A3PE3000-2FG484 vs A3PE3000L-FG484 Vergleich
Detaillierter Direktvergleich von A3PE3000-2FG484 von Microchip Technology und A3PE3000L-FG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FG484 ✓ AktivMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000-2FG484 | A3PE3000L-FG484 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $152,00 | $112,00 |
| Family | ProASIC3E Flash FPGAs | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells (DFF-equivalent) | 75,264 | — |
| VersaTiles | 75,264 | — |
| User I/O | 341 | — |
| Embedded SRAM | 516,096 bits | — |
| Core Voltage | 1.5 V | — |
| Technology | 130 nm CMOS flash process | 130 nm CMOS flash, nonvolatile |
| Maximum System Performance | 310 MHz | — |
| Speed Grade | -2 | — |
| Configuration | Non-volatile Flash (single-chip, instant-on) | Flash-based, Instant On, single-chip |
| Soft ARM Support | Yes (optional Cortex-M1 soft core) | — |
| Gehäuse | 484-ball FBGA (FG484) | — |
| Montageart | Surface Mount | Surface Mount |
| Operating Temperature (commercial) | 0C to +85C | — |
| RoHS-Status | Non-G suffix (standard package); G-suffix variants are RoHS-compliant | [DATA_NEEDED: RoHS compliance] |
| I/O Standards | Voltage-referenced I/O supported (VREF per minibank) | — |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Low Power Feature | — | Flash*Freeze technology |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Betriebstemperatur | — | [DATA_NEEDED: Operating Temperature] |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |
| Embedded Memory | — | [DATA_NEEDED: Embedded RAM block capacity] |