A3P600L-FG484I vs A3P600L-FG484 Vergleich

Detaillierter Direktvergleich von A3P600L-FG484I von Microchip Technology und A3P600L-FG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3P600L-FG484I A3P600L-FG484I - ProASIC3L Flash FPGA 600K Gates | Microchip

A3P600L-FG484I - ProASIC3L Flash FPGA 600K Gates | Microchip

A3P600L-FG484I ✓ Aktiv
Microchip Technology
A3P600L-FG484 A3P600L-FG484 - ProASIC3L Low Power FPGA 600K Gates | Microchip

A3P600L-FG484 - ProASIC3L Low Power FPGA 600K Gates | Microchip

A3P600L-FG484 ✓ Aktiv

Spezifikationsvergleich

Parameter A3P600L-FG484I A3P600L-FG484
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $45,60 $85,90
Family ProASIC3L ProASIC3L (Flash FPGAs)
System Gates 600000 600000
Logic Cells 13824 —
User I/O 235 —
Core Voltage 1.2 V to 1.5 V —
Technology 130 nm flash CMOS CMOS, non-volatile flash based
Gehäuse 484-ball FBGA (FG484) 484-FBGA (23 x 23 mm, 1.0 mm pitch, 2.23 mm height)
Package Dimensions 23 x 23 mm, 1.0 mm ball pitch —
Package Height 2.23 mm —
Montageart Surface Mount Surface Mount
Configuration Memory Nonvolatile flash, single-chip, Instant On —
Temperature Grade I (Industrial) —
Betriebstemperatur [DATA_NEEDED: exact operating temperature range] 0C to +85C (TJ)
Supply Voltage - I/O [DATA_NEEDED: I/O bank voltage range] —
Embedded Memory [DATA_NEEDED: embedded SRAM capacity] —
Reprogrammability Yes, in-system reprogrammable flash fabric —
RoHS-Status [DATA_NEEDED: RoHS compliance status] Non-compliant (per Microchip USA listing)
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Logic Cells / CLBs — 13824
Total RAM Bits — 110592
User I/Os — 235
Core Supply Voltage — 1.14 V to 1.575 V
Max Operating Frequency — 350 MHz (family rating)
Special Features — Flash*Freeze low-power standby technology
Configuration — Single-chip, on-chip flash (no external boot device)
Packaging — Tray
Manufacturer Lead Time — 8 weeks
Product Status — Active

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