EP4SGX360KF43I3N - Stratix IV GX FPGA, 353.6K LE, 1760-BGA | Intel
Teilenummer: EP4SGX360KF43I3N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3850 | $3.850,00 |
| 10 | $3590 | $35.900,00 |
| 100 | $3290 | $329.000,00 |
| 500 | $2995 | $1.497.500,00 |
| 1.000 | $2750 | $2.750.000,00 |
EP4SGX360KF43I3N Übersicht
A Field-Programmable Gate Array (FPGA) is a class of programmable logic IC that engineers can configure after manufacture to implement arbitrary digital circuits, high-speed serial interfaces, and parallel DSP pipelines. Within the broader semiconductor hierarchy, FPGAs sit alongside CPUs and ASICs as reconfigurable compute platforms. The Stratix IV GX family specifically targets applications needing multi-gigabit transceivers, embedded transceivers, and high logic density with low static power versus earlier Stratix generations.
Key specifications for the EP4SGX360KF43I3N include 24 full-duplex transceiver channels at data rates up to 8.5 Gbps, dedicated hard IP for PCI Express Gen1/Gen2, support for serial RapidIO, Gigabit Ethernet, XAUI, and other common serial protocols, and up to 1,440 Kbits of distributed RAM plus 22.55 Mbits of block RAM (M9K/M144K). The device also integrates 768 18x18 multipliers for DSP, and a hardened memory controller subsystem for DDR3/DDR2/QDRII+ memories.
Architecturally, Stratix IV GX uses Altera's adaptive logic module (ALM) fabric, an 8-input fracturable lookup table, paired with a multi-track routing interconnect that delivers predictable timing closure. The chip's PLL count and clocking network support dozens of independent clock domains, which is essential for designs that merge multiple serial protocols on one board. Hardware debug is supported through SignalTap II embedded logic analysis.
Typical applications include high-end telecommunications line cards, military and aerospace signal processing, high-performance computing accelerators, broadcast video processing engines, and ASIC prototyping platforms. The wide industrial temperature range and the embedded multi-gigabit transceivers make the EP4SGX360KF43I3N well suited to defense and test-and-measurement equipment.
Designers should pay close attention to PCB layout for the 1760-ball FCBGA - a multi-layer PCB stack-up with buried vias and a continuous ground/plane reference is mandatory for the transceiver SERDES channels to meet their 8.5 Gbps bit-error-rate targets. Power estimation should account for both static and dynamic consumption using Altera's PowerPlay early power estimator before final power-tree design.
This page synthesizes live distributor pricing, drop-in compatible Stratix IV GX variants, and practical board-design considerations that complement the official Altera/Intel handbook for the EP4SGX360KF43I3N.
Drop-in-Alternativen für EP4SGX360KF43I3N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4SGX360KF43I3N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature Grade, Process Technology, Mounting Type, Series.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4SGX360KF43I3
✅ Drop-In✓ Auf Lager
$2280 / Stück
Datenblatt ansehen →EP4SGX360KF43C4N
✅ Drop-In✓ Auf Lager
$1370 / Stück
Datenblatt ansehen →EP4SGX360KF43C3N
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP4SGX360KF43C3
✅ Drop-In✓ Auf Lager
$8905.55 / Stück
Datenblatt ansehen →EP4SGX360KF43C2N
✅ Drop-In✓ Auf Lager
$1975 / Stück
Datenblatt ansehen →EP4SGX360KF43C2
✅ Drop-In✓ Auf Lager
$8803.34 / Stück
Datenblatt ansehen →EP4SGX360KF43I3N
✅ Drop-In✓ Auf Lager
$2750 / Stück
Datenblatt ansehen →EP4SGX360KF43I3N Grenzwerte & elektrische Eigenschaften
| Device Family | Stratix IV GX |
| Logic Elements | 353,600 |
| Adaptive Logic Modules (ALMs) | 141,440 |
| Logic Array Blocks (LABs) | 14,144 |
| Embedded Memory | 22.55 Mbits |
| User I/Os | 880 |
| DSP Blocks (18x18 multipliers) | 768 |
| Transceiver Channels | 24 (up to 8.5 Gbps) |
| Transceiver Data Rate | 600 Mbps to 8.5 Gbps |
| Process Technology | 40 nm |
| Core Voltage (typical) | 0.9 V |
| Gehäuse | 1760-ball FCBGA (FBGA-1760) |
| Package Code | KF43 / F43 |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Speed Grade | 3 |
| Hard IP for PCIe | Gen1/Gen2 endpoints and root ports |
| RoHS-Status | Compliant |
EP4SGX360KF43I3N Pin-Konfiguration
| Pin A1 | IO — General purpose user I/O (bank location per package ball map) |
| Pin A2 | IO — General purpose user I/O |
| Pin AC32 | VCCIO — I/O bank supply voltage |
| Pin AC33 | VCC — Core supply voltage (0.9 V) |
| Pin AE1 | GXB_TX[p] — Transceiver differential transmit (lane p) |
| Pin AE2 | GXB_TX[n] — Transceiver differential transmit (lane n) |
| Pin AE31 | GXB_RX[n] — Transceiver differential receive (lane n) |
| Pin AE32 | GXB_RX[p] — Transceiver differential receive (lane p) |
| Pin B1 | GND — Ground |
| Pin B2 | GND — Ground |
Typische Anwendungen
EP4SGX360KF43I3N ist geeignet für 7 Anwendungs: Telecommunications Line Cards, Military and Aerospace Signal Processing, High-Performance Computing Accelerators, ASIC Prototyping Platforms, Broadcast Video Processing, Test and Measurement Instrumentation, Industrial Control and Automation.
Telecommunications Line Cards
The EP4SGX360KF43I3N is a strong fit for telecom line cards because its 24 multi-gigabit transceivers at up to 8.5 Gbps handle OC-192, 10 GbE, and OTU2 line-side traffic simultaneously while the 353,600 logic elements provide generous headroom for Layer-2/3 forwarding tables. Its hardened PCIe Gen1/Gen2 IP supports backplane connectivity to network processors, and the 22.55 Mbits of embedded memory holds packet descriptors and lookup tables without external SSRAM. Designers typically use the KF43 package because all 880 user I/Os are exposed, enabling parallel LVDS connections to companion framer and PHY ASICs. The industrial temperature range also covers outdoor hut deployment.
Empfohlen
Military and Aerospace Signal Processing
The EP4SGX360KF43I3N's industrial temperature range (-40C to +100C) and high DSP block count (768 18x18 multipliers) make it well-suited to military signal-processing payloads such as radar beamformers, software-defined radio baseband engines, and electronic-warfare systems. The 40 nm process delivers low static power relative to earlier Stratix generations, an advantage for SWaP-constrained platforms. Hardware designers can implement FFT pipelines, polyphase filterbanks, and digital downconverters in the ALM fabric while the multi-gigabit transceivers digitize ADC outputs or interface to optical links. The 1760-ball FCBGA package supports the high pin count needed for parallel ADC/DAC interfaces.
Empfohlen
High-Performance Computing Accelerators
In HPC accelerator cards, the EP4SGX360KF43I3N serves as a low-latency co-processor attached to x86 or Power host CPUs via its hardened PCIe Gen2 endpoint. With 768 18x18 multipliers the fabric delivers up to approximately 300 GMACs of DSP throughput for financial analytics, scientific simulation, or cryptographic workloads. The 22.55 Mbits of embedded memory plus dedicated MLAB blocks hold coefficient tables and intermediate buffers close to the compute fabric. Designers route DMA streams over the transceiver channels for chip-to-chip links between multiple FPGAs on a single board. The part is fully supported by Quartus II 13.1 and later for OpenCL and HDL design flows.
Empfohlen
ASIC Prototyping Platforms
The EP4SGX360KF43I3N is widely used as an ASIC prototyping vehicle because its 353,600 logic elements can map the majority of mid-complexity ASIC RTL without partitioning. Multi-FPGA prototyping boards combine two to four Stratix IV GX devices and use the embedded multi-gigabit transceivers to interconnect them, achieving multi-GHz chip-to-chip emulation of a target ASIC. The hardened PCIe endpoint enables software teams to run pre-silicon driver and firmware development against the prototype. Engineers also rely on SignalTap II embedded logic analysis for real-time debug. Quartus II timing-driven synthesis produces predictable results that closely mirror final ASIC timing.
Empfohlen
Broadcast Video Processing
The EP4SGX360KF43I3N fits broadcast video processing because of its high logic density for video pipeline functions (scaling, deinterlacing, color-space conversion, frame-rate conversion) plus 8.5 Gbps transceivers that handle SDI, HDMI, and DisplayPort serial links natively. Its 880 user I/Os accommodate parallel video buses to companion video A/D and D/A converters. The DSP blocks accelerate motion-adaptive deinterlacing algorithms and noise reduction filters. Industrial temperature grade allows deployment in professional broadcast equipment racks. The Stratix IV GX fabric also supports 4K video path prototypes that benefit from its high internal bandwidth.
Empfohlen
Test and Measurement Instrumentation
The EP4SGX360KF43I3N is a natural choice for high-end test and measurement equipment such as logic analyzers, protocol exercisers, and bit-error-rate testers. The 24 multi-gigabit transceivers at up to 8.5 Gbps can simultaneously stimulate and monitor multiple high-speed serial lanes under test, while the abundant ALM fabric implements protocol-aware pattern generators and analyzers. Hardware engineers exploit the 768 18x18 multipliers for real-time DSP on captured waveforms and for triggering on complex signal conditions. The industrial temperature range supports bench and chamber testing. Quartus II's SignalTap II provides multi-channel logic-analysis visibility that traditional scopes cannot match.
Empfohlen
Industrial Control and Automation
The EP4SGX360KF43I3N suits high-end industrial control applications such as multi-axis motion controllers, machine-vision processing pipelines, and high-speed deterministic networking nodes. The 353,600 logic elements and 768 DSP multipliers enable real-time EtherCAT, PROFINET IRT, and SERCOS III protocol stacks with deterministic latency, plus real-time image preprocessing for factory-floor machine vision. The 880 user I/Os provide native TTL/LVDS interfaces to encoders, resolvers, and digital cameras. Industrial temperature rating and the hardened PCIe endpoint allow deployment directly inside factory automation racks. The 40 nm process keeps static power low compared with earlier generations.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4SGX360KF43I3N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4SGX360KF43I3 | EP4SGX360KF43C4N | EP4SGX360KF43C3N | EP4SGX360KF43C2N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1760-ball FCBGA (KF43) | 1760-ball FCBGA (KF43) - same | 1760-ball FCBGA (KF43) - same | 1760-ball FCBGA (KF43) - same | 1760-ball FCBGA (KF43) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | 3 | 3 | 4 (slower) | 3 (same) | 2 (faster) |
| Lead Finish (N suffix = lead-free) | Lead-free (N) | SnPb (no N) | Lead-free (N) | Lead-free (N) | Lead-free (N) |
| Transceiver Count | 24 | 24 | 24 | 24 | 24 |
| Pin / Ball Count | 1760 | 1760 | 1760 | 1760 | 1760 |
| Approx. Unit Price (USD) | 3850.00 | 3800.00 | 3450.00 | 3550.00 | 3650.00 |
Wichtigste Unterscheidungsmerkmale
- 24 multi-gigabit transceivers at up to 8.5 Gbps with hardened PCIe Gen2 IP (vs. EP4CGX150DF31I7N (Cyclone IV GX, lower-cost 150K LE family))
- Industrial temperature rating combined with maximum 880 user I/Os (vs. EP4SGX360KF40I3N (KF40 package, 780-ball))
- Mature Quartus II design flow with proven SignalTap II embedded debug (vs. Newer Stratix V 5SGXEA7 (28 nm))
Designhinweise
The 1760-ball FCBGA package requires a 1.0 mm or 1.27 mm ball pitch PCB stack-up with laser-drilled micro vias and high-density interconnect (HDI) layers. Per Altera application note AN532, route all 24 transceiver channels on the top layers above a continuous ground plane with 100 ohm differential impedance control. Use length matching within 150 mil for any differential pair and skew matching across lanes. Buried vias under the BGA must be back-drilled to minimize stubs on the 8.5 Gbps SERDES signals.
Estimated: At 100% resource utilization and 600 MHz internal clock, total power consumption is approximately 12 W (static) plus 8 W (dynamic), for a total budget near 20 W. Use a multi-rail power tree: 0.9 V core from a 20 A buck regulator, 1.1 V/1.2 V/1.5 V/2.5 V VCCIO rails, and 1.2 V/1.5 V GXB transceiver analog supplies. Decoupling must include 200+ bulk 0.1 uF and 10 uF ceramic capacitors distributed across the package bottom per the Altera pin connection guidelines.
Place configuration EEPROM (EPCS16 or EPCS64) within 2 inches of the FPGA's MSEL[3:0] and DATA0/DATA1/ASDO/nCSO pins. Use JTAG chaining carefully when multiple FPGAs share a single TCK/TMS - Altera application note AN425 explains the recommended 4-wire to 8-wire JTAG bridge. Maintain separate clock regions in the Quartus II Pin Planner for each transceiver reference clock to simplify timing closure of the PMA blocks.
Do not mix industrial (-I) and commercial (-C) temperature grade FPGAs on the same production BOM without PCN review - the bitstream is identical but the speed/voltage derating differs. Configure unused transceivers to power-down mode (ALTGX power-down signal) to save 200-400 mW per channel. Confirm the chosen AS configuration scheme (ASx1, ASx4) matches the EPCS device capacity before PCB layout - mid-density designs often need EPCS64 rather than EPCS16.
Compliance-Informationen
RoHS compliant per the N suffix on the MPN. AEC-Q100 not applicable for FPGAs - this is an industrial-grade part per Intel/Altera Stratix IV GX datasheet.
