A3P600-2FG484 vs A3P600-FGG484 Vergleich
Detaillierter Direktvergleich von A3P600-2FG484 von Microchip Technology und A3P600-FGG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | A3P600-2FG484 | A3P600-FGG484 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $61,50 | $44,75 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600K | 600K |
| Logic Elements (LEs) | 7K LEs (approx.) | — |
| User I/Os | 235 | — |
| RAM Bits | 110592 | — |
| Core Supply Voltage | 1.5V | 1.5 V |
| Maximum System Performance | 310 MHz | — |
| I/O Banks | 4 | — |
| Gehäuse | 484-BGA (FBGA) | 484-Pin FBGA (FGG484) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Process Technology | 130nm CMOS | 130 nm CMOS |
| Configuration | Flash-based | — |
| RoHS-Status | Compliant | Lead Free |
| Lead-Free | Yes | — |
| Maximum System Frequency | — | 231 MHz |
| User I/O Count | — | 235 |
| Configuration Memory | — | Flash-based (non-volatile, single chip) |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |