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TJA1462BT - CAN FD SIC Transceiver, SO8, Standby | NXP
The NXP TJA1462BT is a CAN FD signal improvement capability (SIC) transceiver with Standby mode in an 8-pin SO (SOIC-8) package, supporting data rates up to 8 Mbit/s on the CAN bus. It is part of the TJA146x family that implements CAN Signal Improvement Capability (SIC) per ISO 11898-2:2024 third edition and CiA 601-4, with full interoperability to classical CAN and CAN FD controllers. A CAN transceiver (sometimes called a CAN bus transceiver or CAN physical-layer interface) is the analog interface between a digital CAN protocol controller and the differential CAN bus wires. It converts digital transmit (TXD) bits from the controller into differentially driven bus levels on CANH and CANL, and converts received bus levels back into digital RXD bits, providing galvanic isolation level shifting and ESD protection for the controller. Key features include bus signal improvement that reduces ringing on the CAN bus, allowing larger topologies and higher data rates than classical HS-CAN transceivers. The device operates from a 4.5 V to 5.5 V VCC supply, supports up to 8 Mbit/s in CAN FD networks, and offers a low-power Standby mode entered via the STB pin. The TJA1462 is intended as a pin-compatible drop-in replacement for the TJA1042 or TJA1044 from NXP, enabling direct retrofit without hardware or software changes. The architecture uses a fully differential driver with slope control and integrated bus failure protection, including TXD dominant time-out, bus dominant time-out, and overtemperature shutdown. Receiver symmetry is trimmed to provide reliable operation at recessive voltages as low as 0.5 V on the bus. Typical applications include automotive ECUs, body control modules, gateway ECUs, industrial CAN nodes, and any node that needs to coexist with mixed CAN FD / classical CAN networks on the same bus segment, where the SIC function reduces the required bit time and improves EMC behavior on long stubs. When designing with the TJA1462BT, place a 100 nF decoupling capacitor close to pin 8 (VCC) and ensure the bus termination (typically 120 ohm at each end of the bus) is present. Use the STB pin to enter Standby when the node is inactive to reduce quiescent current, and verify that the bit timing of the CAN controller remains within ISO 11898-2:2024 limits for SIC operation. This page synthesizes the NXP datasheet, real distributor pricing, drop-in alternatives, application context and design notes not collated in any single manufacturer document.
TJA1463ATK/0Z - CAN SIC Transceiver, 8Mbit/s, Sleep | NXP
The NXP Semiconductors TJA1463ATK/0Z is a CAN Signal Improvement Capability (SIC) transceiver with Sleep mode, supporting CAN FD communication up to 8 Mbit/s and housed in a 14-pin HVSON (SOT1086-1) package. It implements the SIC behavior defined in CiA 601-4 and ISO 11898-2:2024 parameter set C, while remaining fully interoperable with classical CAN and CAN FD nodes defined by ISO 11898-2:2024 and SAE J2284-1 through J2284-5. The /0Z suffix denotes the tape-and-reel, 100% matte-tin lead-free, Pb-free, AEC-Q100-qualified automotive-grade ordering code. A CAN SIC (CAN Signal Improvement Capability) transceiver is a physical-layer device that sits between a CAN protocol controller and the differential CAN bus, translating the controller's TX/RX logic into the bus's dominant/recessive differential signaling. The "signal improvement" function actively damps the dominant-to-recessive edge ringing that traditionally limits CAN FD bus length and stub density, allowing larger topologies than classical HS-CAN. In the system hierarchy it belongs to: CAN transceiver -> network interface IC -> interface IC -> integrated circuit -> semiconductor. Key features include up to 8 Mbit/s CAN FD data rate, tight bit-timing symmetry enabling communication at 5 Mbit/s with a higher node count, an integrated low-power Sleep mode with remote wake-up via bus activity, a separate VIO supply pin for flexible MCU interfacing from 1.8V to 5V, an STB (standby) mode pin, and an ERR output pin that flags local and global bus failures. The HVSON-14 package provides a small PCB footprint with a thermal pad for improved dissipation in ECU environments. Architecturally the TJA1463ATK/0Z combines a high-speed differential bus driver/receiver pair, an internal slope-control/SIC current-shaping network, a low-drop VIO level shifter, a low-quiescent Sleep regulator with bus-wake comparator, and ESD protection rated to IEC 61000-4-2 on the bus pins. The SIC behavior is achieved without external components - just the standard CAN bus termination and a 5V or 3.3V VCC. Typical applications include automotive body controllers, ADAS sensor nodes (radar, lidar, camera ECUs), chassis and powertrain ECUs, battery management systems (BMS) and battery energy storage system (BESS) communication links, industrial CAN FD backbones, and any classical-CAN network that is being migrated to CAN FD with longer cables or more nodes than the legacy bus can support. When designing with this part, ensure VIO matches the host MCU supply, place the bus termination (typically 120 ohm at each bus end) within the recommended layout, and follow NXP's EMC and ESD layout guidance in the application notes. The Sleep pin and the VIO domain must be sequenced correctly to enter and exit Sleep cleanly. This page synthesizes distributor pricing, AEC-Q100 compliance status, drop-in pin-compatible alternatives in the TJA146x family, and practical CAN SIC design notes not consolidated in the manufacturer datasheet.
TJF1051T/3/1 - High-Speed CAN Transceiver SOIC-8 | NXP
The NXP TJF1051T/3/1 is a high-speed Controller Area Network (CAN) transceiver that serves as the physical interface between a CAN protocol controller and the differential CAN bus, supplied in an 8-pin SOIC package. It supports CAN data rates up to 1 Mbit/s (classical CAN) and the CAN FD (Flexible Data-rate) extension at higher bus speeds, with versions tailored to common microcontroller I/O voltages. The /3 suffix denotes a 5 V MCU interface variant where VIO is internally tied to VCC, so TXD/RXD logic levels are compatible with 5 V microcontrollers directly. A CAN transceiver is a physical-layer (PHY) device that converts digital logic from a microcontroller into the differential dominant/recessive signaling required by the ISO 11898 CAN bus standard. Inside the broader product taxonomy it sits beneath CAN interface ICs -> network interface ICs -> interface ICs -> integrated circuits. The TJF1051T belongs to NXP's family of third-generation high-speed CAN transceivers designed to replace the legacy TJA1051/PCA82C250/IFX1051LE predecessors while delivering enhanced electromagnetic compatibility and electrostatic discharge immunity. Key features of the TJF1051T/3/1 include improved EMC/ESD performance compared with earlier generations, ideal passive behavior on the CAN bus when supply voltage is removed (zero load with VCC = 0 V so the bus is not biased by the node), an S (Silent) pin for low-power listen-only mode, and bus-fault protection against automotive transients per ISO 7637. The differential bus pins (CANH, CANL) tolerate typical automotive battery and jump-start voltages present on 12 V systems. Internal architecture combines a high-speed differential driver/receiver pair with thermal shutdown, under-voltage detection on VCC/VIO, bus-dominant time-out protection, and an unpowered node detection that keeps the bus in recessive when the IC is off. Together these blocks implement the CAN physical layer defined in ISO 11898-2:2003, ISO 11898-5:2007 and the pending updated ISO 11898-2:2016 release, including the CAN FD frame format. Typical applications include body-control modules, powertrain networks, electric vehicle battery management (BMS) slave nodes, industrial CANopen and DeviceNet nodes, onboard chargers, and CAN-to-UART bridges for diagnostics. The /3 variant is the right choice when pairing with a 5 V microcontroller, while the non-/3 variant supports a separate VIO rail for 3.3 V MCUs. The TJF1051T/3/1 was developed as a pin-compatible, functionally equivalent upgrade for the TJA1051T/3 in existing automotive CAN networks, allowing reuse of proven PCB footprints. When designing, ensure the bus-termination topology and stub lengths follow ISO 11898-2 to maximize signal integrity at 1 Mbit/s and beyond. The Silent pin enables low-current standby and is required for partial-networking sleep modes. This page synthesizes NXP manufacturer specifications, distributor pricing tiers, cross-brand drop-in alternatives (TCAN1051, MCP2562FD, NCV7342), and practical PCB layout notes - content not compiled on the manufacturer product page alone.
