10AX115R2F40E2SG vs 10AX115R1F40E1SG Vergleich
Detaillierter Direktvergleich von 10AX115R2F40E2SG von Intel und 10AX115R1F40E1SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115R2F40E2SG | 10AX115R1F40E1SG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5.410,00 | $0,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | [DATA_NEEDED: ALM count] |
| Embedded Memory Bits | 68,857,856 | — |
| M20K Memory Blocks | 2,128 | [DATA_NEEDED: M20K count] |
| MLAB Memory Bits | 8,812,800 | — |
| Variable-Precision DSP Blocks | 1,518 | — |
| 18 x 19 Multipliers | 3,036 | — |
| PLLs | 16 | — |
| User I/O Pins | 342 | — |
| Transceiver Count | 48 (max 96 for the family) | — |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) | — |
| Hard Memory Controllers | Yes | 2 |
| PCIe Hard IP | Gen3 x1/x2/x4/x8 | — |
| Process Technology | 20 nm TSMC | 20 nm TSMC |
| Speed Grade | -2 (E2, mid) | R1 (commercial) |
| Betriebstemperatur | 0C to +100C (commercial) | — |
| Gehäuse | 1517-ball FCBGA, 40 x 40 mm | 1517-BBGA / FCBGA (F40), 40 x 40 mm |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| RoHS | Compliant | — |
| Embedded Memory | — | 68,857,560 bits (68.86 Mbit) |
| DSP Blocks | — | 342 |
| DSP Format | — | Variable-precision (fixed/floating-point) |
| Transceivers | — | [DATA_NEEDED: transceiver count for 10AX115 F40] |
| Transceiver Max Data Rate | — | 14.4 Gbps |
| Hard PCIe Cores | — | PCIe Gen3 x8 |
| Maximum User I/O | — | 768 |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | E1 (enhanced) |
| RoHS-Status | — | Compliant |