10M16DAF484C7G vs 10M16DAF256C7G Vergleich
Detaillierter Direktvergleich von 10M16DAF484C7G von Intel und 10M16DAF256C7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M16DAF484C7G | 10M16DAF256C7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $55,50 | $13,80 |
| Family | MAX 10 | — |
| Logic Elements | 16000 | — |
| Embedded Memory | 504 Kbits (10,240 x 5 RAM bits) | — |
| Embedded User Flash | 562 Kbits | — |
| Digital Signal Processing (DSP) Blocks | 16 (18x18 multipliers) | — |
| Maximum User I/O Pins | 320 | — |
| ADC Blocks | 2 (12-bit SAR) | — |
| Analog Inputs | Up to 18 single-ended | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| Process Technology | 55 nm | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Betriebstemperatur | 0C to 85C (commercial, -7C speed grade) | 0C to +85C (C7G suffix = commercial) |
| Gehäuse | 484-FBGA (F484), 23 mm x 23 mm, 1.0 mm pitch | 256-LBGA (F256), 17x17 mm |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration | Non-volatile (dual-boot on-chip flash) | — |
| RoHS-Status | Compliant | Compliant |
| Product Family | — | MAX 10 |
| Logic Elements (LE) | — | 16000 |
| Maximum User I/O | — | 178 |
| Embedded Memory Bits | — | 562176 (549 Kbit) |
| Embedded RAM Blocks | — | M9K, 69 blocks (per family datasheet) |
| Configuration Memory | — | Dual-configuration flash (non-volatile) |
| User Flash Memory (UFM) | — | [DATA_NEEDED: UFM size in kB] |
| 18x18 Hardware Multipliers | — | [DATA_NEEDED: multiplier count] |
| Integrated ADC | — | Yes, 12-bit SAR (per MAX 10 family) |
| Supply Voltage - Core | — | 1.2 V (dual-supply variants) |
| Supply Voltage - I/O | — | 3.3 V (or LVCMOS 1.2-3.3 V per bank) |
| Speed Grade | — | 7 |
| MSL-Level | — | 3 (per JEDEC J-STD-020, BGA package) |