10AX115U4F45E3LG vs 10AX115U3F45E2LG Vergleich
Detaillierter Direktvergleich von 10AX115U4F45E3LG von Intel und 10AX115U3F45E2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115U4F45E3LG | 10AX115U3F45E2LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5.650,00 | $8.500,00 |
| Family | Arria 10 GX | Arria 10 |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,856 |
| User I/Os | 480 | — |
| Gehäuse | 1932-ball FCBGA | — |
| Process Node | 20 nm TSMC | — |
| Transceiver Channels | Up to 96 | — |
| Max Transceiver Data Rate | 17.4 Gbps | — |
| DSP Blocks | 1,518 (variable-precision) | Variable-precision, 1.5 TFLOPs FP32 |
| Hard PCIe Gen3 Cores | Yes (x8 capable) | — |
| Hard Memory Controllers | Yes (DDR3/DDR4, QDR IV, RLDRAM 3) | — |
| Speed Grade | E3 (fastest commercial) | U3 (medium-performance, transceiver-focused) |
| Temperature Grade | L (extended commercial) | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Series | — | Arria 10 GX |
| User I/O Count | — | 480 |
| Package Code | — | F45 (45 × 45 mm FCBGA) |
| Package Type | — | 1932-ball FCBGA (Flip-Chip BGA) |
| Process Technology | — | 20 nm TSMC |
| Transceiver Data Rate | — | Up to 28.05 Gbps |
| PCIe Hard IP | — | Gen3 x8/x16 |
| Memory Interfaces | — | DDR4, DDR3, QDR IV, RLDRAM 3 |
| Betriebstemperatur | — | 0C to +100C (Industrial, E2 grade) |
| Configuration Method | — | SRAM-based, loaded via JTAG / AS / PS |
| Lead-Free / Halogen-Free | — | Yes / Yes |