A3P600-FG256I vs A3P600-1FGG256I Vergleich
Detaillierter Direktvergleich von A3P600-FG256I von Microchip Technology und A3P600-1FGG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3P600-FG256I - ProASIC3 FPGA, 600K Gates | Microchip Technology
A3P600-FG256I ✓ AktivMicrochip Technology
A3P600-1FGG256I - ProASIC3 FPGA, 600K Gates | Microchip
A3P600-1FGG256I ✓ AktivSpezifikationsvergleich
| Parameter | A3P600-FG256I | A3P600-1FGG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $23,10 | $16,19 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Series | ProASIC3 | — |
| System Gates | 600,000 | — |
| Logic Elements / VersaTiles | 13,824 VersaTiles (7K logic elements per Mouser) | — |
| Total RAM Bits | 110,592 | 110592 |
| Number of User I/O | 177 | — |
| Core Supply Voltage | 1.5 V | 1.5V |
| Maximum Internal Frequency | [DATA_NEEDED: accurate maximum frequency; distributor listings cite 231 MHz or 350 MHz] | — |
| Gehäuse | 256-LBGA (FBGA-256) | — |
| Package Dimensions | 17 x 17 mm, 1.6 mm height, 1 mm pitch | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperaturbereich | [DATA_NEEDED: exact industrial temperature range (I suffix)] | — |
| Programming Technology | Nonvolatile Flash | — |
| Reprogrammability | In-system programmable | — |
| I/O Supply Voltage Range | [DATA_NEEDED: exact I/O bank voltage range] | — |
| RoHS-Status | unknown | Compliant |
| REACH Status | unknown | — |
| Lebenszyklusstatus | active per DigiKey (ships today) | — |
| Family | — | ProASIC3 |
| Number of Logic Elements/Cells | — | 7KLEs |
| Number of I/O | — | 177 |
| Number of Gates | — | 600K |
| Voltage - Supply | — | 1.425V ~ 1.575V |
| Gehäuse / Bauform | — | 256-LBGA |
| Supplier Device Package | — | 256-FBGA |
| Betriebstemperatur | — | -40°C ~ 100°C (TJ) |
| Maximum Operating Frequency | — | 272 MHz |
| Technology | — | 130nm |
| Number of I/O Banks | — | [DATA_NEEDED: Number of I/O Banks] |
| Embedded Memory | — | 110592 bits |