A3PE3000L-1FG484M vs A3PE3000L-1FGG484M Vergleich
Detaillierter Direktvergleich von A3PE3000L-1FG484M von Microchip Technology und A3PE3000L-1FGG484M von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000L-1FG484M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FG484M ✓ AktivMicrochip Technology
A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip
A3PE3000L-1FGG484M ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000L-1FG484M | A3PE3000L-1FGG484M |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $117,60 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| System Gates | 3000000 | 3000000 |
| Logic Elements | [DATA_NEEDED: exact LE count] | 35K LEs |
| Number of I/O | 341 | — |
| Maximum Frequency | 250 MHz | — |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Technology | 130 nm flash process | — |
| Configuration Memory | On-chip Flash (instant-on, reprogrammable) | — |
| Low Power Feature | Flash*Freeze technology | — |
| Gehäuse | 484-ball FBGA (FG484) | 484-ball FBGA (FGG484), 1 mm pitch |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | -1 (standard) | -1 |
| Temperature Grade / Operating Temp | M (per ordering code); [DATA_NEEDED: exact operating temperature range] | — |
| JTAG Boundary Scan | IEEE 1149.1 supported | — |
| Input Options | Schmitt trigger option on single-ended inputs (A3PE3000L) | — |
| Pull Options | Weak pull-up / pull-down | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| CLBs | — | 75264 |
| User I/Os | — | 341 |
| Embedded SRAM | — | 516096 bits (504 kbits) true dual-port |
| I/O Voltage (VCCI) | — | as low as 1.2 V |
| Process Technology | — | 130 nm, 7-layer metal (6 copper) flash-based CMOS |
| Configuration | — | Non-volatile Flash, live-at-power-up, single-chip, reprogrammable |
| Special Features | — | Flash*Freeze technology |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range for -M suffix] |
| Design Software | — | Microchip Libero SoC |