10AX090R3F40I2LG vs 10AX090R3F40E2LG Vergleich
Detaillierter Direktvergleich von 10AX090R3F40I2LG von Intel und 10AX090R3F40E2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX090R3F40I2LG | 10AX090R3F40E2LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.640,00 | $5.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 900,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Block RAM (M20K) | 24.33 Mbit | — |
| MLAB Memory | [DATA_NEEDED: MLAB Kbit] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Hardened fixed/floating-point DSP blocks (on-die) |
| Transceivers | 24 channels | Multi-gigabit serial transceivers (on-die) |
| Max Transceiver Data Rate | 17.4 Gbps | — |
| Hard Processor System | Not integrated (FPGA only) | — |
| PCI Express Hard IP | Gen3 hard IP | — |
| External Memory Interface | DDR4 / DDR3 / QDRIV / RLDRAM3 | — |
| Process Technology | 20 nm | 20 nm |
| Gehäuse | 1517-BBGA, FCBGA (F40) | 1517-Ball FCBGA |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Logic Elements | — | 900,000 |
| Embedded Memory | — | 59,234,304 bits |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |