A3PE3000-1FGG896 vs A3PE3000L-1FGG896 Vergleich
Detaillierter Direktvergleich von A3PE3000-1FGG896 von Microchip Technology und A3PE3000L-1FGG896 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000-1FGG896 - ProASIC3E Flash FPGA 3M Gates 620 I/O | Microchip
A3PE3000-1FGG896 ✓ AktivMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000-1FGG896 | A3PE3000L-1FGG896 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $255,00 |
| Family | ProASIC3E (Flash FPGA) | ProASIC3L |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells | 75,264 | 75264 |
| User I/O | 620 | 620 |
| Speed Grade | -1 | -1 |
| Gehäuse | 896-ball FBGA (FGG896) | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Technology | Nonvolatile flash, CMOS | — |
| Configuration | Single-chip, Instant On (on-chip flash) | — |
| Reprogrammability | Yes (in-system reprogrammable flash fabric) | — |
| Montageart | Surface Mount | Surface Mount |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V (supports 1.2 V to 1.5 V) |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Embedded Memory | [DATA_NEEDED: embedded block RAM capacity] | — |
| Lead Free | Yes (LEAD FREE per distributor listing) | — |
| RoHS-Status | Compliant | — |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Country of Origin | South Korea (per MicrochipDirect for A3PE3000-1FG896 family variant) | — |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| I/O Voltage | — | As low as 1.2 V |
| Process Technology | — | 130 nm flash |
| Configuration Memory | — | Nonvolatile flash (single-chip) |
| Special Features | — | Flash*Freeze technology |
| Packaging | — | Tray |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |