A3PE3000L-1FG896I vs A3PE3000L-FGG896I Vergleich
Detaillierter Direktvergleich von A3PE3000L-1FG896I von Microchip Technology und A3PE3000L-FGG896I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000L-1FG896I - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FG896I ✓ AktivMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000L-1FG896I | A3PE3000L-FGG896I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $139,90 |
| Family | ProASIC3L (Flash FPGA) | ProASIC3L |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells | 75,264 | — |
| User I/O | 620 | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Process Technology | 130 nm CMOS flash | — |
| Maximum Frequency | 892.86 MHz | — |
| Gehäuse | 896-ball FBGA (FG896), 1.00 mm pitch | — |
| Montageart | Surface Mount | Surface Mount (SMD/SMT) |
| Betriebstemperatur | -40C to +85C (Industrial) | Industrial grade (I suffix) |
| Configuration Memory | On-chip Flash (non-volatile, single chip) | — |
| Low Power Feature | Flash*Freeze Technology | — |
| JTAG Boundary Scan | IEEE 1149.1 | — |
| Input Options | Schmitt trigger option on single-ended inputs | — |
| Pull Options | Weak pull-up / pull-down | — |
| Reprogrammability | Live reprogrammable | — |
| Speed Grade | -1 | Standard (no speed suffix) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Versorgungsspannung | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Gehäuse / Bauform | — | 896-BGA (FBGA, 1 mm pitch) |
| Packaging | — | Tray, standard quantity 27 |