10AX090N3F40E2LG vs 10AX090N3F45E2LG Vergleich
Detaillierter Direktvergleich von 10AX090N3F40E2LG von Intel und 10AX090N3F45E2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX090N3F40E2LG | 10AX090N3F45E2LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.280,00 | $2.285,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 59,234,304 bits | — |
| DSP Blocks | 1,518 | 768 (variable-precision, with hardened FP) |
| User I/O Pins | 600 | — |
| Transceivers | Up to 24 full-duplex channels | Multi-protocol, up to 12.5 Gbps (24 Gbps backplane on selected channels) |
| Transceiver Data Rate | Up to 14.4 Gbps | — |
| Hard Memory Controllers | Yes (DDR4, DDR3, QDR IV, RLDRAM 3) | — |
| Maximum DDR4 Rate | 2666 Mbps | — |
| PCIe Hard IP | PCIe Gen3 x8 (root port or endpoint) | — |
| Gehäuse | 1517-ball FCBGA, 40 mm | 1932-ball FCBGA, F45 (29 mm x 29 mm) |
| Process Technology | TSMC 20nm | 20 nm TSMC |
| Betriebstemperatur | -40C to +100C (extended industrial) | — |
| Core Voltage | 0.9 V typical | — |
| Configuration Encryption | AES-256 bitstream encryption | — |
| Partial Reconfiguration | Supported | — |
| RoHS-Status | Compliant | Compliant |
| Embedded Memory Bits | — | 59,234,304 (about 59.2 Mbit) |
| Core Voltage (VCC) | — | 0.9 V |
| Hard PCIe IP | — | PCIe Gen3 x8 controller (hard IP) |
| External Memory Interface | — | DDR4 up to 1600 MHz |
| Temperature Grade | — | Extended (E2) |
| Speed Grade | — | 3 (mid) |
| Configuration Memory | — | SRAM-based (requires external flash) |
| Toolchain | — | Intel Quartus Prime Pro Edition |