A3PE3000-PQG208X3 vs A3PE3000L-1PQG208 Vergleich

Detaillierter Direktvergleich von A3PE3000-PQG208X3 von Microchip Technology und A3PE3000L-1PQG208 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE3000-PQG208X3 A3PE3000-PQG208X3 - 3M-Gate Flash FPGA, 231MHz | Microchip

A3PE3000-PQG208X3 - 3M-Gate Flash FPGA, 231MHz | Microchip

A3PE3000-PQG208X3 ✓ Aktiv
Microchip Technology
A3PE3000L-1PQG208 A3PE3000L-1PQG208 - ProASIC3L FPGA 147 I/O | Microchip

A3PE3000L-1PQG208 - ProASIC3L FPGA 147 I/O | Microchip

A3PE3000L-1PQG208 ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE3000-PQG208X3 A3PE3000L-1PQG208
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $128,00 $162,90
Family ProASIC3E Flash FPGA ProASIC3L (ProASIC3E family, low power)
System Gates 3,000,000 (3M) 3000000
Maximum System Frequency 231 MHz —
Process Technology 130 nm flash 130 nm flash
Core Supply Voltage 1.5 V —
Number of I/Os (PQG208) 147 —
Total Memory Bits 516096 —
Configuration Technology Nonvolatile Flash (Instant-On, single-chip) —
Gehäuse 208-pin BFQFP (PQG208), 0.5 mm pitch 208-BFQFP (PQFP-208)
Montageart Surface Mount —
Packing Option Tape and Reel (X3 suffix) —
Soft ARM Support Optional (per family datasheet) —
Reprogrammability Yes (in-system reprogrammable) —
Betriebstemperatur [DATA_NEEDED: operating temperature range] —
I/O Bank Voltage Support [DATA_NEEDED: supported I/O standards/voltages] —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Applications Markets Consumer, networking/communications, computing, avionics —
Manufacturer Part Number — A3PE3000L-1PQG208
Logic Elements — 35K LEs
Number of I/O — 147
Core Voltage — 1.2 V to 1.5 V
Betriebsversorgungsspannung — 1.5 V
Maximum Operating Frequency — 892.86 MHz
Configuration Memory — Flash (single-chip, reprogrammable)
Low Power Feature — Flash*Freeze technology (40% dynamic / 50% static power reduction)
Montagestil — SMD/SMT
Betriebstemperaturbereich — 0C to +70C
Packaging — Tray
Lead Free — Yes (G suffix)

Datenblätter & Ressourcen

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