10M08DCF256C8G vs 10M08DCF256A7G Vergleich
Detaillierter Direktvergleich von 10M08DCF256C8G von Intel und 10M08DCF256A7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M08DCF256C8G | 10M08DCF256A7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,28 | $15,20 |
| Series | MAX 10 | MAX 10 |
| Logic Elements | 8,000 | 8,000 LE |
| Embedded Memory (bits) | 387,072 (378 Kbits user flash + block SRAM) | — |
| User I/O Count | 178 | — |
| Gehäuse | 256-LBGA (F256, FineLine BGA) | 256-LBGA (FineLine BGA, F256) |
| Pitch | 1.0 mm | — |
| Speed Grade | C8 (commercial, slowest speed bin) | -7 |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Configuration | Internal flash (instant-on, non-volatile) | — |
| ADC | Dual 12-bit SAR, up to 17 analog inputs | — |
| 18x18 Multipliers | 8 | — |
| PLLs | 2 | — |
| Global Clock Networks | 4 | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | 55 nm |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Design Software | Intel Quartus Prime (Lite / Standard / Pro) | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (168 hours) | — |
| Embedded Memory | — | 378 Kbit (M9K blocks) |
| Total RAM Bits | — | 387,072 bits |
| User I/Os | — | 178 |
| Operating Supply Voltage (Core) | — | 1.2 V |
| Montagestil | — | SMD/SMT |
| Temperature Grade | — | Automotive (-40C to +125C) |
| Configuration Memory | — | On-die dual-configuration flash (non-volatile) |
| Lead Free | — | Yes |
| Integrated ADC | — | 12-bit, 1 MSPS, 16-channel (per family) |