A3PE3000L-FG324 vs A3PE3000L-1FGG324I Vergleich
Detaillierter Direktvergleich von A3PE3000L-FG324 von Microsemi und A3PE3000L-1FGG324I von Microsemi. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | A3PE3000L-FG324 | A3PE3000L-1FGG324I |
|---|---|---|
| Marke | Microsemi | Microsemi |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,00 |
| Family | ProASIC3EL (ProASIC3E Low Power) | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| User I/O | 221 | 221 |
| Core Voltage | 1.2 V (supports 1.2 V to 1.5 V) | 1.2 V (1.2 V to 1.5 V range) |
| Process Technology | 130 nm CMOS flash | 130 nm flash |
| Gehäuse | 324-ball FBGA | 324-ball FBGA (FGG), 19 x 19 mm |
| Configuration Memory | On-chip flash (non-volatile, single chip) | — |
| Montageart | Surface Mount | Surface Mount |
| Max Reported Frequency (parameter listing) | 781.25 MHz (per FindIC parameter data) | — |
| RoHS-Status | RoHS Non-Compliant (contains lead, FG variant) | [DATA_NEEDED: RoHS Status] |
| Lead Free Status | Contains Lead (FG variant); choose FGG variant for lead-free | — |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature] | -40C to +125C (Industrial, I suffix) |
| Embedded Memory | [DATA_NEEDED: Embedded Memory] | — |
| DLL/PLL Blocks | [DATA_NEEDED: DLL/PLL Blocks] | — |
| MSL-Level | [DATA_NEEDED: MSL Level] | — |
| Programming Method | In-system / on-board flash programming | — |
| Logic Elements (Cells) | — | 75264 |
| Embedded RAM Bits | — | 516096 |
| Speed Grade | — | -1 |
| Programming Technology | — | Nonvolatile Flash (Instant On, single chip) |
| Low Power Feature | — | Flash*Freeze Technology |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |
| Number of Logic Blocks (CLBs) | — | 75264 |