TJF1051T/3/1J - High-Speed CAN Transceiver, SO-8 | NXP
The NXP TJF1051T/3/1J is a high-speed Controller Area Network (CAN) transceiver providing the physical interface between a CAN protocol controller and the differential two-wire CAN bus, packaged in an 8-pin SO (SOIC-8) surface-mount package. It supports data rates up to 5 Mbit/s and implements the CAN physical layer defined by ISO 11898-2:2003, ISO 11898-5:2007, and the pending ISO 11898-2:2016 update. A CAN transceiver is the analog front-end that converts the digital TXD/RXD logic levels of a microcontroller into the differential dominant/recessive signalling required on the CAN bus, while also providing ESD protection, bus fault tolerance, and common-mode rejection. The TJF1051T/3 family adds a VIO level-adapter supply pin that allows direct interfacing to microcontrollers with supply voltages from 3V to 5V, simplifying mixed-voltage designs where the MCU runs at 3.3V but the bus nodes may operate at 5V. Key features include an extremely low ElectroMagnetic Emission (EME) due to built-in slope control on the CANH/CANL outputs, a Silent mode (S) input for low-power bus monitoring without disturbing traffic, and high immunity to ElectroMagnetic Interference (EMI) on the bus lines. The device also includes thermal shutdown, bus dominant time-out protection, and an undervoltage detector on VCC and VIO, ensuring robust behaviour on harsh automotive or industrial bus networks. It is the pin-compatible successor to the TJA1051 with improved EMC behaviour and tighter parametric compliance with the ISO 11898-2:2016 specification. Typical applications include automotive body and chassis CAN nodes, industrial CANopen networks, building automation, and any MCU-to-CAN-bus interface requiring 3.3V or 5V logic compatibility with low EME and high EMI immunity. Compared with older TJA1050/TJA1040 designs, the TJF1051T/3 provides substantially reduced electromagnetic emissions, removing the need for external common-mode chokes in many layouts. When designing with this part, place the VIO decoupling capacitor as close as possible to pin 5 and ensure both VCC and VIO are present before TXD transitions are applied. The Silent mode pin must be tied LOW for normal operation or driven by the MCU when bus diagnostics or low-power standby states are required. The /1 JTR suffix indicates 2500-piece reel packaging.
TJF1052IT - Galvanically Isolated High-Speed CAN Transceiver | NXP
The NXP Semiconductors TJF1052IT is a galvanically isolated high-speed CAN transceiver that provides an isolated interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus, delivered in a 16-pin SOIC package with 1 kV / 2.5 kVrms integrated isolation and 2 Mbps data rate support. According to NXP's product page, this part is specifically targeted at industrial applications where galvanic isolation barriers are required, eliminating the need for a separate digital isolator plus isolated DC-DC bias supply. A CAN transceiver is a physical-layer device that converts digital transmit/receive logic from a CAN controller into the differential voltage signaling required by the ISO 11898-2 CAN bus standard, and vice versa. The TJF1052IT integrates the transceiver with on-chip galvanic isolation, placing it in the hierarchy: physical-layer transceiver -> automotive/industrial bus interface -> CAN interface IC -> Interface IC. Integrated isolation removes the need for external optocouplers, isolation transformers, or digital isolator ICs, simplifying PCB layout and reducing BOM count in industrial CAN nodes. Key features include 2 Mbps CAN FD data rate support, 1 kVrms (variant /1Y) or 2500 Vrms (variant /2Y) isolation withstand voltage, 20 kV/us common-mode transient immunity (CMTI), and integrated isolated DC-DC bias supply so the bus-side node can be fully floating. Variants such as TJF1052IT/1Y, TJF1052IT/2Y, and TJF1052IT/5Y differ primarily in isolation voltage rating, with the /5Y variant qualified for functional safety contexts. The 16-SOIC wide-body (7.50 mm) package provides the clearance and creepage distances needed to meet reinforced insulation requirements. Typical applications include isolated industrial CAN nodes (PROFIBUS-style networks), PLCs, battery management systems, solar inverters, and any industrial control bus where the node must float at high common-mode voltage relative to the host. The device operates from a single 3.3 V or 5 V supply on the logic side and includes thermal shutdown, bus dominant time-out, and TXD/RXD logic pins compatible with standard CAN controllers. When designing with this part, ensure that the wide-body SOIC creepage/clearance around the package meets the end-equipment's pollution degree and over-voltage category. Designers do not need an external isolated bias supply, but should still include proper PCB edge plating and slot routing to preserve the integrated isolation rating. Use NXP's application note on isolated CAN node design for layout guidance.
TJF1052IT/1Y - Isolated High-Speed CAN Transceiver | NXP | 16-SOIC
The NXP TJF1052IT/1Y is a galvanically isolated high-speed CAN (Controller Area Network) transceiver housed in a 16-pin SOIC wide-body (7.50 mm width) package. Per the NXP datasheet, it provides 1000 Vrms of galvanic isolation between a CAN protocol controller and the physical two-wire CAN bus, delivering 2 Mbps data rate capability with 20 kV/µs common-mode transient immunity (CMTI). The device integrates NXP's proprietary isolation technology with the proven TJA1052 CAN physical layer, eliminating the need for a separate digital isolator and isolated DC-DC power supply on the bus side. A CAN transceiver (also called a CAN PHY) is the physical-layer interface between a CAN protocol controller and the differential CAN bus. In industrial systems, galvanic isolation between the low-voltage controller domain and the high-voltage bus domain protects sensitive microcontrollers from ground loops, surge events, and high common-mode voltages. The TJF1052i family extends the standard CAN transceiver by embedding this isolation barrier inside the IC, simplifying PCB layout and reducing BOM count compared to discrete isolator-plus-transceiver designs. Key features include integrated 1 kVrms isolation, 2 Mbps CAN FD (Flexible Data-rate) capability, low loop delay suitable for CAN FD frames, thermal protection, bus-dominant time-out, and a silent mode for selective wake-up. The device supports the ISO 11898-2 physical-layer standard and is specifically targeted at industrial automation, energy distribution, and medical equipment applications where reinforced isolation is mandatory. Internally, the TJF1052i combines a capacitive- or transformer-based isolation barrier with a CAN transceiver core on a single silicon die. The wide-body SOIC package provides the required creepage and clearance distances for 1 kVrms isolation, while the exposed pad aids thermal dissipation during sustained bus transmission. The result is a CAN transceiver that satisfies both functional isolation and basic insulation requirements in a single chip. Typical applications include industrial PLC communication modules, grid-tied smart-meter networking, photovoltaic inverter CAN buses, battery management system (BMS) communication links, electric-vehicle charging-station controllers, and isolated sensor networks in process automation. Designers reach for the TJF1052i when they need CAN connectivity in a high-voltage environment without the complexity of a multi-chip isolated solution. When designing with this part, mind the wide-body 7.50 mm SOIC footprint - it is wider than a standard 150-mil SOIC, so PCB land pattern and creepage must accommodate it. Also confirm that the upstream 5 V or 3.3 V controller rail is well decoupled; the isolated bus side derives its own internal supply through the on-chip isolation transformer/charge pump, so no external isolated supply is required.
