A3PE3000L-FG484 vs A3PE3000-2FG484 Vergleich

Detaillierter Direktvergleich von A3PE3000L-FG484 von Microchip Technology und A3PE3000-2FG484 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE3000L-FG484 A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip

A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip

A3PE3000L-FG484 ✓ Aktiv
Microchip Technology
A3PE3000-2FG484 A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip

A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip

A3PE3000-2FG484 ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE3000L-FG484 A3PE3000-2FG484
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $112,00 $152,00
Family ProASIC3L (Low Power Flash FPGA) ProASIC3E Flash FPGAs
System Gates 3000000 3,000,000
Logic Cells / CLBs 75264 —
User I/Os 341 —
Maximum System Frequency 250 MHz —
Core Voltage Range 1.2 V to 1.5 V —
Technology 130 nm CMOS flash, nonvolatile 130 nm CMOS flash process
Configuration Flash-based, Instant On, single-chip Non-volatile Flash (single-chip, instant-on)
Low Power Feature Flash*Freeze technology —
Package Type 484-ball FBGA (PBGA484) —
Package Dimensions 23 x 23 mm, 1 mm ball pitch —
Package Height 2.23 mm —
Montageart Surface Mount Surface Mount
Process CMOS —
Betriebstemperatur [DATA_NEEDED: Operating Temperature] —
Supply Voltage I/O [DATA_NEEDED: I/O supply voltage range] —
Embedded Memory [DATA_NEEDED: Embedded RAM block capacity] —
RoHS-Status [DATA_NEEDED: RoHS compliance] Non-G suffix (standard package); G-suffix variants are RoHS-compliant
Logic Cells (DFF-equivalent) — 75,264
VersaTiles — 75,264
User I/O — 341
Embedded SRAM — 516,096 bits
Core Voltage — 1.5 V
Maximum System Performance — 310 MHz
Speed Grade — -2
Soft ARM Support — Yes (optional Cortex-M1 soft core)
Gehäuse — 484-ball FBGA (FG484)
Operating Temperature (commercial) — 0C to +85C
I/O Standards — Voltage-referenced I/O supported (VREF per minibank)

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