A3P125VQG100 vs A3P125-VQ100T Vergleich
Detaillierter Direktvergleich von A3P125VQG100 von Microchip Technology und A3P125-VQ100T von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P125-VQG100 ProASIC3 Flash FPGA 71 I/O TQFP-100 | Microchip
A3P125VQG100 ✓ AktivMicrochip Technology
A3P125-VQ100T - 125K Gate Flash FPGA | Microchip | 100-VQFP
A3P125-VQ100T ✓ AktivSpezifikationsvergleich
| Parameter | A3P125VQG100 | A3P125-VQ100T |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,30 | $7,50 |
| Logic Elements | 1500 LEs (1.5K) | — |
| Number of I/O | 71 | — |
| Embedded Memory | 36864 bits true dual-port SRAM | — |
| Family | ProASIC3 Flash FPGA | — |
| Technology | Nonvolatile Flash | — |
| Gehäuse | 100-TQFP (VQG100, 14x14 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Configuration | Self-contained, instant-on (no external boot PROM) | — |
| Soft ARM Support | Optional (ProASIC3 family feature) | — |
| LVDS-capable I/O | Supported in ProASIC3 family (700 Mbps DDR on A3P250 and above) | — |
| Versorgungsspannung | [DATA_NEEDED: core/IO supply voltage] | 1.425V to 1.575V |
| Maximum Operating Frequency | [DATA_NEEDED: system performance] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: temperature grade for VQG100 speed grade] | — |
| Speed Grade | [DATA_NEEDED: speed grade suffix detail] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance statement] | RoHS non-compliant |
| Standard Package Quantity | 90 | — |
| System Gates | — | 125000 |
| Logic Cells / Logic Blocks | — | 3072 |
| RAM Bits | — | 36864 |
| User I/Os | — | 71 |
| Package Type | — | 100-VQFP (14x14 mm) |
| Betriebstemperatur | — | -40°C to 125°C (TJ) |
| Logic Family | — | CMOS |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), Flash-Based |
| Gehäuse / Bauform | — | 100-TQFP |
| Supplier Device Package | — | 100-VQFP (14x14) |
| AEC-Q100 | — | Qualified |
| Packaging | — | Tray |