TJF1052IT/5Y - Isolated CAN Transceiver 2Mbps 5kV | NXP
The NXP TJF1052IT/5Y is a galvanically isolated high-speed CAN (Controller Area Network) transceiver delivering 2 Mbps data rate across a 5000 Vrms isolation barrier in a 16-pin SOIC (7.50 mm) package. It integrates a CAN protocol controller interface, isolated power, and isolated bidirectional logic signals in a single IC, eliminating the need for external digital isolators, isolated DC-DC converters, and discrete CAN transceivers on the same PCB. An isolated CAN transceiver is a device that bridges a host microcontroller's CAN protocol controller to the physical two-wire differential CAN bus while maintaining galvanic isolation (no direct electrical connection) between the high-voltage bus side and the low-voltage logic side. This category sits within the broader hierarchy of CAN transceivers -> automotive/industrial bus transceivers -> interface ICs -> wired communication ICs. Galvanic isolation is required for safety, ground-loop elimination, and noise immunity when the bus operates at high common-mode voltages relative to the host controller. Key features of the TJF1052IT/5Y include 20 kV/us common-mode transient immunity (CMTI), integrated DC-DC isolation power, ±58 V bus fault protection, and thermal shutdown. The device supports the ISO 11898-2 standard CAN physical layer and is compatible with both classic CAN and CAN FD (Flexible Data-rate) frames up to 2 Mbps. Power dissipation is bounded by the SOIC-16W package's thermal resistance, making it suitable for industrial automation nodes and battery management system peripherals. Architecturally, the TJF1052IT/5Y combines an on-chip coreless-transformer isolation barrier, an isolated CAN physical layer, and a fully integrated isolated power supply. This single-chip integration replaces the typical 3-chip solution (CAN transceiver + digital isolator + isolated DC-DC), reducing BOM count, PCB area, and design complexity while improving reliability through fewer solder joints. Typical applications include industrial automation PLC fieldbus nodes, solar inverter CAN interfaces, battery management system (BMS) slave modules in e-mobility, and railway signaling where reinforced isolation is mandatory. The wide bus fault tolerance also makes it suitable for 24 V truck and 48 V mild-hybrid automotive environments. When designing with this device, note that the integrated isolation removes the requirement for optocouplers, but the PCB layout must still preserve the 5 kV creepage and clearance at the package level. Decoupling capacitors close to the VCC pins on both sides of the isolation barrier are critical for stable CAN signal integrity. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Engineers comparing isolated CAN transceivers will find cross-reference data, parametric tables, and design guidance consolidated for accelerated part selection and PCB reuse.
TLE7250VSJ - 2 Mbit/s CAN FD Transceiver, PG-DSO-8 | Infineon
The Infineon TLE7250VSJ is a high-speed CAN FD transceiver supporting data rates up to 2 Mbit/s, compliant with ISO 11898-2 and housed in a PG-DSO-8 package. It features a digital supply input V_IO and a power-save mode, and is designed to fulfill the enhanced physical layer requirements of CAN FD networks used in automotive body, chassis and powertrain ECUs. According to the Infineon datasheet, the TLE7250V family (TLE7250VLE and TLE7250VSJ) meets or exceeds ISO 11898-2 requirements and supports data rates up to 2 Mbit/s with optimized slew rates for large HS-CAN networks. A CAN transceiver is a physical-layer interface IC that sits between a CAN protocol controller and the differential CAN bus wires (CANH, CANL). It converts single-ended TXD/RXD logic levels from the microcontroller into differential bus voltages defined by ISO 11898-2, and vice versa for reception. The TLE7250VSJ's optimized slew rate limits electromagnetic emission (EME) while preserving signal integrity at 2 Mbit/s, making it suitable for mixed-supply HS-CAN networks where 5 V microcontrollers and 3.3 V MCUs coexist on the same bus. Key features include low EME / high EMI immunity, an integrated V_IO supply input for direct interfacing with 3.3 V or 5 V microcontrollers without level shifters, three operating modes (normal, receive-only, power-save) selectable via NEN and NRM pins, AEC-Q100 qualification for automotive use, and RoHS-compliant halogen-free PG-DSO-8 packaging. Built on Infineon Smart Power Technology (SPT), the device integrates strong ESD and electromagnetic immunity on-chip. Typical applications include automotive gateway ECUs, body control modules, powertrain CAN networks, ADAS sensor CAN buses, and industrial CAN FD nodes. The PG-DSO-8 package supports automated optical inspection (AOI) of solder joints, simplifying automotive-grade manufacturing. When designing the bus termination, ensure 120 ohm termination at each end of the CAN segment and place decoupling capacitors close to VCC and V_IO pins to maintain EMI performance. This page synthesizes distributor pricing, drop-in alternatives and application notes not found in the manufacturer datasheet, helping engineers select, source and lay out the TLE7250VSJ quickly for automotive CAN FD designs.
TLE9222LCXUMA1 - FlexRay Transceiver | TSON-14 | Infineon
The Infineon TLE9222LCXUMA1 is a FlexRay transceiver IC supplied in a 14-pin PG-TSON surface-mount package (3 mm x 4.5 mm body) with an exposed thermal pad. It implements the physical layer of the FlexRay automotive networking standard and is the world's smallest FlexRay transceiver in the market per the manufacturer, addressing tight PCB real-estate constraints in chassis, powertrain and ADAS ECUs. The part supports data rates up to 10 Mbit/s, integrates bus failure management, and provides a low-power standby mode with remote wake-up capability. A FlexRay transceiver is a physical-layer (PHY) device that sits between a microcontroller's FlexRay Communication Controller and the differential FlexRay bus. It converts digital logic-level signals from the controller into differential bus voltages conforming to the FlexRay electrical specification, and vice versa for reception. The transceiver category sits within the broader automotive communication IC hierarchy of transceivers -> interface ICs -> integrated circuits. FlexRay was developed as a deterministic, fault-tolerant backbone for high-speed in-vehicle networking, supporting time-triggered and event-triggered communication with bandwidth up to 10 Mbit/s per channel. Key features of the TLE9222LCXUMA1 include an integrated bus failure detection (open, short-to-GND, short-to-VBAT) with diagnostic output, low standby current consumption for battery-sensitive applications, and an extended automotive temperature operating range. The PG-TSON-14-3 package exposes a thermal pad to the PCB for efficient heat removal through the copper pours. The TLE9222LCXUMA1 part number suffix -XUMA1 indicates reel packaging for high-volume surface-mount assembly. Typical applications for the TLE9222LCXUMA1 include electronic control units in chassis-by-wire systems (steering, braking, suspension), powertrain ECUs, ADAS sensor fusion controllers, and body-domain modules where deterministic, redundant communication is required. The combination of small package footprint, robust bus failure diagnostics, and low-power modes suits compact ECU designs where PCB area is at a premium. When designing with this device, follow Infineon's recommended PCB layout for the exposed thermal pad and use a star-grounding scheme for the bus shield connection. Always consult the manufacturer datasheet for the latest bus failure threshold values and EMC optimization recommendations for the differential bus termination network. This page synthesizes Infineon datasheet parameters, distributor pricing tiers, drop-in alternative candidates, and practical design notes - information not found in any single manufacturer datasheet page.
