A3PE3000-FGG324 vs A3PE3000L-FGG324 Vergleich
Detaillierter Direktvergleich von A3PE3000-FGG324 von Microchip Technology und A3PE3000L-FGG324 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000-FGG324 - ProASIC3E FPGA 3M Gates 221 I/O | Microchip
A3PE3000-FGG324 ✓ AktivMicrochip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000-FGG324 | A3PE3000L-FGG324 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $335,22 | $86,15 |
| Family | ProASIC3E | ProASIC3L (Flash-based FPGA) |
| System Gates | 3000000 gates | 3,000,000 |
| Logic Cells | 75264 cells | — |
| Number of I/O | 221 | — |
| Core Supply Voltage | 1.425 V to 1.575 V | — |
| Process Technology | 130 nm flash | — |
| Maximum System Frequency | 231 MHz | — |
| Embedded Flash Bits | 516096 bits | — |
| Configuration Type | Flash (nonvolatile, single-chip) | — |
| Gehäuse | 324-Ball FBGA (FGG324) | 324-BGA / FBGA (FGG324) |
| Package Dimensions | 19 x 19 mm, 1.63 mm height, 1 mm pitch | — |
| Montageart | Surface Mount | — |
| Soft ARM Support | Yes (optional soft ARM core support) | — |
| RoHS-Status | Green (compliant) | [DATA_NEEDED: RoHS status] |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature] | 0 C to +70 C (commercial) |
| Technology Node Family | CMOS flash FPGA | — |
| Manufacturer Part Number | — | A3PE3000L-FGG324 |
| Logic Cells (CLBs) | — | 75264 |
| User I/O | — | 221 |
| Configuration Memory | — | On-chip Flash (single-chip, nonvolatile) |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Betriebsversorgungsspannung | — | 1.5 V |
| Maximum Operating Frequency | — | 250 MHz |
| Special Features | — | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down |
| Boundary Scan | — | IEEE 1149.1 (JTAG) |
| Montagestil | — | SMD/SMT |
| Packaging | — | Tray |
| Embedded RAM | — | [DATA_NEEDED: embedded RAM capacity] |