A3PE600-FG256I vs M7AFS600-FGG256I Vergleich
Detaillierter Direktvergleich von A3PE600-FG256I von Microchip Technology und M7AFS600-FGG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE600-FG256I - 600K Gate Flash FPGA, 256-FBGA | Microchip
A3PE600-FG256I ✓ AktivMicrochip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ AktivSpezifikationsvergleich
| Parameter | A3PE600-FG256I | M7AFS600-FGG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $44,60 | $0,00 |
| Logic Gates | 600000 | — |
| D Flip-Flops (DFFs) | 13824 | — |
| CLBs / VersaTiles | 13824 | — |
| Number of User I/O | 165 | — |
| Maximum System Frequency | 350 MHz | 1098.9 MHz (per distributor parametric listing) |
| Core Supply Voltage | 1.425 V to 1.575 V | — |
| Technology | 130 nm CMOS flash-based | — |
| Configuration Memory | Nonvolatile Flash (single-chip, live at power-up) | — |
| Betriebstemperatur | -40C to +100C (TJ), industrial | — |
| Gehäuse | 256-FBGA (LBGA), 17 x 17 mm, 1.0 mm pitch | 256-LBGA (FBGA), 1 mm ball pitch |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| RoHS-Status | RoHS Non-Compliant (contains lead; FGG variant is green) | — |
| Lead Free Status | Contains Lead | — |
| Family | ProASIC3E | Fusion Mixed-Signal FPGA |
| Speed Grade | Standard (-1) | — |
| System Gates | — | 600K |
| User I/O | — | 119 |
| Core Voltage | — | 1.5 V |
| Process Technology | — | 130 nm |
| Embedded Processor | — | ARM CoreMP7 |
| Fabric Type | — | Flash-based, non-volatile, instant-on |
| Analog Subsystem | — | Integrated configurable analog (per Microchip Fusion family page) |
| On-chip Flash Memory | — | Yes (large flash memory blocks, per Microchip Fusion family page) |
| Clock Management | — | Integrated clock generation and management circuitry (PLLs) |
| Temperature Grade | — | Industrial (I suffix) |
| Betriebstemperaturbereich | — | -40C to +85C (industrial grade standard range) |
| MSL-Level | — | [DATA_NEEDED: MSL Level] |
| Thermal Resistance (theta_JA) | — | [DATA_NEEDED: Thermal Resistance] |