A3PE600-1FGG484 vs A3PE600-FGG484I Vergleich
Detaillierter Direktvergleich von A3PE600-1FGG484 von Microchip Technology und A3PE600-FGG484I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip
A3PE600-1FGG484 ✓ AktivMicrochip Technology
A3PE600-FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip
A3PE600-FGG484I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE600-1FGG484 | A3PE600-FGG484I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $44,90 | $44,03 |
| Family | ProASIC3E | ProASIC3E |
| System Gates | 600000 | 600000 |
| Logic Cells / CLBs | 13824 | — |
| User I/Os (this package) | 270 | — |
| Max User I/Os (family) | 616 | — |
| Embedded SRAM | 110592 bits (504 kbits true dual-port max per family data) | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Configuration Memory | On-chip flash, live at power-up (Level 0) | On-chip flash (Instant On, single chip) |
| Speed Grade | -1 | — |
| Betriebstemperatur | 0 C to +85 C (TJ) | -40C to +85C (Industrial) |
| Gehäuse | 484-FPBGA (FBGA-484), 23 x 23 mm, 1 mm pitch | FBGA-484 (PBGA484), green |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Packaging | Tray | — |
| RoHS-Status | ROHS3 Compliant | Compliant (green package per Jotrin) |
| Product Status | Active | — |
| Manufacturer Lead Time | 8 weeks | — |
| Reprogrammability | Yes, single-chip solution, no external boot device | — |
| Logic Cells | — | 13824 cells |
| CLBs | — | 13824 |
| Maximum Frequency | — | 350 MHz |
| User I/Os | — | 270 |
| Embedded Flash Memory | — | 110592 bits |
| Technology | — | CMOS, flash-based nonvolatile |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height, 1.0 mm ball pitch |
| Terminal Form | — | Ball |
| Number of Terminals | — | 484 |