TLE9250XSJXUMA1 - 5Mbps CAN FD Transceiver PG-DSO-8 | Infineon
The Infineon TLE9250XSJXUMA1 is a high-speed CAN FD transceiver supporting data rates up to 5 Mbit/s, supplied in an 8-pin PG-DSO-8 package with operating voltage range 4.5 V to 5.5 V and an automotive temperature grade of -40 C to +150 C. It implements the physical layer according to ISO 11898-2 (2016) and is qualified to AEC-Q100 for automotive use, making it a drop-in interface between a microcontroller's CAN protocol controller and the differential bus wiring. The 5 Mbit/s CAN FD capability is essential for modern automotive networks carrying larger payloads such as ADAS sensor data, diagnostic telemetry, and gateway traffic. A CAN transceiver is a physical-layer interface IC that translates a microcontroller's digital CAN TXD/RXD logic-level signals into the differential CANH/CANL bus signaling required by the ISO 11898-2 standard. It also provides bus fault tolerance, dominant time-out, and ESD protection on the bus pins. In the broader hierarchy, the TLE9250XSJ sits between the protocol controller (an MCU or standalone CAN controller) and the wiring harness, protecting the controller from bus transients while driving the bus to the required differential voltage levels. Key features include very low electromagnetic emission (low EME) optimized for automotive EMI requirements, a low-power mode with remote wake-up via CAN bus activity, integrated bus pin ESD protection, dominant time-out for TXD stuck-dominant fault handling, and overtemperature shutdown. These features minimize external component count and simplify compliance with OEM EMC standards. The device also supports a 3.3 V compatible logic interface on TXD/RXD/EN/NSTB pins, allowing direct connection to modern low-voltage microcontrollers without level shifters. From an architecture standpoint, the TLE9250XSJ uses a fully integrated differential driver and receiver with separate supply pins for the digital interface (VDD, 3.3 V to 5 V) and the bus driver (VSUP, battery). This split-rail approach allows the bus to remain powered while the MCU side is off, supporting partial networking and low quiescent current in sleep mode. The internal slope control reduces radiated emissions at high bus speeds, eliminating the need for external common-mode chokes in most applications. Typical applications include automotive body control modules (BCM), gateway ECUs connecting multiple CAN sub-networks, electric vehicle battery management systems (BMS), ADAS sensor fusion nodes, and industrial CAN FD networks. Its wide supply range and automotive-grade qualification make it equally suitable for 12 V and 24 V truck/commercial-vehicle platforms. A key design consideration is the use of a common-mode choke and split bus termination (60 ohm between CANH and CANL plus two 30 ohm to ground) for optimum signal integrity at 5 Mbit/s. The non-sleep current is typically below 10 uA with remote wake-up enabled, making the part well-suited for partial networking where ECUs may be selectively powered down. This page synthesizes distributor stock, drop-in alternatives within the PG-DSO-8 footprint, and practical design guidance not found in the manufacturer datasheet alone.
TLE9351VSJXTMA1 - 5Mbps CAN FD Transceiver PG-DSO-8 | Infineon
The Infineon TLE9351VSJXTMA1 is a high-speed CAN FD transceiver supporting ISO 11898-2, SAE J2284, and CAN FD up to 5 MBit/s, housed in an 8-pin PG-DSO-8 package. It operates from a 3.3V or 5V supply and includes a standby mode for low quiescent current, targeting automotive in-vehicle networks where reliable bus communication is mandatory. The part is AEC-Q100 qualified, confirming its suitability for harsh automotive electrical environments including load-dump, jump-start, and reverse-battery transients. A CAN transceiver (Controller Area Network transceiver) is a physical-layer IC that sits between a microcontroller's CAN protocol controller and the differential CAN bus. It converts single-ended TX/RX logic levels into the differential dominant/recessive bus states defined by ISO 11898-2 and rejects common-mode noise through high common-mode rejection. In the broader system hierarchy it belongs to: transceiver -> physical-layer interface -> in-vehicle networking IC -> automotive power management and communication IC -> semiconductor. CAN FD (Flexible Data-rate) extends classic CAN by increasing the data-phase bit rate while keeping the arbitration phase at the legacy bit rate, enabling larger payloads and faster ECU-to-ECU throughput. Key features include bus fault protection up to ±42V, thermal shutdown, undervoltage detection on VCC, and a low-power standby mode with bus wake-up capability. The receiver exhibits high common-mode immunity for reliable operation in noisy automotive harnesses, and the transmitter delivers a tightly controlled differential output with slope control to limit EMI. The PG-DSO-8 footprint is industry-standard for 8-pin CAN transceivers, simplifying PCB layout migration between competing solutions. Typical applications include body control modules, gateway ECUs, powertrain ECUs (where CAN FD is increasingly required), battery management system CAN interfaces, and ADAS sensor clusters. The standby mode enables quiescent current budgets in the microamp range, supporting always-on CAN networks that must wake the ECU upon bus activity. When designing with this part, place the VCC decoupling capacitor within 2mm of the VCC pin and route the CANH/CANL traces as a 100-ohm-impedance differential pair with ground stitching vias. Use a TVS diode such as NUP2105L on the bus pins to survive ISO 7637-2 pulse transients not covered by the IC's internal ±42V protection. The SPLIT pin, if used, requires a capacitor to ground. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
TLIN1029A-Q1 - LIN Transceiver w/ Dominant Timeout | TI
The Texas Instruments TLIN1029A-Q1 is a fault-protected Local Interconnect Network (LIN) physical-layer transceiver, supporting data rates up to 20 kbps per LIN 2.x and ISO 17987-4, and packaged in an 8-pin SOIC (DRQ1) or 8-pin SON (DRBRQ1). The vehicle-side bus pin tolerates ±42 V load-dump transients and integrates a current-limited wave-shaping driver plus an internal LIN pull-up for responder-node applications, allowing reduced BOM versus discrete implementations. A LIN physical-layer transceiver is a single-wire, bidirectional bus interface IC that converts logic-level UART data into a current-shaped LIN bus waveform (dominant/recessive) and back, providing the physical medium for low-cost in-vehicle sub-networks such as body control modules, mirror switches, seat controllers, and sensor clusters. TLIN1029A-Q1 sits within the broader LIN transceiver category, which itself is a sub-family of automotive interface ICs standardized by ISO 17987 and the LIN Consortium. Key features include an integrated wake-up pattern detector compliant with LIN 2.x and ISO 17987-4, ±42 V fault protection on the LIN bus pin, ±15 kV HBM ESD on LIN and ±8 kV on the battery pin (per HBM model), dominant-state timeout to prevent bus lock-up, undervoltage detection on VSUP, thermal shutdown, and back-feed prevention that blocks current flow from LIN to VSUP during ground-shift events. The 8-pin SOIC and 3 mm × 3 mm SON options give designers a layout choice for both through-hole-style reflow and space-constrained modules. Architecturally the device combines a high-side driver with active current limiting, a recessive-side pull-up, a comparator-based receiver, and a state machine for wake-up pulse recognition; this integration removes the need for an external LIN pull-up resistor and a TVS diode in moderate-environment designs. Typical applications include body control modules, HVAC control panels, steering-wheel switch interfaces, door/window lift switches, seat-position memory modules, and LED lighting controllers. The wide VSUP range and integrated fault protection suit 12-V automotive battery systems including cold-crank and load-dump conditions. When designing with TLIN1029A-Q1, place a 100 nF decoupling capacitor close to VSUP and follow LIN bus layout guidelines (single-node stub, controlled impedance, ground return path) to meet EMC requirements per IEC 61967 and SAE J2962. This page synthesizes distributor pricing, AEC-Q100 compliance context, and drop-in alternatives not consolidated in the manufacturer datasheet.
