10M16DCU324C8G vs 10M16DAU324C8G Vergleich
Detaillierter Direktvergleich von 10M16DCU324C8G von Intel und 10M16DAU324C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M16DCU324C8G | 10M16DAU324C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $38,40 | $35,40 |
| Series | MAX 10 | — |
| Logic Elements (LE) | 16,000 | 16,000 |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| User Flash Memory | 562,176 bits | — |
| Maximum User I/O | 246 | 246 |
| Gehäuse | 324-LFBGA / 324-UBGA (U324) 15x15 mm | 324-UBGA (Ultra FineLine BGA) |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | 8 | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT] | — |
| Configuration Memory | Internal flash (non-volatile) | Internal flash, dual-boot capable |
| DSP Blocks | Yes (18x18 multipliers) | — |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| On-chip ADC | Yes (MAX 10 integrated) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | 3 | 3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | MAX 10 |
| Embedded Memory Bits | — | 562,176 |
| User Flash Memory (UFM) | — | [DATA_NEEDED: UFM size in Kb] |
| Core Supply Voltage | — | 1.2 V (on-chip regulator) |
| Process Technology | — | TSMC 55 nm CMOS (non-volatile) |
| Embedded ADC | — | 12-bit SAR ADC |
| Multipliers (18x18) | — | [DATA_NEEDED: multiplier count] |
| LVDS Performance | — | Up to 1.6 Gbps per pair |
| Memory Interface Support | — | DDR3, DDR2, LPDDR2 (hardened PHY) |
| Betriebstemperatur | — | Commercial (0C to +85C) - speed grade 8 |
| Lead-Free / Halogen-Free | — | Yes / [DATA_NEEDED] |