10M04DAF256A7G vs 10M08DAF256C7G Vergleich

Detaillierter Direktvergleich von 10M04DAF256A7G von Intel und 10M08DAF256C7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10M04DAF256A7G 10M08DAF256C7G
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $3,53 $7,95
Family MAX 10 MAX 10
Logic Elements (LE) 4,000 8,000
Adaptive Logic Modules (ALM) Not applicable (MAX 10 uses 4-input LUT LE architecture) —
Embedded Memory (M9K bits) 178 Kbit —
User Flash Memory 250 Kbit (typical for MAX 10 04 family) 387,072 bits (approx. 48 KB)
Embedded 18x18 Multipliers Yes (MAX 10 DSP blocks) —
Maximum User I/O Pins 250 (package-dependent) —
Process Technology 55 nm TSMC low-power CMOS [DATA_NEEDED: process node, typically 55 nm embedded flash]
Gehäuse 256-LBGA (FineLine BGA, 17x17 mm) 256-pin LBGA (F256)
Montageart Surface Mount (BGA) Surface Mount
Operating Temperature Grade Automotive / Industrial (A7G = -40C to +125C TJ) —
Supply Voltage Core [DATA_NEEDED: core voltage, typically 1.2 V for MAX 10] —
Configuration Method On-chip flash (instant-on, single-chip mode) —
Integrated ADC Yes (MAX 10 ADC blocks) —
RoHS-Status Compliant Compliant (Pb-free "G" suffix)
Lead-Free Yes —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Programming Interface JTAG / Quartus Prime —
Embedded Memory (M9K blocks) — 46 (378 Kbits)
Maximum User I/O — 178
Core Voltage — 1.2 V
Betriebstemperatur — 0 °C to +85 °C (Commercial, "C" grade)
Package Dimensions — 17 mm × 17 mm, 1.0 mm ball pitch
On-chip ADC — 12-bit, 1 MSPS, 1 channel
PLLs — 2
18 × 18 Multipliers — 24
Configuration — Dual-configuration internal flash (D-series)
Internal Oscillator — Yes (on-chip)

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