A3P250-2FGG144 vs A3P060-2FGG144 Vergleich

Detaillierter Direktvergleich von A3P250-2FGG144 von Microchip Technology und A3P060-2FGG144 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3P250-2FGG144 A3P250-2FGG144 - ProASIC3 Flash FPGA 250K Gates | Microchip

A3P250-2FGG144 - ProASIC3 Flash FPGA 250K Gates | Microchip

A3P250-2FGG144 ✓ Aktiv
Microchip Technology
A3P060-2FGG144 A3P060-2FGG144 - ProASIC3 Flash FPGA 60K Gates FBGA-144 | Microchip

A3P060-2FGG144 - ProASIC3 Flash FPGA 60K Gates FBGA-144 | Microchip

A3P060-2FGG144 ✓ Aktiv

Spezifikationsvergleich

Parameter A3P250-2FGG144 A3P060-2FGG144
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $27,80 $5,62
Family ProASIC3 Flash FPGA ProASIC3 Flash FPGA
System Gates 250K 60000
User I/Os 97 —
Configuration Memory 36864 (on-chip flash) On-chip flash (non-volatile)
Speed Grade -2 -2
Maximum System Performance 310 MHz —
Process Technology 130 nm 130 nm flash
Core Supply Voltage 1.5 V 1.5 V
Gehäuse 144-LBGA (FBGA-144) 144-ball FBGA (FGG144)
Montagestil SMD/SMT —
Operating Temperature (Min) 0 C —
Operating Temperature (Max) +70 C —
Packaging Tray —
Soft ARM Support Yes (optional, ProASIC3 family) —
Configuration Type Flash (single-chip, live at power-up) —
Reprogrammability Yes (in-system reprogrammable) —
Maximum System Frequency — 310 MHz
User I/O — 96
DigiKey Listing Value — 18432
Montageart — Surface Mount
Betriebstemperatur — [DATA_NEEDED: Operating Temperature]
Number of Logic Elements — [DATA_NEEDED: Number of Logic Elements]
Embedded Memory — [DATA_NEEDED: Embedded Memory]
MSL-Level — [DATA_NEEDED: MSL Level]
RoHS-Status — [DATA_NEEDED: RoHS Status]

Datenblätter & Ressourcen

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