A3P125VQG100 vs A3P125-1VQG100T Vergleich
Detaillierter Direktvergleich von A3P125VQG100 von Microchip Technology und A3P125-1VQG100T von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P125-VQG100 ProASIC3 Flash FPGA 71 I/O TQFP-100 | Microchip
A3P125VQG100 ✓ AktivMicrochip Technology
A3P125-1VQG100T - 125K Gate ProASIC3 FPGA 272MHz | Microchip
A3P125-1VQG100T ✓ AktivSpezifikationsvergleich
| Parameter | A3P125VQG100 | A3P125-1VQG100T |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,30 | $17,60 |
| Logic Elements | 1500 LEs (1.5K) | — |
| Number of I/O | 71 | — |
| Embedded Memory | 36864 bits true dual-port SRAM | — |
| Family | ProASIC3 Flash FPGA | ProASIC3 |
| Technology | Nonvolatile Flash | — |
| Gehäuse | 100-TQFP (VQG100, 14x14 mm) | 100-Pin TQFP (VQFP-100) |
| Montageart | Surface Mount | Surface Mount |
| Configuration | Self-contained, instant-on (no external boot PROM) | — |
| Soft ARM Support | Optional (ProASIC3 family feature) | — |
| LVDS-capable I/O | Supported in ProASIC3 family (700 Mbps DDR on A3P250 and above) | — |
| Versorgungsspannung | [DATA_NEEDED: core/IO supply voltage] | — |
| Maximum Operating Frequency | [DATA_NEEDED: system performance] | 272 MHz |
| Betriebstemperaturbereich | [DATA_NEEDED: temperature grade for VQG100 speed grade] | [DATA_NEEDED: operating temperature range] |
| Speed Grade | [DATA_NEEDED: speed grade suffix detail] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance statement] | [DATA_NEEDED: RoHS status] |
| Standard Package Quantity | 90 | — |
| Equivalent Gate Count | — | 125000 gates |
| Logic Elements / CLBs | — | 3072 |
| User I/O | — | 71 |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm CMOS |
| Configuration Technology | — | Nonvolatile Flash |
| Package Body Size | — | 14 x 14 mm |
| Lead Pitch | — | 0.5 mm |
| Packaging | — | Tray |
| Instant-On / Single Chip | — | Yes (no external configuration device required) |