10AX115N4F45I3LG vs 10AX115N4F45E3LG Vergleich
Detaillierter Direktvergleich von 10AX115N4F45I3LG von Intel und 10AX115N4F45E3LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115N4F45I3LG | 10AX115N4F45E3LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.100,00 | $7.100,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Device | 10AX115 | — |
| Logic Elements | 1,150,000 | — |
| Embedded Memory (bits) | 68,857,856 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | 427,200 |
| DSP Blocks | [DATA_NEEDED: DSP count] | 3,376 (variable-precision, 18x19 multipliers) |
| User I/O Count | 768 | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | Up to 96 channels at up to 17.4 Gbps |
| Process Technology | TSMC 20 nm | TSMC 20nm |
| Gehäuse | 1932-BBGA, FCBGA | 1932-ball FCBGA (F45, 45x45 mm) |
| Package Family | F45 (45 mm) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | I3 | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Terminal Form | Ball | — |
| Number of Terminals | 1932 | — |
| Package Code | BGA (FCBGA) | — |
| Logic Elements (LE) | — | 1,150,000 |
| Embedded Memory | — | 68,857,856 bits (8,532 Kbits per M20K block) |
| Maximum User I/O Pins | — | 768 |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore |
| Memory Interfaces | — | DDR4, DDR3, QDR-IV, RLDRAM III (hard controller) |
| PCIe Hard IP | — | PCIe Gen3 x8 (hard IP block) |
| PLLs | — | 24 |
| Betriebstemperatur | — | Extended (E) industrial grade per ordering code |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Voltage Rails | — | Core 0.9 V, transceiver 1.0/1.1 V, I/O bank-dependent |