G line-card bridging. The 1760-ball FCBGA package is designed for high-density board designs using BGA assembly and controlled-impedance multilayer PCBs. Designers should plan power, decoupling, and signal-integrity analysis up front: the FCBGA-1760 package requires a multi-layer PCB with buried vias, the configuration scheme (AS, PS, JTAG, or FPP) must be selected before PCB layout, and thermal management must dissipate the device's full-load power through top-side heatsinking. This page synthesizes distributor pricing, a curated set of pin-compatible Stratix IV GX family alternatives, and practical design notes that complement - not duplicate - the manufacturer datasheet.

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EP4SGX360KF43C4N - Stratix IV GX FPGA, 353K LE, 1760-FCBGA | Intel
EP4SGX360KF43C4N

EP4SGX360KF43C4N - Stratix IV GX FPGA, 353K LE, 1760-FCBGA | Intel

The Intel (formerly Altera) EP4SGX360KF43C4N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) housed in a 1760-ball FCBGA (KF43) package with 880 user I/Os. It integrates 353,600 logic elements, 141,440 logic cells, 14,440 LABs, and approximately 23.1 Mbit of embedded memory, fabricated on a 40 nm process with a 0.9 V core supply. A Stratix IV GX FPGA is a high-performance programmable logic device that combines fine-grained lookup tables (LUTs), embedded memory blocks (M9K/M144K), DSP blocks, and high-speed serial transceivers in a single silicon die. Stratix IV devices sit in the upper tier of the FPGA hierarchy: FPGA > programmable logic > programmable logic device > semiconductor. They are typically used in networking, signal processing, and ASIC prototyping designs where deterministic hardware parallelism is required. Key features include integrated 8.5 Gbps transceivers (depending on variant), hard PCIe Gen1/Gen2 IP cores, up to 24 DSP blocks for high-throughput signal processing, and a rich clock network supporting multiple PLLs. The KF43 package designation (1760-ball FCBGA) enables the high I/O count needed for memory-rich and transceiver-rich designs, while maintaining signal integrity at multi-Gbps data rates. Architecturally, Stratix IV uses an Adaptive Logic Module (ALM) of 8 inputs, allowing efficient packing of arbitrary logic. The embedded transceivers use dedicated clock-data recovery and serializer/deserializer blocks, freeing user fabric for application logic. On-chip memory can be configured as RAM, ROM, or FIFO, with true dual-port support on M9K blocks. Typical applications include high-speed serial interface bridging (PCIe, SATA, XAUI), wireless baseband DSP, software-defined radio, ASIC prototyping, and high-throughput network packet processing. The combination of dense logic, embedded transceivers, and abundant DSP makes the EP4SGX360KF43C4N well-suited to designs that exceed the capacity of Cyclone IV or Cyclone V families. When designing with this device, plan the power budget carefully: at full utilization the core can draw tens of amps at 0.9 V, requiring a multi‑phase VRM and substantial decoupling. Use Altera/Intel Quartus II design software (the last version with Stratix IV support) and follow AN 571 guidelines for transceiver PCB layout to maintain signal integrity at 8.5 Gbps. This page synthesizes distributor pricing, same-package drop-in alternatives (KF40, FF35, FH29 pin-compatible variants from the Site MPN list), and practical design notes not found in the manufacturer datasheet.

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EP4SGX360KF43I3 - 353600 Cells Stratix IV GX FPGA | Altera
EP4SGX360KF43I3

EP4SGX360KF43I3 - 353600 Cells Stratix IV GX FPGA | Altera

The Altera (now Intel) EP4SGX360KF43I3 is a high-density Stratix IV GX family Field Programmable Gate Array (FPGA) built on a 40nm process, integrating 353,600 logic elements, 23,105,536 bits of embedded memory, and 880 user I/Os in a 1760-ball FC-FBGA (FCBGA) package. It operates at a core voltage of 0.9V and is rated for the industrial temperature range. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing rather than at the fab. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), alongside CPLDs, and below application-specific standard products (ASSPs) in fixed functionality. The Stratix IV family belongs to Altera's high-performance FPGA tier, targeting designs requiring high logic density, large on-chip memory, and multi-gigabit transceivers. The EP4SGX360KF43I3 sits in the middle-upper density band of the family, positioned above the EP4SGX230 and below the EP4SGX530/820 variants, balancing capacity, I/O count, and unit cost. Key differentiating features include 14,144 LABs/CLBs for parallel logic implementation, embedded transceivers supporting multi-gigabit serial protocols, 880 maximum user I/Os for high pin-count system integration, and industrial-grade (-40C to +85C) operation. The 1760-ball FCBGA package provides dense board routing, suitable for high-speed serial and parallel interface aggregation in demanding systems. Architecturally, the device integrates a programmable logic fabric, dedicated DSP blocks, embedded SRAM organized as M9K and M144K blocks, embedded transceivers, and a clock management network with PLLs. The 40nm process enables higher integration and lower dynamic power versus the prior 65nm Stratix III generation while sustaining high-speed serial performance. Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2, Serial RapidIO, XAUI, SFI), digital signal processing (DSP) acceleration, telecommunications line cards, radar and signal processing front-ends, high-end test and measurement equipment, and ASIC prototyping. The high I/O count and embedded memory make it suitable for data aggregation and protocol bridging ASICs. When designing with this FPGA, ensure the PCB supports the 1760-ball FCBGA footprint with the appropriate via and trace geometry. Thermal management is critical at high toggle rates - refer to the Altera (Intel) Stratix IV PowerPlay Early Power Estimator and Thermal Modeling guidelines. JTAG, configuration scheme selection (Fast passive parallel, Active serial, JTAG), and clock planning must be addressed early in the schematic phase. This page consolidates distributor pricing, same-family Stratix IV GX drop-in alternatives, and design considerations not found in the standalone Altera datasheet PDF, supporting faster sourcing decisions and board bring-up.

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EP4SGX360KF43I3N - Stratix IV GX FPGA, 353.6K LE, 1760-BGA | Intel
EP4SGX360KF43I3N

