10AS048E2F29E2SG vs 10AS048E2F29I1HG Vergleich
Detaillierter Direktvergleich von 10AS048E2F29E2SG von Intel und 10AS048E2F29I1HG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
10AS048E2F29I1HG - Arria 10 SX SoC FPGA, 480K LE, Dual ARM Cortex-A9 | Intel
10AS048E2F29I1HG ✓ AktivSpezifikationsvergleich
| Parameter | 10AS048E2F29E2SG | 10AS048E2F29I1HG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $2.120,00 |
| Product Type | SoC FPGA | — |
| Device Family | Arria 10 SX | — |
| Logic Elements | 480,000 | 480000 |
| Listing Frequency | 1.5 GHz | — |
| Processor Cores | 2 | Dual ARM Cortex-A9 MPCore |
| Processor | ARM Cortex-A9 MPCore | — |
| Debug and Trace Technology | CoreSight | — |
| Gehäuse | 780-FBGA, FC | 780-FBGA, FC (29x29 mm) |
| Package Dimensions | 29 mm x 29 mm | — |
| Terminal Count | 780 | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Mounting Technology | [DATA_NEEDED: mounting technology] | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Versorgungsspannung | [DATA_NEEDED: supply voltage range] | — |
| I/O Standard Support | [DATA_NEEDED: I/O standard support] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | — |
| DSP Block Count | [DATA_NEEDED: DSP block count] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Family | — | Arria 10 SX |
| Device Variant | — | 10AS048 |
| Maximum Core Frequency | — | 1.5 GHz |
| HPS Debug | — | CoreSight |
| Process Technology | — | 20 nm |
| Core Voltage | — | 0.9 V |
| Package Type | — | Flip Chip Fine-Pitch BGA |
| Montageart | — | Surface Mount |
| Operating Temperature Grade | — | Industrial |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Configuration | — | FPGA + Hard Processor System (SoC) |