10M50SCE144A7G vs 10M50SAE144C8G Vergleich
Detaillierter Direktvergleich von 10M50SCE144A7G von Intel und 10M50SAE144C8G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M50SCE144A7G | 10M50SAE144C8G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,85 | $47,90 |
| Series | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50000 |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count and total bits] | — |
| Total User Flash Bits | 1,677,312 bits | — |
| User I/O Count | 101 | — |
| Number of LABs/CLBs | 3,125 | — |
| Supply Voltage - Core | 1.2 V (internal) | [DATA_NEEDED: core Vcc] |
| Supply Voltage - I/O | 3.0 V / 3.3 V LVCMOS/LVTTL | — |
| Betriebstemperatur | -40C to +100C (industrial) | 0C to +85C (Commercial, "C8" grade) |
| Montageart | Surface Mount | Surface Mount |
| Gehäuse / Bauform | 144-LQFP Exposed Pad (EQFP-144) | — |
| Number of PLLs | 2 | — |
| Integrated ADC | 12-bit, 1 MSPS (analog inputs package-dependent) | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020) | 3 |
| Configuration Method | On-chip non-volatile flash (instant-on, no external boot PROM) | — |
| Process Technology | TSMC 55 nm NOR-flash + SRAM | 55 nm embedded flash CMOS |
| Family | — | MAX 10 FPGA |
| Embedded Memory | — | 1677312 bits (approx. 1.6 Mbit) |
| Maximum User I/Os | — | 101 |
| Gehäuse | — | 144-LQFP Exposed Pad (EQFP-144) |
| Package Dimensions | — | 22 x 22 mm, 0.50 mm pitch |
| Configuration | — | Non-volatile, single-chip (on-chip flash) |
| On-chip User Flash | — | Up to 1.4 Mbit |
| ADC | — | 12-bit successive-approximation, up to 17 channels |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| I/O Standards | — | LVCMOS, LVDS, SSTL, RSDS, PCI |
| Hot Socketing | — | Yes |
| Thermal Resistance (Theta-JA) | — | [DATA_NEEDED: theta-JA C/W] |