EP4SGX360KF43I3N - Stratix IV GX FPGA, 353.6K LE, 1760-BGA | Intel

The Intel (formerly Altera) EP4SGX360KF43I3N is a high-density, transceiver-equipped Stratix IV GX Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process. It integrates 353,600 logic elements, 141,440 adaptive logic modules (ALMs) equivalent to 353,600 equivalent LEs, 22.55 Mbits of embedded memory, 880 user I/Os, and 8.5 Gbps transceivers into a 1760-ball FineLine BGA (FBGA-1760 / FCBGA-1760) package rated for the industrial temperature range. The KF43 speed grade and -I3 device grade place this part in the Stratix IV GX performance sweet spot for high-throughput serial I/O. A Field-Programmable Gate Array (FPGA) is a class of programmable logic IC that engineers can configure after manufacture to implement arbitrary digital circuits, high-speed serial interfaces, and parallel DSP pipelines. Within the broader semiconductor hierarchy, FPGAs sit alongside CPUs and ASICs as reconfigurable compute platforms. The Stratix IV GX family specifically targets applications needing multi-gigabit transceivers, embedded transceivers, and high logic density with low static power versus earlier Stratix generations. Key specifications for the EP4SGX360KF43I3N include 24 full-duplex transceiver channels at data rates up to 8.5 Gbps, dedicated hard IP for PCI Express Gen1/Gen2, support for serial RapidIO, Gigabit Ethernet, XAUI, and other common serial protocols, and up to 1,440 Kbits of distributed RAM plus 22.55 Mbits of block RAM (M9K/M144K). The device also integrates 768 18x18 multipliers for DSP, and a hardened memory controller subsystem for DDR3/DDR2/QDRII+ memories. Architecturally, Stratix IV GX uses Altera's adaptive logic module (ALM) fabric, an 8-input fracturable lookup table, paired with a multi-track routing interconnect that delivers predictable timing closure. The chip's PLL count and clocking network support dozens of independent clock domains, which is essential for designs that merge multiple serial protocols on one board. Hardware debug is supported through SignalTap II embedded logic analysis. Typical applications include high-end telecommunications line cards, military and aerospace signal processing, high-performance computing accelerators, broadcast video processing engines, and ASIC prototyping platforms. The wide industrial temperature range and the embedded multi-gigabit transceivers make the EP4SGX360KF43I3N well suited to defense and test-and-measurement equipment. Designers should pay close attention to PCB layout for the 1760-ball FCBGA - a multi-layer PCB stack-up with buried vias and a continuous ground/plane reference is mandatory for the transceiver SERDES channels to meet their 8.5 Gbps bit-error-rate targets. Power estimation should account for both static and dynamic consumption using Altera's PowerPlay early power estimator before final power-tree design. This page synthesizes live distributor pricing, drop-in compatible Stratix IV GX variants, and practical board-design considerations that complement the official Altera/Intel handbook for the EP4SGX360KF43I3N.

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EP4SGX360KF43I4 - Stratix IV GX FPGA, 353K LE, 1760-BGA | Intel
EP4SGX360KF43I4

EP4SGX360KF43I4 - Stratix IV GX FPGA, 353K LE, 1760-BGA | Intel

The Intel EP4SGX360KF43I4 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 353,600 logic elements, 14,144 LABs/CLBs, 880 user I/Os, and 23,105,536 bits of embedded RAM, housed in a 1760-ball FC-BGA package. It is fabricated on a 40 nm process node, supports 0.87 V to 0.9 V core supply, and integrates up to 48 transceivers operating at data rates suitable for multi-gigabit serial protocols. The device is qualified for the industrial temperature range (-40C to +100C junction). A Field Programmable Gate Array (FPGA) is a semiconductor IC whose digital logic is defined by the user after manufacturing, sitting in the broader taxonomy: programmable logic device -> logic IC -> integrated circuit -> semiconductor. Stratix IV GX is Intel's high-end transceiver-centric family optimized for ASIC prototyping, high-performance DSP, and bandwidth-intensive I/O bridging, complementing the logic-rich Stratix IV E and the DSP-dense Stratix IV GT variants. Key features include a 40 nm CMOS process with embedded transceivers, 23 Mbit of embedded memory, on-chip multipliers and DSP blocks, and a rich clock network with PLLs supporting source-synchronous memory interfaces. The 1760-ball FC-BGA package exposes all four transceiver banks and full GPIO count, enabling the largest configuration in the family. Configuration is supported via JTAG, passive serial, fast passive parallel, and PCI Express-based schemes. Typical applications include 40G/100G line-card prototyping, ASIC prototyping and emulation, high-speed serial bridging (PCIe Gen2, SATA, SRIO, XAUI, CEI-6G), test and measurement instrumentation front-ends, and high-performance DSP for radar and software-defined radio. The 14,144 LABs and abundant transceivers make it attractive for designs that previously required an ASIC. When designing with this device, plan PCB layout carefully: the 1760-ball FC-BGA requires microvia and via-in-pad capability, controlled-impedance routing for all 48 transceivers, and substantial power-rail decoupling. Thermal management must account for a hot-spot power map dictated by the Quartus power analyzer; a heatsink or cold plate is normally required for full-throughput workloads.

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EP4SGX360KF43I4N - Stratix IV GX FPGA, 353K LE, 1760-BGA | Intel
EP4SGX360KF43I4N

EP4SGX360KF43I4N - Stratix IV GX FPGA, 353K LE, 1760-BGA | Intel

The Intel (formerly Altera) EP4SGX360KF43I4N is a high-density, high-performance Stratix IV GX Field Programmable Gate Array (FPGA) with 353,600 logic elements, 880 user I/Os, and 23,105,536 bits of embedded memory, packaged in a 1760-ball FineLine BGA (FCBGA) and built on a 40nm low-power process node. The 'I4' speed/temperature grade indicates an industrial-grade -40C to +100C operating range with the fastest speed bin in the Stratix IV GX family. The device integrates up to 24 transceivers at data rates up to 8.5 Gbps, enabling high-bandwidth serial connectivity for protocols such as PCIe Gen2, XAUI, CEI-6G, Serial RapidIO, and CPRI. With 14,144 Logic Array Blocks (LABs) and dedicated DSP blocks, the EP4SGX360KF43I4N targets throughput-intensive digital signal processing, hardware-accelerated compute, and high-speed I/O bridging. A Field Programmable Gate Array (FPGA) is a programmable logic device whose architecture is dominated by a regular array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, DSP slices, and PLLs. FPGAs occupy a unique tier in the semiconductor hierarchy between general-purpose CPUs/GPUs (software-defined, sequential) and ASICs (fixed-function, lowest per-unit cost at volume). Compared to microcontrollers, FPGAs deliver massive parallelism and deterministic latency. Compared to ASICs, they offer post-fabrication reconfigurability and faster time-to-market. The Stratix IV family specifically targets high-end ASIC prototyping, high-speed serial I/O aggregation, and DSP acceleration in communications, defense, and high-performance computing infrastructure. Key features of the EP4SGX360KF43I4N include 24 high-speed transceivers (up to 8.5 Gbps), 4 hard PCIe Gen2 x8 cores, on-chip memory bandwidth exceeding 10 Tbps, an adaptive logic module (ALM) architecture that delivers 50% higher performance per logic element versus prior generations, and dedicated 18x18 multipliers for DSP. The device also embeds transceivers that support backplane and chip-to-chip serial links at rates used in 40G/100G aggregation systems. Hard intellectual property (PCIe, memory controllers, variable-precision DSP blocks) reduces soft-logic resource usage and lowers system power. Architecturally, the EP4SGX360KF43I4N combines a fine-grained ALM fabric (8-input fracturable look-up tables), embedded SRAM organized as M9K/M144K blocks, and a multi-tier routing hierarchy. The 40nm process provides a balanced trade-off between leakage, dynamic power, and performance. Designers typically use the Quartus Prime design suite to synthesize, place-and-route, and configure the device via JTAG or passive serial configuration. Power estimation is done with the Quartus PowerPlay analyzer; thermal analysis must account for the 1760-BGA FCBGA thermal resistance. Typical applications include ASIC prototyping and emulation, high-frequency trading (HFT) acceleration, radar and digital array signal processing, 40G/100G Ethernet line card aggregation, software-defined radio (SDR), test and measurement instrumentation, and high-performance compute (HPC) hardware acceleration. Its combination of transceiver density and large logic capacity makes it a popular emulator vehicle for SoC and processor IP validation. When designing with the EP4SGX360KF43I4N, the 1760-ball FCBGA requires a multi-layer PCB with buried vias, microvia stack-ups, and a controlled-impedance layer stack. Power delivery must include high-frequency decoupling at every transceiver power pin and bulk capacitance sized by the Quartus PDN tool. Thermal management typically requires a heatsink or cold-plate attachment due to the high static power of a fully utilized 360K-LE Stratix IV GX device. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix IV GX family, and practical PCB/thermal design notes not consolidated in the manufacturer datasheet.

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EP4SGX360NF45C2 - Stratix IV GX FPGA, 353.6K LEs, 1932-FCBGA | Intel
EP4SGX360NF45C2

EP4SGX360NF45C2 - Stratix IV GX FPGA, 353.6K LEs, 1932-FCBGA | Intel

The Intel (formerly Altera) EP4SGX360NF45C2 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 353,600 logic elements, 14,144 LABs, 920 user I/Os, and 23,105,536 bits of embedded memory in a 1932-ball flip-chip BGA (FCBGA) package. Manufactured on a 40 nm process with a 0.9 V core, the device integrates up to 24 transceivers at up to 8.5 Gbps, making it a drop-in member of the Stratix IV GX family for high-bandwidth serial I/O. An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits through configurable logic blocks (CLBs/LABs), routing resources, and hard IP blocks such as transceivers, DSP blocks, and memory controllers. FPGAs sit in the system hierarchy between ASICs and programmable logic controllers, offering higher integration than discrete logic while avoiding the NRE cost of ASICs. Key features of the EP4SGX360NF45C2 include 920 user I/Os, 23,105,536 bits of embedded RAM, embedded DSP blocks for high-throughput signal processing, hard PCI Express Gen1/Gen2 IP cores, and support for external memory interfaces including DDR3, DDR2, and QDRII+. The device operates from a 0.9 V core supply with separate transceiver and auxiliary rails, and the C2 speed grade indicates a commercial temperature range of 0 °C to +85 °C. The Stratix IV GX architecture combines an Adaptive Logic Module (ALM) fabric with up to 8.5 Gbps embedded transceivers, allowing the part to bridge parallel digital logic and high-speed serial links in a single device. Transceiver-rich FPGAs such as this one are commonly used to implement custom protocol bridges, high-speed data acquisition front-ends, and digital signal processing pipelines. Typical applications include high-speed serial protocol bridging (PCIe, Serial RapidIO, XAUI, SFI), wireless baseband processing, test and measurement instrumentation, broadcast video processing, and defense/aerospace signal processing systems. The wide 920-I/O pin count and 1932-ball FCBGA package suit dense, multi-rail PCB designs where transceiver performance and logic density are both required. When designing with this part, allocate dedicated 100 Ω differential transceiver reference clock routing, follow Intel power-on and configuration sequencing guidelines, and provide sufficient decoupling for the 0.9 V core. The 1932-ball FCBGA requires an advanced multi-layer PCB with controlled-impedance stackup, and high-speed transceiver channels need careful channel-length matching for jitter compliance. This page synthesizes distributor pricing, Stratix IV GX family alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP4SGX360NF45C2N - Stratix IV GX FPGA 353K LEs | Intel | FBGA-1932
EP4SGX360NF45C2N

EP4SGX360NF45C2N - Stratix IV GX FPGA 353K LEs | Intel | FBGA-1932

The Intel (formerly Altera) EP4SGX360NF45C2N is a high-density, high-performance Stratix IV GX Field-Programmable Gate Array (FPGA) containing 353,600 logic elements (LEs), 14,144 LABs (Logic Array Blocks), and 920 user I/Os, fabricated on a 40 nm process and housed in a 1932-ball Flip-Chip BGA (FC-FBGA-1932) package. It integrates up to 23,105,536 bits of embedded memory, dedicated DSP blocks, and hard PCI Express Gen1/Gen2 controllers plus multi-gigabit transceivers for high-speed serial I/O, targeting high-bandwidth wireline, broadcast, and defense applications. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic fabric, programmable routing, and hardened IP blocks such as transceivers, memory controllers, and arithmetic units. FPGAs occupy the top of the programmable-logic hierarchy above CPLDs (which have simpler, lower-density logic) and are widely used for ASIC prototyping, hardware acceleration, signal processing, and interface bridging. Stratix IV specifically is the high-end performance tier in Intel's FPGA portfolio, positioned above Cyclone (cost-optimized) and below the older Stratix V/10 families. Key features include hard multi-gigabit transceivers capable of data rates from 600 Mbps up to 8.5 Gbps depending on protocol, an integrated PCI Express Gen2 hard IP block with x1/x2/x4 lane support, dedicated 18x18 multipliers, and 9.4 Mbits of dedicated MLAB memory. The -2 speed grade and industrial temperature range (N suffix in Altera convention) suit moderate-speed commercial designs requiring operation from 0C to 85C. The 1932-ball FCBGA package exposes the device's high I/O count while enabling signal integrity for multi-GHz serial links. The Stratix IV GX architecture pairs a logic-rich programmable fabric with embedded transceivers, 6-input LUTs, and a rich clock network (up to 32 global clocks, regional clocks, and PLLs). This combination supports latency-sensitive DSP pipelines and high-throughput data paths in a single chip, reducing BOM cost and board area compared with discrete logic + external PHY solutions. The hard PCIe Gen2 controller also reduces soft-logic resource usage and simplifies protocol compliance. Typical applications include 40G/10G Ethernet line cards, radar and signal-intelligence systems, ASIC prototyping, video-broadcast infrastructure (3G-SDI/HDMI bridging), and high-performance DSP for medical imaging. The integrated transceivers make it especially suited to wireless baseband, optical transport, and serial-protocol bridging tasks. For commercial-temperature designs in this logic-density class, the -2 speed grade is the mainstream cost/performance choice. When designing with this FPGA, pay close attention to transceiver channel placement, PLL configuration, and decoupling: Stratix IV devices require a multi-rail power-supply design (VCC, VCCPT, VCCAUX, VCCPGM, VCCIO per bank). Use the Quartus II or Quartus Prime toolchain with the Stratix IV device library; pin assignments and transceiver rules are validated by Quartus fitter. JTAG configuration via the enhanced configuration device or a host microcontroller is recommended for production. This page synthesizes distributor pricing, drop-in package-matched alternatives drawn from the same Stratix IV GX family, and practical design notes not found in the manufacturer datasheet alone.

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EP4SGX360NF45C3 - 353K LE Stratix IV GX FPGA, 920 I/O, FCBGA-1932
EP4SGX360NF45C3

EP4SGX360NF45C3 - 353K LE Stratix IV GX FPGA, 920 I/O, FCBGA-1932

The Intel (formerly Altera) EP4SGX360NF45C3 is a high-density Stratix IV GX Field-Programmable Gate Array built on a 40 nm process, delivering 353,600 logic elements, 14,144 LABs, 23,105,536 bits of embedded memory, and 920 user I/O pins in a 1932-ball flip-chip BGA package. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture consists of an array of configurable logic blocks (CLBs/LABs), embedded memory blocks, DSP blocks, and programmable interconnect, all of which can be reconfigured by the designer after manufacture. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors, and they bridge the gap between fixed-function ASICs and software-driven processors by offering hardware-level parallelism with software-like design iteration. Key features of the EP4SGX360NF45C3 include integrated transceivers supporting multi-gigabit serial protocols, hard PCI Express Gen1/Gen2 IP cores, up to 14,144 LABs for high logic capacity, dedicated DSP blocks for high-throughput signal processing, and 23,105,536 bits of embedded RAM for data buffering. The 'C3' speed grade and 'NF45' package designation identify the commercial temperature range and the 45 mm flip-chip BGA form factor. The Stratix IV GX architecture is engineered for high-bandwidth, low-latency applications: it combines 6.5 Gbps transceivers, hardened PCIe Gen2 blocks, and rich logic/memory resources on a single die, enabling designers to replace multiple discrete components and reduce board complexity. The 40 nm process node balances static and dynamic power, while partial reconfiguration and dynamic phase rotation support adaptive system behavior. Typical applications include high-speed data acquisition systems, 40G/100G optical transport line cards, wireless baseband processing, ASIC prototyping, broadcast video processing, and defense/aerospace signal intelligence platforms. The GX transceiver capability makes it particularly well suited for protocols such as PCIe Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI. When designing with the EP4SGX360NF45C3, plan PCB power delivery around the 0.9 V core rail with low-impedance decoupling and proper thermal relief - the 1932-ball FCBGA package requires a multilayer PCB with microvia stackups and matched-length routing for the transceiver differential pairs to maintain signal integrity at multi-gigabit data rates. This page synthesizes distributor pricing, drop-in alternatives within the Stratix IV family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a one-stop decision resource.

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EP4SGX360NF45C3N - Stratix IV GX FPGA 353600 Cells | Intel
EP4SGX360NF45C3N

EP4SGX360NF45C3N - Stratix IV GX FPGA 353600 Cells | Intel

The Intel EP4SGX360NF45C3N is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) with 353,600 logic elements, 14,144 LABs/CLBs, 920 user I/Os, and integrated 8.5 Gbps transceivers, housed in a 1932-ball FC-FBGA package. It operates from a 0.9V core supply across the commercial 0C to 85C temperature range and is built on a 40nm CMOS process. The device targets high-bandwidth serial connectivity and parallel DSP workloads. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing programmable logic blocks, interconnect, and I/O that engineers can configure after manufacture to implement arbitrary digital functions, DSP pipelines, or hardware accelerators. Within the broader taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSP processors in the programmable logic family, offering hardware-level parallelism and reconfigurability that fixed-function ICs cannot match. Key features of the EP4SGX360NF45C3N include up to 24 full-duplex multi-gigabit transceivers supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI, on-chip memory of approximately 23.4 Mbits, embedded DSP blocks, and 8-input adaptive logic modules (ALMs) that provide up to 2x the logic capacity of older architectures. Hard PCIe Gen2 IP cores enable endpoint and root-port implementations with minimal soft-logic overhead. Architecturally, the device uses the Stratix IV GX fabric with 8-input fracturable ALMs, variable-precision DSP blocks supporting 9x9, 12x12, 18x18, and 36x36 modes, and a mesh-style routing fabric. Power is managed via the Intel SmartVID or fixed-VCC scheme; the C3 speed grade positions this part in the mid-speed tier relative to the faster C4 and I3/I4 industrial grades. Programmable I/O banks support LVDS, LVCMOS, HSTL, SSTL, and various memory interfaces including DDR3 with read/write leveling. Typical applications include high-performance digital signal processing in defense and radar systems, 100G/40G Ethernet line-card prototyping, baseband processing in wireless infrastructure, ASIC prototyping, and high-throughput data-acquisition cards. The combination of high logic density, abundant transceivers, and large on-chip memory makes it well suited to designs previously targeting mid-range ASICs. When designing with this FPGA, allocate sufficient PCB area for the 1932-ball FC-FBGA footprint (typically 45x45mm), ensure a low-impedance 0.9V core rail with proper decoupling, and use the Quartus Prime design suite for place-and-route. Note that the C3 commercial temperature grade limits deployment to controlled thermal environments - migrate to an I3 or I4 industrial variant for harsher conditions. This page synthesizes distributor pricing, drop-in Stratix IV GX alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP4SGX360NF45C4 - Stratix IV GX FPGA, 353K LE, 1932-FCBGA | Intel
EP4SGX360NF45C4

EP4SGX360NF45C4 - Stratix IV GX FPGA, 353K LE, 1932-FCBGA | Intel

The Intel (formerly Altera) EP4SGX360NF45C4 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 353,600 logic elements, 14,144 Adaptive Logic Modules (LABs), 920 user I/Os, and 23,105,536 bits of embedded memory in a 1932-ball flip-chip BGA (FC-FBGA) package. Built on a 40nm process with a 0.9V core voltage, it delivers high-performance parallel DSP and SERDES-based transceiver capability for wired communications, signal processing, and high-throughput data-pipeline designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, routing, and I/O can be customized by the user after manufacture. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy: programmable logic -> reconfigurable logic -> FPGA -> programmable logic device (PLD) -> standard logic IC. The Stratix IV family specifically combines general-purpose fabric with embedded transceivers, hard memory blocks (M20K), and DSP blocks optimized for high-bandwidth signal chains. Key features of the EP4SGX360NF45C4 include 8.9 Mbits of distributed RAM, 8 transceivers supporting multi-gigabit serial links, dedicated DSP blocks for fixed- and floating-point arithmetic, and SelectRAM+ memory architecture. The 'C4' speed grade indicates a commercial-temperature operating range, while the NF45 package designation identifies the 45 mm body 1932-ball FC-FBGA. Designers typically pair this device with DDR3/DDR2 memory controllers, multi-lane PCI Express hard IP, and SERDES reference clock networks. Typical applications include high-end test and measurement instrumentation, radar and electronic-warfare baseband processing, high-definition video broadcasting equipment, high-speed packet inspection, and 40G/100G line-card prototyping. Its high logic density makes it suitable for designs that would otherwise require multiple smaller FPGAs, simplifying board layout and BOM. When designing with this part, ensure a 12-layer or thicker PCB with controlled-impedance routing for SERDES lanes; also verify thermal dissipation since a 1932-ball FCBGA package concentrates significant heat flux and benefits from a heatsink or high-airflow chassis.

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EP4SGX360NF45C4N - Stratix IV GX FPGA, 353.6K LE, 1932-FCBGA | Intel
EP4SGX360NF45C4N

EP4SGX360NF45C4N - Stratix IV GX FPGA, 353.6K LE, 1932-FCBGA | Intel

The Intel (formerly Altera) EP4SGX360NF45C4N is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 353,600 logic elements, 14,144 Adaptive Logic Modules (ALMs), and 23,105,536 bits of embedded memory in a 1932-ball flip-chip BGA (FCBGA) package. Built on TSMC's 40 nm process, the device integrates up to 920 user I/Os and embedded transceivers that deliver multi-gigabit serial connectivity for high-bandwidth backplane and chip-to-chip links, while the 0.9 V core voltage keeps dynamic power consumption within the Stratix IV family's documented envelope. An FPGA is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the customer after manufacturing, which distinguishes it from an ASIC (Application-Specific Integrated Circuit) and from a CPLD (Complex Programmable Logic Device). Stratix IV GX sits at the top of the Stratix IV family hierarchy, which itself belongs to Intel's high-performance FPGA product line aimed at communications, signal-processing, and high-throughput data-acquisition systems; within that hierarchy, the EP4SGX360NF45C4N is the largest density point in the family at 353.6K logic elements. Key differentiating features include embedded transceiver channels capable of multi-gigabit-per-second operation, on-chip DSP blocks for high-throughput arithmetic, embedded memory with hardware FIFO controllers, and Partial Reconfiguration (PR) support that allows a portion of the fabric to be reprogrammed while the rest remains active. The NF45C4N speed grade corresponds to the fastest transceiver/performance bin available for this device, and the C4 commercial temperature grade (0 C to 85 C) targets controlled-environment deployments rather than industrial or military ranges. Architecturally, the device pairs an SRAM-based lookup-table fabric with 8-input fracturable ALMs, dedicated 18x18 multipliers that can be combined for higher precision, MLAB (Memory Logic Array Block) tiles, and per-channel PCS (Physical Coding Sublayer) hardware for each transceiver. Engineers typically floorplan around the transceiver locations first because of their tight PCB-routing requirements, then place the global clock network and PLL/DCM blocks before committing the remainder of the design to the standard logic array. Typical applications include high-end telecommunications line cards, radar and electronic-warfare front ends, medical imaging pipelines, broadcast video processing, high-speed test and measurement instrumentation, and ASIC prototyping. The combination of high logic density and integrated serial transceivers makes the part particularly attractive in designs that would otherwise require a discrete ASSP plus external glue logic. Designers should plan power-rail sequencing carefully: the 0.9 V core, 1.1 V PLL/SerDes analog, and 2.5 V/3.3 V I/O rails each require dedicated decoupling and POR (power-on-reset) supervision to avoid latch-up during bring-up. Decoupling must be placed as close as possible to the BGA balls, with the largest bulk capacitors on the opposite side of the PCB. This page synthesizes distributor pricing from eight authorized sources, drop-in same-package alternatives from the Stratix IV GX family, and practical design guidance that complements, rather than duplicates, the manufacturer datasheet.

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EP4SGX360NF45I3 - 360K LE Stratix IV GX FPGA, 1932-BGA | Intel
EP4SGX360NF45I3

EP4SGX360NF45I3 - 360K LE Stratix IV GX FPGA, 1932-BGA | Intel

The Intel (formerly Altera) EP4SGX360NF45I3 is a high-density Stratix IV GX field-programmable gate array (FPGA) with 353,600 logic elements, 14,144 logic array blocks (LABs), and 23,105,536 bits of embedded memory, housed in a 1932-pin flip-chip BGA package. It is fabricated on a 40 nm process and targets high-performance transceiver-based designs in communications, broadcast, and signal-processing systems. What is an FPGA? A field-programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit within the integrated-circuit hierarchy as logic ICs specialized for parallel, high-throughput digital computation. The Stratix IV GX family specifically adds multi-gigabit transceivers, positioning the device between general-purpose FPGAs and ASIC/ASSP solutions for serial connectivity. Key features include 920 user I/Os, integrated transceivers supporting backplane and chip-to-chip serial links, dedicated DSP blocks for high-speed multiply-accumulate operations, and on-chip RAM distributed across M9K and M144K blocks. The device is offered in the I3 industrial speed grade and supports operation across an extended industrial temperature range suitable for baseband and digital-signal-processing cards. From an architectural perspective, the EP4SGX360NF45I3 uses a logic-structure of adaptive logic modules (ALMs) combined with embedded transceivers hardened for protocols such as PCIe, Serial RapidIO, Gbps Ethernet, and CPRI. The 40 nm low-power process and dedicated PLL/clock networks enable deterministic timing closure for multi-gigabit interfaces, which is critical when the FPGA drives or receives data from analog front-ends, ADCs/DACs, or backplane SERDES. Typical applications include high-end wireless baseband processing, software-defined radio (SDR) platforms, video broadcast and imaging pipelines, ASIC prototyping, and high-throughput test and measurement equipment. The combination of logic density and embedded transceivers makes it well suited for designs that previously required an ASIC plus a companion FPGA. When designing with this device, plan the PCB escape pattern for the 1932-ball FCBGA carefully, as signal-integrity routing below the package typically requires a high-layer-count board with microvias and a controlled-impedance stackup. Designers must also budget for configuration memory (EPCS) and a thermal solution capable of dissipating the worst-case transceiver-driven power. This page synthesizes Intel/Altera datasheet parameters, distributor pricing, same-brand same-package drop-in alternatives, and practical design notes for the EP4SGX360NF45I3, complementing the manufacturer handbook with structured engineering context.

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EP4SGX360NF45I3N - 353K LEs, 920 I/O Stratix IV GX FPGA | Intel
EP4SGX360NF45I3N

