A3PE3000L-1FGG896 vs A3PE3000L-FG896I Vergleich

Detaillierter Direktvergleich von A3PE3000L-1FGG896 von Microchip Technology und A3PE3000L-FG896I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE3000L-1FGG896 A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip

A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip

A3PE3000L-1FGG896 ✓ Aktiv
Microchip Technology
A3PE3000L-FG896I A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip

A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip

A3PE3000L-FG896I ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE3000L-1FGG896 A3PE3000L-FG896I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $255,00 $0,00
Family ProASIC3L ProASIC3L (Low Power Flash FPGA)
System Gates 3000000 3000000
Logic Cells 75264 75264
User I/O 620 620
Total Bits of RAM [DATA_NEEDED: Total embedded RAM bits] —
Core Voltage 1.2 V (supports 1.2 V to 1.5 V) 1.2 V to 1.5 V
I/O Voltage As low as 1.2 V —
Speed Grade -1 [DATA_NEEDED: speed grade / grade code]
Process Technology 130 nm flash —
Configuration Memory Nonvolatile flash (single-chip) On-chip Flash (single-chip, nonvolatile)
Special Features Flash*Freeze technology —
Gehäuse 896-ball FBGA (FGG896), 1.00 mm pitch 896-BGA (FBGA-896)
Montageart Surface Mount Surface Mount
Packaging Tray —
Terminal Pitch 1.00 mm —
Technology Base CMOS flash —
Dynamic Power Reduction vs ProASIC3 Approx. 40% —
Static Power Reduction vs ProASIC3 Approx. 50% —
I/O Voltage (minimum) — 1.2 V
Low Power Feature — Flash*Freeze technology (40% dynamic / 50% static power reduction)
Temperature Grade — Industrial (-I suffix)
Reprogrammability — Yes (in-system reprogrammable)
RoHS-Status — RoHS Non-Compliant (per distributor listing)
Lead Free Status — Contains Lead (per distributor listing)
Betriebstemperaturbereich — [DATA_NEEDED: exact operating temperature range in C]
Embedded Memory — [DATA_NEEDED: embedded SRAM block capacity]

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern