A3PE3000L-PQG208I vs A3PE1500-PQG208I Vergleich
Detaillierter Direktvergleich von A3PE3000L-PQG208I von Microchip Technology und A3PE1500-PQG208I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE3000L-PQG208I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-PQG208I ✓ AktivMicrochip Technology
A3PE1500-PQG208I - 1.5M Gate ProASIC3E FPGA | Microchip
A3PE1500-PQG208I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE3000L-PQG208I | A3PE1500-PQG208I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $48,90 | $60,20 |
| Family | ProASIC3L | ProASIC3E |
| System Gates | 3000000 | 1,500,000 |
| Total RAM Bits | 516096 | — |
| Number of I/O | 147 | — |
| Supply Voltage Range | 1.14 V to 1.575 V | — |
| Core Voltage | 1.2 V (low-power option), 1.2 V to 1.5 V range | — |
| Betriebstemperatur | -40C to +100C (TJ) | -40°C to +100°C (industrial) |
| Gehäuse | 208-BFQFP (PQFP 28x28 mm) | 208-PQFP (28x28 mm, 0.5 mm pitch) |
| Montageart | Surface Mount | Surface Mount |
| Technology | 130 nm flash process | — |
| Maximum Operating Frequency | 781.25 MHz | — |
| Configuration Memory | On-chip flash, single-chip (no external boot device) | — |
| Special Features | FlashFreeze technology, Power Driven Layout support | — |
| Moisture Sensitivity | MSL rated (Yes per distributor data) | — |
| Packaging | Tray, factory pack quantity 24 | — |
| RoHS-Status | Lead free (per Microchip/Mouser listing of family) | Compliant |
| Height | 3.4 mm | — |
| Length x Width | 28 mm x 28 mm | — |
| Logic Elements | — | 38,400 |
| User I/Os | — | 147 |
| RAM Bits | — | 276,480 |
| Maximum Internal Frequency | — | 350 MHz |
| Core Supply Voltage | — | 1.5 V |
| I/O Standards | — | LVCMOS, LVTTL, PCI, etc. |
| Configuration | — | Flash-based, non-volatile |
| Process Technology | — | 130 nm |
| MSL-Level | — | 3 |