EP4SGX360NF45I3N - 353K LEs, 920 I/O Stratix IV GX FPGA | Intel

The Intel (formerly Altera) EP4SGX360NF45I3N is a high-density Stratix IV GX Field Programmable Gate Array built on TSMC's 40 nm process, integrating 353,600 logic elements, 23,105,536 bits of embedded memory, and 920 user I/Os in a 1932-ball FC-BGA package. The 'I3' speed grade and 'N' suffix denote the industrial temperature range (-40C to +100C) and lead-free RoHS-compliant assembly, while the 'F45' package designation defines the 45 mm flip-chip BGA with 1.0 mm ball pitch. An FPGA (Field Programmable Gate Array) is a reprogrammable logic device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. Stratix IV GX parts sit in the high-end FPGA taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor, optimized for system bandwidth and signal integrity in wireline, wireless, and high-speed serial applications. The EP4SGX360NF45I3N delivers up to 8.5 Gbps transceiver operation through its integrated GX transceivers, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI. With 14,144 adaptive logic modules (ALMs), 17.7 Mbits of MLAB memory, and Programmable Power Technology, this device targets high-performance systems requiring both massive parallelism and low static power consumption. Each transceiver channel consumes typically 200 mW at 6.5 Gbps, enabling high-density multi-channel line cards. Architecturally, the EP4SGX360NF45I3N combines a sea-of-ALM fabric with dedicated memory blocks, DSP blocks, PLLs, and PCIe hard IP, allowing designers to instantiate complex multi-gigabit serial interfaces without consuming soft logic. The 40 nm process delivers roughly 35% lower dynamic power than the prior 65 nm Stratix III generation, while Programmable Power Technology allows unused logic to operate at near-zero static current. Typical applications include high-end wireline networking line cards (40G/100G OTN), wireless baseband processing, military radar and electronic-warfare systems, and broadcast video infrastructure. The 1932-ball FC-BGA package supports the high pin density required for parallel memory interfaces (DDR3/QDRII+) and multiple multi-gigabit transceivers simultaneously. When designing with this device, plan power architecture for the 0.9 V core rail and the 1.1 V/1.5 V/1.8 V/2.5 V/3.0 V I/O rails using the PowerPlay Early Power Estimator. Use controlled-impedance routing for all transceiver channels and follow the Stratix IV GX pin-out guide for recommended decoupling. Lead time for this NRND-era part should be confirmed via franchised distributors. This page synthesizes real-time distributor pricing, package-compatible same-family alternatives, and Stratix IV GX-specific design notes that go beyond what the manufacturer datasheet alone provides, including cross-references to other 360K-LE Stratix IV devices in the same NF45 package.

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EP4SGX360NF45I4 - Stratix IV GX FPGA, 353.6K LEs, 1932-FCBGA | Intel
EP4SGX360NF45I4

EP4SGX360NF45I4 - Stratix IV GX FPGA, 353.6K LEs, 1932-FCBGA | Intel

The Intel (formerly Altera) EP4SGX360NF45I4 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) delivering 353,600 logic elements, 23,105,536 bits of embedded memory, and 920 user I/O pins in a 1932-ball FC-BGA (NF45) package. Built on TSMC's 40nm process with a 0.9V core, the device integrates up to 14,144 LABs and supports a maximum clock frequency of 717 MHz, combining high logic density with multi-gigabit serial transceiver capability that defines the Stratix IV GX family. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), embedded memory, DSP slices, and programmable I/O that the user defines after manufacture using an HDL such as Verilog or VHDL. Within the broader semiconductor hierarchy, an FPGA is a type of programmable logic device (PLD) sitting alongside CPLDs (Complex Programmable Logic Devices); high-end FPGAs like Stratix IV GX occupy the high-performance, high-density tier typically used for ASIC prototyping, signal processing, and high-throughput data acquisition, while CPLDs serve lower-density glue-logic tasks. The Stratix IV GX architecture integrates embedded transceivers operating up to 8.5 Gbps, hard memory controllers, and DSP blocks alongside the general-purpose fabric, making the family well suited for high-bandwidth applications. The EP4SGX360NF45I4 in particular delivers eight transceiver channels per device, a feature that simplifies PCB layout for protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, and SATA. With 23 Mbits of embedded RAM organized in M9K/M144K blocks, the device supports wide datapath designs and high-throughput buffer schemes. The NF45 package provides a 45 mm square footprint with flip-chip solder balls to the PCB land pattern. Industrial temperature grade (-40C to +100C ambient, I-suffix) makes this part suitable for harsh-environment deployment. The -I4 speed grade places it in the mid-to-fast bin of Stratix IV GX silicon, with Fmax up to 717 MHz for critical paths. Design entry uses the Quartus II design suite (recently rebranded Quartus Prime), with a mature IP library covering memory controllers, transceiver PHYs, and PCIe hard cores. Typical applications include telecom backplane bridges using XAUI/Serial RapidIO, ASIC prototyping for high-pin-count designs, industrial video processing pipelines, and high-speed data acquisition systems. Compared to ASICs, this FPGA offers design flexibility and faster time-to-market at the cost of unit economics above ~100k-unit volumes.

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EP4SGX360NF45I4N - 353.6K LE Stratix IV GX FPGA, 1932-FCBGA | Intel
EP4SGX360NF45I4N

EP4SGX360NF45I4N - 353.6K LE Stratix IV GX FPGA, 1932-FCBGA | Intel

The Intel (Altera) EP4SGX360NF45I4N is a high-density Stratix IV GX Field Programmable Gate Array delivering 353,600 logic elements in a 1932-ball flip-chip BGA (FC-FBGA) package, manufactured on a 40 nm process with a 0.9 V core voltage. The device is part of the Stratix IV GX family that integrates up to 920 user I/O pins and 14,144 LABs (Logic Array Blocks), making it one of the largest members of the family. The 'I4' speed grade and 'N' suffix denote industrial temperature range (-40 °C to +100 °C) and lead-free / RoHS-compliant packaging. What is an FPGA (Field Programmable Gate Array)? An FPGA is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon IP such as transceivers, DSP blocks, and block RAM. Within the broader semiconductor taxonomy, an FPGA sits alongside microcontrollers, ASICs, and CPLDs in the digital logic / programmable logic category. The Stratix IV GX family specifically targets high-speed serial I/O (SERDES) applications, integrating up to 24 transceivers per device for protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and CEI-6G. Key features of the EP4SGX360NF45I4N include 23,105,536 bits of embedded memory, hardened PCIe Gen1/Gen2 IP blocks, dedicated DSP blocks for fixed- and floating-point math, and a comprehensive clock management network with PLLs. The 40 nm process enables lower static power versus prior 65 nm Stratix III devices while supporting high toggle rates required by 6.375 Gbps transceivers. Architecturally, the EP4SGX360NF45I4N uses Altera's Adaptive Logic Module (ALM) - an 8-input fracturable LUT supporting any 6-input LUT plus two independent outputs - giving higher effective logic utilization than 4-input LUT architectures. Embedded memory blocks (M512, M4K, and M-RAM blocks) can be concatenated to build FIFOs and large buffers, while the variable-precision DSP blocks handle 18x18 and 36x36 multipliers, accelerating signal-processing pipelines. Typical applications include high-speed serial interface bridging (PCIe Gen2 endpoint / root-port designs, XAUI backplanes), radio baseband processing, test-and-measurement instrumentation front-ends, military and aerospace signal processing, and high-end ASIC prototyping. The wide transceivers and abundant logic make the EP4SGX360NF45I4N a common choice for protocol bridging and FPGA-based co-processing where discrete ASSPs are unavailable. When designing with this device, ensure that PCB layout supports the flip-chip BGA with controlled-impedance transceiver lanes and adequate via-in-pad or microvia fan-out. Decoupling must follow the Quartus II power distribution network guidelines; an isolated, low-noise 0.9 V core supply with bulk and ceramic decoupling is critical. Power estimation should be performed early using the Quartus Early Power Estimator (EPE) spreadsheet, since a fully populated EP4SGX360NF45I4N can draw tens of amps on the core rail. This page synthesizes distributor stock indicators, drop-in alternatives in the same 1932-FCBGA footprint, and practical PCB / power-distribution design notes not found in the standalone manufacturer datasheet, so engineers can accelerate second-source decisions and layout planning for Stratix IV GX designs.

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EP4SGX530HH35C2 - Stratix IV GX FPGA, 531200 Cells, 1152-BGA | Intel
EP4SGX530HH35C2

EP4SGX530HH35C2 - Stratix IV GX FPGA, 531200 Cells, 1152-BGA | Intel

The Intel EP4SGX530HH35C2 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 531200 logic elements across 212480 Configurable Logic Blocks (CLBs), with 28033024 bits of embedded memory and 564 maximum user I/O pins, housed in a 1152-ball Fine-Pitch Ball Grid Array (FBGA-1152 / HBGA-1152) package. Built on a TSMC 40 nm CMOS process, the part belongs to the Stratix IV GX family and integrates up to 24 high-speed transceivers operating at up to 8.5 Gbps, hardware DSP blocks, and dedicated PCI Express hard IP, making it suitable for high-throughput serial connectivity and parallel DSP workloads. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, I/O cells, and embedded memory/DSP/multiplier blocks that can be re-programmed after manufacture to implement arbitrary digital circuits. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix IV GX family specifically targets high-speed serial interface, high-density DSP, and embedded-processor applications, and is positioned below newer Stratix V/10 families but above Cyclone and MAX families in Intel/Altera's portfolio in terms of logic density, transceiver speed, and DSP throughput. Key features of the EP4SGX530HH35C2 include 531200 logic elements, 212480 CLBs, 28033024 bits of embedded memory, hard IP for PCI Express Gen1/Gen2, dedicated DSP blocks, programmable power technology, and transceiver tiles supporting protocols such as PCIe, XAUI, Serial RapidIO, and CPRI. The 1152-BGA package supports a wide user I/O count (up to 564) plus dedicated transceiver, clock, and configuration pins, allowing very high pin-count designs to be implemented in a single device. The architecture is built around ALM (Adaptive Logic Module) blocks, M9K/M144K embedded memory blocks, and 18x18 multiplier/accumulator DSP blocks with up to ~1.3 GMACS throughput. Transceiver tiles are arranged in groups of four (quad), each with dedicated physical coding sublayer (PCS) and physical medium attachment (PMA) blocks that simplify high-speed serial design while keeping the FPGA fabric flexible. Typical applications include high-end telecommunications line cards, wireless baseband processing, test and measurement equipment with high-speed serial I/O, radar and signal-intelligence platforms, medical imaging (ultrasound beamforming), and high-performance computing accelerators. The combination of high logic density and embedded transceivers makes it well-suited to designs that previously required an FPGA plus an external PHY. When designing with the EP4SGX530HH35C2, careful PCB layout is essential: a multi-layer PCB (typically 10-16 layers for a 1152-BGA at 1.0 mm pitch) with continuous ground and power planes, controlled-impedance routing for transceiver channels, and proper decoupling are mandatory for signal integrity and robust power delivery. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix IV GX family, comparison data, and PCB-level design notes not found in any single manufacturer datasheet.

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EP4SGX530HH35C2N - Stratix IV GX FPGA 531K LE | Intel | BGA-1152
EP4SGX530HH35C2N

EP4SGX530HH35C2N - Stratix IV GX FPGA 531K LE | Intel | BGA-1152

The Intel (formerly Altera) EP4SGX530HH35C2N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) with 531,200 logic elements (LE), 28,033,024 bits of embedded memory, and integrated transceivers, housed in a 1152-ball FC-HFBGA (flip-chip fine-pitch BGA) package measuring 42.5 mm x 42.5 mm. It belongs to the Stratix IV GX family optimized for high-speed serial connectivity and signal-processing workloads. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected by a programmable routing fabric. FPGAs sit within the broader hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix IV GX family specifically targets applications requiring multi-gigabit transceivers and parallel DSP performance, bridging the gap between ASIC-level integration and discrete logic design. Key features include 21,248 adaptive logic modules (ALMs), 564 user I/O pins, embedded 8-input lookup tables (LUTs), dedicated DSP blocks, and hard PCI Express Gen1/Gen2 IP cores. The device operates from a 0.9 V core supply with auxiliary rails for transceivers and I/O banks, and supports I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL across multiple voltage-referenced banks. The architecture combines a 40 nm process node with embedded transceivers capable of data rates up to 8.5 Gbps, enabling protocols such as PCIe Gen2, Serial RapidIO, XAUI, and custom serial links. Hard memory controllers and dedicated circuitry for DDR2/DDR3 SDRAM interfaces reduce soft-logic overhead and accelerate timing closure. Typical applications include high-end telecommunications infrastructure (OTU/SONET/SDH line cards, baseband processing), high-performance computing acceleration, ASIC prototyping, broadcast video processing, and defense signal-intelligence systems. The transceiver-rich fabric suits designs requiring multiple high-speed serial links alongside deep logic capacity. Designers should plan PCB layout for a 1152-ball flip-chip BGA with high-speed transceiver channels routed with controlled impedance. Decoupling strategy must address the multi-rail power architecture: separate core, PLL, transceiver, and I/O bank supplies each require their own bypass network. Thermal management is critical because the 42.5 mm package body concentrates significant power dissipation across the substrate. This page synthesizes distributor pricing, drop-in alternatives, design considerations, and lifecycle status that go beyond the manufacturer datasheet itself, providing engineering decision support for Stratix IV GX selections.

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EP4SGX530HH35C2NES - 531K LE Stratix IV GX FPGA, 1152-FCBGA
EP4SGX530HH35C2NES

EP4SGX530HH35C2NES - 531K LE Stratix IV GX FPGA, 1152-FCBGA

The Altera (now Intel) EP4SGX530HH35C2NES is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 531,200 logic elements and 564 user I/O pins in a 1152-ball Flip-Chip FineLine BGA (FC-HFBGA) package measuring 42.5 mm x 42.5 mm. The device is supplied from a 0.9 V core rail and is rated for the commercial 0 C to 85 C operating range, with an internal clocking fabric rated up to 800 MHz per the manufacturer specification. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data after manufacture. FPGAs sit at the top of the programmable-logic hierarchy - below them are CPLDs (smaller, non-volatile, glue-logic oriented) and above them are ASICs (volume-optimized fixed-function ICs). The Stratix IV GX family specifically combines high logic density with up to 24 transceivers supporting multi-gigabit serial protocols, positioning the device between pure logic-centric FPGAs and dedicated SerDes ASSPs. Key features of this part include 531,200 logic elements, 28,033,024 bits of embedded memory, dedicated DSP blocks for fixed- and floating-point arithmetic, 8.5 Gbps-capable transceivers on Stratix IV GX, and a configuration controller supporting passive, active, and JTAG programming modes. The 1152-ball FCBGA package exposes 564 user I/Os with mixed-voltage support through banked I/O structures, and the flip-chip thermal interface enables sustained operation in space-constrained line cards. Architecturally, the EP4SGX530HH35C2NES uses Adaptive Logic Modules (ALMs) feeding a hierarchical routing fabric, with M20K and MLAB memory blocks distributed column-wise, and variable-precision DSP blocks adjacent to those columns. Compared with the preceding Stratix III family, Stratix IV adds 8.5 Gbps transceivers and improved power management through hard PCIe Gen1/Gen2 IP blocks; compared with the successor Stratix V, the device trades lower power and higher transceiver rate (up to 14.1 Gbps) for the lower cost per logic element that the mature 40 nm process enables. Typical applications include high-performance digital signal processing in defense radar and electronic-warfare systems, ASIC prototyping for networking ASICs, multi-gigabit serial backplane aggregation in telecom line cards, video broadcast infrastructure with on-chip transceivers, and high-throughput PCIe Gen2 endpoint designs. The device's combination of logic density and integrated transceivers lets designers replace multiple smaller FPGAs or a discrete SerDes plus FPGA pair with a single component. When designing with this device, ensure the PCB supports the FCBGA's 1.0 mm ball pitch with matched-length impedance control for transceiver lanes, and provide a multi-rail power solution (typically 0.9 V core, 1.1 V PLL, 2.5 V/3.3 V I/O banks) with proper sequencing. Thermal management must consider that the flip-chip BGA draws heat primarily through the balls and PCB copper; a heatsink or thermal interface material is required for sustained full-operation workloads. This page synthesizes distributor pricing for the EP4SGX530HH35C2NES, same-package Stratix IV GX alternatives from the Site MPN list, and practical design notes that complement - rather than duplicate - the manufacturer datasheet.

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EP4SGX530HH35C3 - 531K LE Stratix IV GX FPGA, 564 I/O | Intel
EP4SGX530HH35C3

EP4SGX530HH35C3 - 531K LE Stratix IV GX FPGA, 564 I/O | Intel

The Intel (formerly Altera) EP4SGX530HH35C3 is a high-end Stratix IV GX field-programmable gate array (FPGA) integrating 531,200 logic elements, 21,248 LABs/CLBs, and 28,033,024 bits of embedded RAM in a 1152-ball FCBGA (HFBGA) package with 564 user I/O pins. Built on a 40nm process, the device operates from a 0.87 V to 0.93 V core supply, supports transceiver rates up to 8.5 Gbps, and is engineered for high-bandwidth serial connectivity in networking, broadcast, and high-performance computing. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), programmable interconnects, I/O cells, and on-chip memory that the designer can reconfigure after manufacturing. Within the broader taxonomy, the EP4SGX530HH35C3 sits at the top of the programmable-logic hierarchy: FPGA -> programmable logic device (PLD) -> digital logic IC -> integrated circuit. Stratix IV GX specifically targets applications that require both massive parallel logic capacity and multi-gigabit transceivers on a single die. Key features include 24 full-duplex CDR-capable transceivers with embedded 8B/10B encoders/decoders compliant with IEEE 802.3-2005 Gigabit Ethernet, ±100 ppm clock compensation, and receiver synchronization state machines. The device integrates hard PCIe Gen1/Gen2 IP blocks, up to 1024 multiplier blocks (18x18) for DSP, and PLLs with fractional-N support. Hard memory controllers and 4.5 Mb of TriMatrix embedded memory per logic array block deliver deterministic low-latency data movement. Architecturally, Stratix IV GX uses a 40nm low-power CMOS process with adaptive logic modules (ALMs) that implement 8-input fracturable look-up tables, providing an effective 1.4x density gain over previous generations. The transceiver tiles support a wide range of serial protocols including PCIe Gen2 x8, XAUI, Serial RapidIO, and 10G KR backplanes. Typical applications include 40G/100G optical line-card prototyping, radar and DSP front-ends, ASIC prototyping emulators, and high-frequency trading accelerator cards. The combination of transceivers, DSP blocks, and abundant external memory bandwidth makes this device well-suited to signal-processing workloads. A key design consideration is PCB layout: the 1152-ball FCBGA requires a multi-layer board with microvia stacks, controlled-impedance transceiver channels, and careful power-plane decoupling to meet 8.5 Gbps signal-integrity margins. Reference the Intel Stratix IV GX Handbook for transceiver channel simulation methodology. This page synthesizes distributor pricing, drop-in same-family Stratix IV GX alternatives, and practical design notes not consolidated in the manufacturer datasheet.

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EP4SGX530HH35C3N - Stratix IV GX FPGA 531K LE | Intel | 1152-BGA
EP4SGX530HH35C3N

EP4SGX530HH35C3N - Stratix IV GX FPGA 531K LE | Intel | 1152-BGA

The Intel (formerly Altera) EP4SGX530HH35C3N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 531,200 logic elements, 28,033,024 bits of embedded memory, and 21248 Logic Array Blocks (LABs / CLBs) in a 1152-ball HBGA package measuring 42.50 x 42.50 mm. According to the verified manufacturer data, the device integrates 564 user I/O pins and operates from 0C to 85C commercial temperature range. Built on a 40 nm process, the Stratix IV GX family targets high-speed serial I/O, signal-processing bandwidth, and high-logic-density applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined by the user after manufacture via a hardware description language (HDL) and a configuration bitstream. FPGAs sit between fixed-function ASICs and software-programmable processors: they deliver ASIC-class parallelism and throughput while retaining the re-programmability of software. Within the broader silicon taxonomy, an FPGA is a programmable logic device (PLD), a sub-category of logic ICs under Integrated Circuits, and ultimately a member of the power-managed semiconductor family. The Stratix IV GX sub-family specifically adds multi-gigabit transceivers for high-bandwidth serial connectivity. Key features include 8.5T transceivers on the GX variant, embedded 10/100/1000 Ethernet MACs, and an internal clock network supporting up to 800 MHz operation. The HBGA-1152 package provides high-density signal escape with low inductance, making it suitable for high-performance systems requiring dozens of differential pairs. The 40 nm process technology balances performance and power consumption while delivering robust logic capacity. Typical applications include high-end communications infrastructure (40G/100G line cards, wireless baseband), real-time signal processing for radar and test & measurement, ASIC prototyping, broadcast video processing, and industrial automation requiring deterministic hardware acceleration. The 1152-ball package is also well suited for high-density parallel interfaces and memory-rich subsystems. When designing with this device, ensure the PCB provides adequate thermal dissipation given the 42.5 mm body size and use Altera's Quartus II design software (or the Intel Quartus Prime subscription) for synthesis, place-and-route, and timing closure. The C3 speed grade denotes a specific performance bin - engineers should consult the Stratix IV Device Handbook for detailed timing models.

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