A3P600-FGG484 vs A3PE600-FG484M Vergleich

Detaillierter Direktvergleich von A3P600-FGG484 von Microchip Technology und A3PE600-FG484M von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3P600-FGG484 A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip

A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip

A3P600-FGG484 ✓ Aktiv
Microchip Technology
A3PE600-FG484M A3PE600-FG484M - 600K-Gate ProASIC3E Flash FPGA | Microchip

A3PE600-FG484M - 600K-Gate ProASIC3E Flash FPGA | Microchip

A3PE600-FG484M ✓ Aktiv

Spezifikationsvergleich

Parameter A3P600-FGG484 A3PE600-FG484M
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $44,75 $68,90
Family ProASIC3 ProASIC3E (Flash-Based FPGA)
System Gates 600K 600000
Maximum System Frequency 231 MHz 231 MHz
Process Technology 130 nm CMOS —
Core Supply Voltage 1.5 V —
User I/O Count 235 —
Gehäuse 484-Pin FBGA (FGG484) 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm ball pitch
Montageart Surface Mount Surface Mount
Configuration Memory Flash-based (non-volatile, single chip) —
Terminal Form Ball —
Package Shape Square BGA —
Temperature Grade Commercial —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Operating Temperature Minimum 0 C —
Operating Temperature Maximum [DATA_NEEDED: maximum operating temperature] —
RoHS-Status Lead Free [DATA_NEEDED: RoHS status]
Number of Logic Elements (LEs) [DATA_NEEDED: logic element count] —
Embedded Memory [DATA_NEEDED: embedded SRAM capacity] —
Logic Elements / Cells — 13824
CLBs — 13824
Maximum User I/O — 270
Embedded SRAM — 110592 bits (True Dual-Port)
Technology — 130 nm, 7-layer metal (6 copper), flash-based CMOS
Core Voltage — 1.2 V to 1.5 V
Supply Voltage Range — 1.14 V to 1.575 V (nominal 1.5 V)
Configuration — Live-at-power-up flash fabric, single-chip (no external boot device)
Betriebstemperatur — [DATA_NEEDED: operating temperature range]
Packaging — Tray (M suffix)
Distributor Stock Reference — 4480 pieces (Heisener listing)

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