TLIN1029DRBRQ1 - LIN Transceiver w/ Vreg 20kBd Auto AEC-Q100
The Texas Instruments TLIN1029DRBRQ1 is an AEC-Q100 qualified LIN (Local Interconnect Network) physical layer transceiver with integrated voltage regulator and wake-up protection, housed in an 8-pin VSON EP (DRB) package. It supports LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A and ISO 17987-4 electrical physical layer specifications at data rates up to 20 kbps, designed primarily for 12-V automotive in-vehicle networks with wider bus fault tolerance. A LIN (Local Interconnect Network) transceiver is a single-wire bidirectional bus interface IC that connects low-cost body-electronics modules (door locks, mirrors, seat controllers, HVAC flaps) to a vehicle's central body control module. As a sub-class of in-vehicle networking, LIN sits below CAN-FD in the automotive network hierarchy - LIN -> sub-bus -> body network -> vehicle network -> automotive electronics. The TLIN1029 family specifically adds an integrated LDO to power the local microcontroller from the LIN bus supply, eliminating the need for an external regulator. Key features of the TLIN1029DRBRQ1 include AEC-Q100 Grade 1 qualification for automotive applications, integrated dominant state timeout to prevent a single node from hogging the bus, ±42-V bus fault tolerance, ±15-kV HBM ESD protection on the LIN pin, and ultra-low current sleep mode with remote/local wake-up support. The integrated LDO delivers up to 70 mA to power local sensors or microcontrollers directly from the bus. Technically, the part operates over a 4.5-V to 36-V supply range (Load Dump tolerant up to 42 V), consumes less than 10 µA in sleep mode, and includes thermal shutdown, undervoltage lockout, and reverse-battery protection. The 8-pin VSON EP (3x3 mm) package provides an exposed thermal pad for enhanced power dissipation in harsh under-hood or door-module operating environments. Typical applications include automotive body control modules, HVAC control, mirror and seat adjustment modules, steering column switches, sunroof controllers, and lighting modules. The integrated regulator eliminates one external component, reducing BOM cost and PCB area in space-constrained body-electronics modules. When designing with the TLIN1029DRBRQ1, add a reverse-battery protection diode or MOSFET on the supply pin for ISO 7637-2 transient compliance, and follow the LIN bus termination guidelines (master typically adds 1 kΩ + diode; slave uses internal pull-up). The WAKE pin allows local wake-up from the bus without a full MCU boot. This page synthesizes distributor availability, AEC-Q100 qualified drop-in alternatives, and automotive LIN bus design notes not found in the manufacturer datasheet alone.
TLIN1039-Q1 - LIN Transceiver, 36V, 20kbps TX | Texas Instruments
The Texas Instruments TLIN1039-Q1 is an AEC-Q100 (Grade 1) qualified Local Interconnect Network (LIN) physical-layer transceiver housed in an 8-pin TSOT-23 (DDF) package. It supports data rates up to 20 kbps on the transmitter path and up to 100 kbps on the receiver for faster in-line programming. The part targets 12-V automotive networks with a wide 4.5 V to 36 V supply range and extended bus-fault protection rated at ±45 V, alongside greater than ±8 kV HBM and IEC ESD protection levels on the LIN bus pin. A LIN transceiver is the physical-layer interface for the LIN (Local Interconnect Network) bus, a single-wire, low-speed serial protocol widely used for in-vehicle body and comfort networks such as door modules, seat controllers, mirror switches, and HVAC actuators. The TLIN1039-Q1 belongs to the family of automotive LIN transceivers within the broader category of interface ICs / physical-layer transceivers, sitting beneath the CAN/LIN/FlexRay hierarchy of in-vehicle networking standards. Its role is to translate CMOS-level TXD/RXD logic into the dominant/recessive current-driven LIN bus waveform that meets the LIN 2.0/2.1/2.2/2.2A, ISO/DIS 17987-4 and SAE J2602-1 physical-layer specifications. Key features of the TLIN1039-Q1 include integrated local and remote wake-up support, a current-limited wave-shaping driver that reduces electromagnetic emissions (EME), an open-drain RXD output for flexible logic interfacing, internal pull-down on TXD for fail-safe behavior, dominant-state time-out protection, and ±45 V bus-fault tolerance with thermal shutdown. The combination of wide operating voltage, bus-fault ruggedness and AEC-Q100 Grade 1 qualification makes the part well suited to harsh automotive electrical environments including jump-start, load-dump and reverse-battery transients. Architecturally, the device combines a bandgap-referenced voltage regulator, a current-limited open-drain LIN driver with slew-rate control, a window comparator receiver, and a state-machine that handles dominant time-out, thermal shutdown, under-voltage lockout and wake-up detection. The integrated ESD cell on the LIN pin exceeds ±8 kV HBM, eliminating the need for an external TVS in most 12-V automotive LIN node designs. Typical applications include body control modules, door/window/seat/mirror modules, HVAC control nodes, steering column switches, lighting ECUs, and sensor/actuator nodes that must interface with a LIN master in an in-vehicle network. The receiver's higher 100 kbps capability also enables faster in-line programming of slave ECUs over the LIN bus. When designing with this device, ensure that VSUP is decoupled with a 100 nF ceramic capacitor close to the pin, and that the LIN bus pin is protected by the bus-pin ESD structure rather than an external TVS, since adding a TVS can load the bus and disturb the LIN waveshaping. The TXD pin must not be pulled high to VSUP, as TLIN1039-Q1 only provides an internal pull-down. This page synthesizes manufacturer datasheet parameters, distributor availability, drop-in same-family alternatives, and practical automotive design notes not consolidated in any single source.
TLIN821-Q1 - Automotive Fault-Protected LIN Transceiver | Texas Instruments
The TLIN821-Q1 from Texas Instruments is an automotive fault-protected local interconnect network (LIN) physical layer transceiver. It supports data rates up to 20 kbps and is designed for low-speed UART-based communication in vehicle networks. The device is housed in an 8-pin SON (DRB) package, making it suitable for space-constrained automotive electronic control units. A LIN transceiver is a physical layer device that interfaces a microcontroller's UART to the single-wire LIN bus. It converts the TXD signal from the MCU into a bus signal and senses the bus state to drive the open-drain RXD output. The TLIN821-Q1 includes a current-limited wave-shaping driver that reduces electromagnetic emissions (EME), helping meet automotive EMC requirements.“ Key features include integrated ESD protection, under-voltage protection, thermal shutdown, and ground fault protection. The device also offers inhibit and wake functions, allowing the LIN node to enter low-power mode and be woken by bus activity or a dedicated wake signal. This reduces current consumption in parked vehicles. The TLIN821-Q1 is AEC-Q100 qualified, ensuring reliable operation across the automotive temperature range. Its robust fault protection prevents damage from accidental shorts, ground drifts, or supply disconnections. According to the TI datasheet, when a fault occurs, the transmitter is disabled until the fault is removed. Typical applications include automotive body control modules, door and seat control units, lighting systems, HVAC actuators, and battery management systems. With its 20 kbps data rate and fault-tolerant design, it is the ideal choice for LIN-based automotive networking.
TLIN829-Q1 - Fault-Protected LIN Transceiver, 20kbps | TI
The Texas Instruments TLIN829-Q1 is an automotive fault-protected Local Interconnect Network (LIN) physical-layer transceiver with integrated dominant-state timeout, supporting data rates up to 20kbps and operating from a wide 5.5V to 28V supply (with extended fault tolerance above 28V). Housed in an 8-pin SOIC or 8-pin SON (DRB 3x3) package, it converts a TXD logic-level data stream into a single-wire LIN bus waveform via a current-limited wave-shaping driver, and converts the bus signal back to logic levels through an open-drain RXD pin. The transceiver complies with LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602, and ISO/DIS 17987-4 standards. According to TI product page data, the LIN receiver additionally supports fast in-line programming at rates up to 100kbps. The TLIN829-Q1 is a 12V-system optimized, cost-effective derivative of the TLIN1029A-Q1 and TLIN1029-Q1 family, sharing the same family footprint and adding wider operating voltage, bus-fault protection, and a dominant-state watchdog that prevents the bus from being stuck in the dominant state due to software or hardware faults. What is a LIN transceiver? A LIN (Local Interconnect Network) transceiver is a physical-layer (PHY) device that connects a microcontroller's UART-style logic domain to a single-wire, low-cost automotive communication bus. It typically integrates a wave-shaping transmitter, a comparator-based receiver, bus fault protection (against shorts to battery, ground, and adjacent LIN nodes), ESD protection, and a low-power wake-up mechanism. LIN sits hierarchically under in-vehicle networking alongside CAN (Controller Area Network), FlexRay, and Automotive Ethernet - LIN targets low-speed, low-cost nodes like door modules, mirror adjusters, and seat controllers, while CAN/Ethernet handle higher-bandwidth powertrain and ADAS domains. Key features include: integrated dominant-state timeout for fail-safe bus recovery, ±45V LIN bus fault tolerance (load-dump tolerant), ±15kV HBM ESD on the LIN pin per IEC 61000-4-2, ultra-low quiescent current in sleep mode, thermal shutdown, and an active-high WAKE input that wakes the device from sleep without MCU intervention. The part supports both 3.3V and 5V MCU logic via a separate VCC/VSUP rail scheme. The 8-pin SOIC (D) and 8-pin SON (DRB 3x3) packages provide small footprint for space-constrained body-electronics modules. Typical applications include automotive body control modules (BCM), HVAC control, door/window/seat modules, steering column controls, rain/light sensors, mirror adjusters, headlamp leveling, and interior lighting nodes. The part's AEC-Q100 Grade 1 qualification (-40C to +125C) makes it suited for underhood and cabin applications alike. Designers should ensure proper LIN bus termination (typically a master pull-up of 1kΩ plus a diode to VSUP, and a slave pull-up of 30kΩ in the device), use a 100nF X7R decoupling capacitor close to VSUP, and route the LIN trace as a short, stub-free single-ended line, twisted if possible, to minimize radiated emissions. The dominant-state timeout is configurable; refer to the datasheet's register or strap-setting description for the chosen mode.
TLV3202AQDGKRQ1 - 40ns Dual Automotive Comparator | TI
The Texas Instruments TLV3202AQDGKRQ1 is a dual, high-speed, low-power automotive comparator with 40 ns propagation delay, a 40 µA per-channel quiescent current, and rail-to-rail inputs in an 8-VSSOP DGK package. It operates from a single 2.7 V to 5.5 V supply and supports an ambient operating-temperature range of -40 °C to 125 °C. The device is designed for fast threshold decisions where response time, low power, and compact placement matter. A comparator is a differential signal integrated circuit that compares two input voltages and switches its logic output according to their relationship. In the broader semiconductor hierarchy, this dual analog comparator belongs to the comparator, interface IC, and signal-conditioning categories. The TLV3202-Q1 family combines rail-to-rail input capability, 1 mV offset voltage, push-pull outputs, and large output-drive capability, making it useful for signal conditioning, threshold detection, and system monitoring. The most important verified features are 40 ns high-speed response, 40 µA low-power operation, rail-to-rail input, 1 mV offset voltage, and large output drive current. Its two channels share one package, reducing board area for paired decisions. The push-pull output can drive downstream digital logic directly, while the low-power operating current helps preserve system power budget in continuously monitoring designs. The automotive-oriented Q1 designation also makes the device appropriate for temperature-qualified vehicle systems when its specified operating range and qualification requirements are satisfied. The TLV3202AQDGKRQ1 is supplied in an 8-VSSOP DGK surface-mount package. Its compact footprint is suitable for dense industrial, automotive, communications, and embedded-control designs. The package and pin configuration must be compared directly against the original PCB footprint before substitution; a similar comparator function alone does not guarantee drop-in compatibility. The manufacturer product page identifies the device as a dual comparator with eight pins and a -40 °C to 125 °C temperature range. Typical applications include automotive battery and signal monitoring, industrial threshold detection, sensor conditioning, overvoltage and undervoltage indication, waveform edge detection, and general-purpose digital decision logic. The fast 40 ns response helps minimize uncertainty when a signal crosses the comparator threshold, while the low-power characteristic is advantageous in battery-powered or continuously active systems. Designers should verify input common-mode limits, output logic levels, supply decoupling, and unused-channel handling against the manufacturer datasheet. Place the device near the sensed signal where practical, maintain a stable reference node, and route high-current or switching nodes away from comparator inputs. This page combines the verified manufacturer and distributor information with engineering guidance, application context, and a conservative replacement assessment.
TLV320AC37CN - 3V Voice-Band Audio Processor | Texas Instruments
The TLV320AC37CN is a voice-band audio processor (VBAP) from Texas Instruments, designed for single 3-V operation with low power consumption. It integrates a combined A/D, D/A converter and filters, supporting sample rates up to 16 kHz and a pass-band to 7.2 kHz. The device is housed in a 20-pin PDIP package, making it suitable for through-hole assembly in telecommunication and audio applications. A voice-band audio processor (VBAP) is a specialized mixed-signal IC that combines analog-to-digital and digital-to-analog conversion with filtering and signal processing optimized for the 300 Hz to 3.4 kHz voice band. It sits within the broader category of audio codecs, which are essential in telephony, intercoms, and voice-controlled systems. The TLV320AC37CN specifically targets low-power, battery-operated voice applications, offering a complete analog front-end and codec in a single package. Key features include a low operating power of 20 mW typical, standby mode at 5 mW, and power-down mode at 2 mW. The device supports extended variable-frequency operation with sample rates up to 16 kHz and a pass-band to 7.2 kHz. It includes an electret microphone interface, making it ideal for direct connection to electret condenser microphones. The combined A/D, D/A, and filters simplify system design by reducing external components. Technically, the TLV320AC37CN employs a CMOS process and operates from a single 3-V supply, which is critical for portable and battery-powered equipment. The device features a PCM codec interface with A-law companding, suitable for digital telephony standards. The through-hole PDIP-20 package ensures easy prototyping and manual assembly, though it limits high-density applications compared to surface-mount alternatives. Typical applications include digital telephone answering machines, speakerphones, intercom systems, and voice recorders. The low power consumption and 3-V operation make it particularly suited for battery-powered devices where efficiency is paramount. The integrated filters and codec reduce BOM cost and board space. When designing with this device, ensure proper decoupling of the 3-V supply and careful layout of the analog and digital sections to minimize noise coupling. The device is now obsolete, so consider pin-compatible alternatives for new designs.
