10M08DCF256C8G vs 5CEBA4F17I7 Vergleich
Detaillierter Direktvergleich von 10M08DCF256C8G von Intel und 5CEBA4F17I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M08DCF256C8G | 5CEBA4F17I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,28 | $140,00 |
| Series | MAX 10 | Cyclone V E |
| Logic Elements | 8,000 | — |
| Embedded Memory (bits) | 387,072 (378 Kbits user flash + block SRAM) | — |
| User I/O Count | 178 | — |
| Gehäuse | 256-LBGA (F256, FineLine BGA) | 256-LBGA (F17, 17x17 mm, 1.0 mm pitch) |
| Pitch | 1.0 mm | — |
| Speed Grade | C8 (commercial, slowest speed bin) | 7 |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Configuration | Internal flash (instant-on, non-volatile) | — |
| ADC | Dual 12-bit SAR, up to 17 analog inputs | — |
| 18x18 Multipliers | 8 | — |
| PLLs | 2 | 4 |
| Global Clock Networks | 4 | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | 28 nm TSMC low-power |
| Betriebstemperatur | 0C to +85C (commercial) | -40C to +100C (industrial, 'I' grade) |
| Design Software | Intel Quartus Prime (Lite / Standard / Pro) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (168 hours) | — |
| Family | — | 5CEA4 |
| Logic Elements (LE) | — | 49,000 |
| Embedded Memory Bits | — | 3,464,192 |
| Embedded 18x18 Multipliers | — | 128 |
| User I/O Banks | — | 2 |
| Core Voltage | — | 1.1 V |
| Configuration Modes | — | AS, PS, FPP, JTAG |