A3PE3000L-FG896I vs A3PE3000-FG896I Vergleich

Detaillierter Direktvergleich von A3PE3000L-FG896I von Microchip Technology und A3PE3000-FG896I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE3000L-FG896I A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip

A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip

A3PE3000L-FG896I ✓ Aktiv
Microchip Technology
A3PE3000-FG896I A3PE3000-FG896I - ProASIC3E FPGA, 3M Gates, 896-BGA | Microchip

A3PE3000-FG896I - ProASIC3E FPGA, 3M Gates, 896-BGA | Microchip

A3PE3000-FG896I ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE3000L-FG896I A3PE3000-FG896I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $195,00
Family ProASIC3L (Low Power Flash FPGA) ProASIC3E Flash Family FPGAs
System Gates 3000000 3M gates
Logic Cells 75264 —
User I/O 620 —
Core Voltage 1.2 V to 1.5 V —
I/O Voltage (minimum) 1.2 V —
Configuration Memory On-chip Flash (single-chip, nonvolatile) Nonvolatile Flash (single-chip, Instant On)
Low Power Feature Flash*Freeze technology (40% dynamic / 50% static power reduction) —
Gehäuse 896-BGA (FBGA-896) 896-Pin FBGA (896-BGA)
Montageart Surface Mount Surface Mount
Temperature Grade Industrial (-I suffix) I (Industrial)
Reprogrammability Yes (in-system reprogrammable) —
RoHS-Status RoHS Non-Compliant (per distributor listing) RoHS Compliant: Yes
Lead Free Status Contains Lead (per distributor listing) —
Speed Grade [DATA_NEEDED: speed grade / grade code] —
Betriebstemperaturbereich [DATA_NEEDED: exact operating temperature range in C] Industrial (-40C to +85C)
Embedded Memory [DATA_NEEDED: embedded SRAM block capacity] —
Logic Elements — 35KLEs
User I/Os — 620
Maximum System Frequency — 231 MHz
Core Supply Voltage — 1.5 V
Process Technology — 130 nm flash
Package Dimensions — 31 x 31 x 2.44 mm
Terminal Form — Ball
Packaging — Tray
Programming Support — Reprogrammable, Cortex-M1 soft processor support

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