TLV320AIC3106IRGZT - Low-Power Stereo Audio CODEC | TI
The Texas Instruments TLV320AIC3106IRGZT is a low-power stereo audio CODEC with 10 inputs, 7 outputs, integrated headphone amplifier, and enhanced digital effects, housed in a 48-pin VQFN (RGZ) 7x7 mm package. It supports 16/20/24/32-bit PCM data at sample rates from 8 kHz to 96 kHz with 102 dBA signal-to-noise ratio on the DAC path, and operates from a 1.8 V digital supply plus a 3.3 V analog supply, consuming as little as 15 mW during stereo 48 kHz DAC playback. An audio CODEC (coder-decoder) is an integrated circuit that converts between digital audio streams and analog microphone/line/headphone signals, combining an ADC input path and DAC output path inside a single chip. The TLV320AIC3106 sits in the broader hierarchy of audio interface ICs -> interface ICs -> integrated circuits, and is widely deployed in portable, battery-powered, and space-constrained designs where low power, stereo playback, and integrated headphone drive are required simultaneously. Multiple line, microphone, and headphone amplifiers share an extensive register-based power-control interface, enabling fine-grained energy management as system use cases change. Key features of the TLV320AIC3106 include stereo 24-bit ADC and DAC with 102 dBA SNR, integrated 40 mW headphone amplifier, programmable 3D / bass / treble / EQ digital effects, and selectable single-ended or fully-differential analog inputs. The digital serial audio bus supports I2S, left-justified, right-justified, and DSP/PCM modes for flexible connection to virtually any application processor or DSP. An automatic gain control (AGC) block on the ADC path keeps microphone levels stable across varying speech distances. At the architectural level the device pairs a multi-bit delta-sigma modulator front end with on-chip FIR and IIR engine blocks so that tone control, EQ, and de-emphasis are applied digitally without burdening the host processor. PLL-based clock generation accepts common 12, 13, 24, or 27 MHz system clocks and derives all internal timing from them, simplifying board layout by removing the need for a dedicated audio master crystal in many designs. Extensive register-based power control keeps unused analog blocks powered down until audio paths are activated. Typical applications span portable media players, portable navigation devices, mobile phones and VoIP handsets, portable gaming, digital still cameras and camcorders, ultrasonic imaging, IP phones and USB headsets, as well as portable audio docks and Bluetooth speakers. The combination of low power, integrated headphone drive, and rich on-chip digital effects makes it equally suitable for stereo playback and full-duplex voice-capture products. When designing with this part, ensure both the 1.8 V digital and 3.3 V analog rails are well decoupled close to the IC, and that the PLL reference clock is selected to match the chosen MCLK frequency in software. Because the device supports both single-ended and differential microphone paths, designers should populate the unused input pins according to the datasheet reference circuit rather than leaving them floating. This page synthesizes distributor pricing, drop-in alternatives, and practical design considerations for the TLV320AIC3106IRGZT and its sibling variants into a single design-oriented reference beyond the raw manufacturer datasheet.
TLV320AIC3110IRHBT - Low-Power Audio Codec with Class-D Amp | TI
The TLV320AIC3110IRHBT is a low-power, highly integrated audio codec from Texas Instruments, featuring a stereo audio DAC and a mono audio ADC, along with a 1.3W stereo Class-D speaker amplifier. It supports 32-bit audio data and communicates via I2C or serial interface. The device is housed in a 32-pin VQFN (5x5 mm) package, making it suitable for space-constrained portable applications. An audio codec is a device that encodes and decodes digital audio data, converting between analog and digital domains. It typically includes ADCs and DACs, along with signal processing and amplification stages. In a system hierarchy, an audio codec sits between the digital audio processor (e.g., DSP or SoC) and the analog audio output (speakers, headphones) or input (microphones). It is a critical component in portable electronics, automotive infotainment, and IoT devices. Key features of the TLV320AIC3110 include a 1.3W stereo Class-D speaker amplifier, which provides high efficiency for battery-powered devices. The device supports a wide analog supply range of 2.7V to 3.6V, a digital core supply of 1.525V to 1.95V, and a digital I/O supply of 1.1V to 3.6V. It also includes a programmable digital sine-wave generator and extensive register-based power control for optimizing power consumption. Technically, the TLV320AIC3110 integrates a low-power stereo DAC with 32-bit resolution and a mono ADC, supporting sample rates up to 96 kHz. The Class-D amplifier delivers 1.3W per channel into 8 ohms with low distortion. The device features a 5x5 mm VQFN package with exposed thermal pad for improved heat dissipation. It operates over the industrial temperature range of -40°C to +85°C. Typical applications include portable audio players, smartphones, tablets, and IoT devices requiring high-quality audio playback and recording. The integrated Class-D amplifier eliminates the need for an external amplifier, reducing BOM cost and board space. The I2C control interface allows easy integration with microcontrollers and DSPs. When designing with this device, ensure proper decoupling of the analog and digital supplies, and place the Class-D amplifier output filters close to the device to minimize EMI. The thermal pad should be soldered to a copper pour for effective heat dissipation.
TMC8462A-BA - EtherCAT Slave Controller, 2x 100M PHY, 121-BGA | ADI
The Analog Devices (formerly Trinamic) TMC8462A-BA is a complete EtherCAT slave controller IC integrating two 100-Mbit PHYs, a dual switch-mode regulator power supply, and 24V-capable high-voltage digital I/Os, supplied in a 121-ball BGA package (9 mm x 9 mm). It operates from a 5 V to 35 V supply range and exposes I2C, MII, and SPI host interfaces, allowing it to attach to virtually any microcontroller or FPGA host that needs to bring EtherCAT connectivity onto the backplane. An EtherCAT slave controller is the silicon block responsible for handling the deterministic EtherCAT protocol on behalf of the application processor, offloading real-time mailbox and cyclic datagram processing so the host MCU can focus on the motion or I/O task itself. The TMC8462A-BA sits inside an industrial fieldbus hierarchy above the 100BASE-TX PHY and below the application MCU, and ultimately below higher-level Industrial Ethernet protocols such as PROFINET, EtherNet/IP, and CIP Motion - it is the lowest layer that interprets EtherCAT frames natively. Compared with discrete EtherCAT slave designs, it eliminates an external PHY, an external auxiliary regulator, and a discrete 24V-tolerant I/O buffer. Key features of the TMC8462A-BA include two integrated 100-Mbit Ethernet PHYs that drive a daisy-chained EtherCAT port 0/port 1 topology, a built-in dual switch-mode power supply block, eight high-voltage (24V-tolerant) digital I/Os for industrial sensors and actuators, a watchdog timer, a PWM unit, and SPI/I2C master interfaces. The integrated PHYs remove the need for external 100BASE-TX magnetics-side circuitry, and 24V-tolerant I/Os allow direct connection to industrial sensors without a separate level shifter. Architecturally, the TMC8462A-BA combines the EtherCAT Processing Unit (EPU), two 100BASE-TX PHYs, an Ethernet MAC, a digital I/O bank, and a power management block on a single die. The internal switch-mode regulator generates the lower rails required for the digital core and PHYs from the incoming 5-35 V bus, simplifying the bill of materials and reducing PCB area versus a discrete EtherCAT solution. Typical applications for the TMC8462A-BA include industrial motor drives, stepper and servo controllers using EtherCAT, distributed I/O modules, sensor/actuator nodes, robotic sub-systems, and CNC peripherals where EtherCAT slave controllers are required. It is also used as the slave side of the TMC8462A-EVAL evaluation kit. When designing with the TMC8462A-BA, ensure the upstream 24V supply is decoupled with low-ESR bulk capacitance near the BGA and that MDI traces to the magnetics are length-matched, as required by 100BASE-TX. The host SPI clock should not exceed the datasheet maximum, and unused high-voltage I/Os must be tied to a defined logic level to avoid floating inputs in the field. This page synthesizes distributor pricing, drop-in same-package variants, datasheet PDF location, and application design notes not all collected in one place on the manufacturer datasheet alone.
TMUX136RSER - 6GHz 2-Ch SPDT Analog Switch | TI UQFN-10
The Texas Instruments TMUX136RSER is a high-performance 6-GHz, 2-channel, 2:1 (SPDT) analog switch with powered-off protection, packaged in a 10-pin UQFN (RSE, 2.0 x 1.5 mm) and rated for a typical on-resistance of 9.5 ohm. It supports a wide VCC range of 2.3 V to 4.8 V and offers 1.4 pF typical on-state capacitance, making it ideal for high-frequency signal multiplexing. What is an analog switch/multiplexer? An analog switch (also called a multiplexer or MUX) is a solid-state semiconductor device that routes analog or digital signals between multiple input/output paths under digital control, using MOSFET transistors as the switching elements. Analog switches sit within the broader hierarchy of interface ICs -> signal routing -> semiconductor ICs. The 2:1 (SPDT) configuration means each of the two independent channels can connect a common pin to one of two possible inputs, a topology commonly used for signal multiplexing, source selection, and USB/MIPI/LVDS switching. Key features include a -3 dB bandwidth of 6 GHz, 1.4 pF on-state capacitance (Con), 9.5 ohm typical on-resistance (Ron), and 1.8 V-compatible control inputs that interface directly with low-voltage processor GPIOs. Power-off protection forces all I/O pins into high-impedance mode when VCC is removed, protecting downstream components and preventing back-powering through the signal path. The flow-through pinout places inputs and outputs on opposite sides of the package, simplifying PCB routing. The architecture uses N-channel MOSFET pass transistors driven by a charge-pump-assisted gate driver, which achieves low Ron flatness across the input signal range and supports bidirectional signal paths. The 6 GHz bandwidth enables pass-through of high-speed differential protocols such as USB 2.0, MIPI DSI/CSI, and LVDS without significant insertion loss. Typical applications include tablet and notebook signal multiplexing, smartphone MIPI/DSI switching, USB 2.0 high-speed signal routing, and audio signal path selection. The device also finds use in test equipment and instrumentation where high-bandwidth signal multiplexing is required. When designing with this device, observe the absolute maximum ratings for analog signal voltage. Use controlled-impedance PCB traces (typically 50 ohm single-ended or 90 ohm differential) for high-frequency signals to preserve signal quality at the rated 6 GHz bandwidth. This page synthesizes distributor pricing, drop-in alternatives from TI and competitors, and practical design notes not found in the manufacturer datasheet alone.
TMUX7208 - 44V Latch-Up Immune 8:1 MUX | Texas Instruments
The Texas Instruments TMUX7208 is a precision 8:1 single-channel multiplexer designed for high-voltage, high-performance signal routing. It operates from a single supply of 4.5V to 44V, dual supplies of ±4.5V to ±22V, or asymmetric supplies such as VDD=12V and VSS=-5V. The device features a low on-resistance of 4Ω (typical) and low charge injection of 3pC, making it suitable for precision analog applications. The TMUX7208 is available in a 16-pin TSSOP (PW) package and supports a wide operating temperature range of -40°C to +125°C. A multiplexer (MUX) is a device that selects one of several analog or digital input signals and forwards it to a single output line. The TMUX7208 is an analog multiplexer, specifically an 8:1 configuration, meaning it routes one of eight input channels to a common output based on the state of three address pins and an enable pin. This functionality is essential in data acquisition systems, test equipment, and industrial automation where multiple sensors or signals need to be sampled sequentially by a single ADC or measurement circuit. Key features of the TMUX7208 include latch-up immunity, which prevents damage from overvoltage or ESD events, and 1.8V logic-compatible inputs, allowing direct interface with low-voltage microcontrollers without level shifters. The device supports high current up to 300mA (max), making it robust for various loads. The low on-resistance and charge injection ensure minimal signal distortion and glitches during switching. The TMUX7208 uses a precision architecture with a break-before-make switching mechanism, preventing momentary shorting between channels. The device also features an enable pin that, when low, disconnects all channels, providing a high-impedance state. This is useful for power-down or isolation scenarios. The wide supply range and latch-up immunity make it ideal for industrial and automotive environments where voltage transients are common. Typical applications include data acquisition systems, test and measurement equipment, industrial process control, and battery monitoring systems. The TMUX7208 can be used to multiplex multiple sensor inputs into a single ADC, reducing component count and cost. Its high-voltage capability allows direct connection to 24V industrial buses without additional level shifting. When designing with the TMUX7208, ensure that the supply voltages are within the specified range and that the input signals do not exceed the supply rails. Proper decoupling capacitors on the supply pins are recommended to minimize noise. The address and enable pins should be driven with logic levels compatible with 1.8V to 5V, as the device is 1.8V logic compatible.
TMUX8108 - 100V Flat RON 8:1 MUX | Texas Instruments
The TMUX8108 is a modern high-voltage analog multiplexer from Texas Instruments, offering a single-ended 8:1 configuration with flat on-resistance (RON) and latch-up immunity. It operates with dual supplies, a single supply, or asymmetric supplies up to a maximum supply voltage of 100 V. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins, and all logic inputs support 1.8 V, 3.3 V, and 5 V logic levels, with the ability to connect as high as 48 V for system flexibility. An analog multiplexer is a device that routes one of several input signals to a common output based on digital control signals. In a single-ended 8:1 configuration, the TMUX8108 selects one of eight input channels and connects it to a single output. This functionality is essential in data acquisition systems, test equipment, and industrial automation where multiple sensors or signals need to be sampled sequentially by a single ADC or measurement circuit. The multiplexer acts as a signal router, enabling efficient use of expensive analog-to-digital converters and reducing component count. Key features of the TMUX8108 include a flat RON of 50 ohm, which minimizes distortion and ensures consistent performance across the input voltage range. The device provides latch-up immunity, preventing damage from overvoltage or overcurrent conditions. It supports a wide supply range up to 100 V, making it suitable for high-voltage industrial and automotive applications. The logic inputs are compatible with 1.8 V, 3.3 V, and 5 V systems, allowing direct interface with modern microcontrollers without level shifters. Technically, the TMUX8108 is built on a high-voltage CMOS process that enables low leakage currents and fast switching times. The flat RON characteristic is achieved through careful design of the switch architecture, ensuring that the on-resistance remains nearly constant across the entire analog input range. This reduces signal distortion and improves accuracy in precision measurement systems. The device also features break-before-make switching to prevent momentary shorting of channels during transitions. Typical applications include data acquisition systems, automated test equipment, industrial process control, and battery monitoring systems. In data acquisition, the TMUX8108 allows a single ADC to sample multiple sensor channels, reducing cost and board space. In battery monitoring, it can route individual cell voltages to a measurement circuit, enabling accurate state-of-charge estimation. The high-voltage capability makes it ideal for automotive 48 V systems and industrial 24 V or 48 V buses. When designing with the TMUX8108, ensure that the supply voltages are within the absolute maximum ratings and that the logic control signals are properly referenced to the logic supply. The device requires careful PCB layout to minimize parasitic capacitance and maintain signal integrity, especially in high-frequency applications. Additionally, consider the on-resistance and leakage current when calculating system accuracy, as these parameters affect the overall measurement error.